LCB126
250V, 170mA Single-Pole
Normally Closed Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
250
170
15
Units
VP
mArms / mADC
Features
•
•
•
•
•
•
•
•
•
3750Vrms Input/Output Isolation
Low Drive Power Requirements
Greater Reliability than Electromechanical Relays
FCC Compatible
VDE Compatible
No EMI/RFI Generation
Small 6-Pin Package
Flammability Rating UL 94 V-0
Tape & Reel, Surface Mount Version Available
Description
LCB126 is a 250V, 170mA, 15, single-pole,
normally closed (1-Form-B) solid state relay
featuring enhanced peak load capability and
lower on-resistance. It uses optically coupled relay
technology to provide an enhanced 3750Vrms
isolation barrier between the input and the output of
the relay.
The efficient MOSFET switches use the patented
OptoMOS architecture. A highly efficient infrared LED
controls the optically coupled output.
Approvals
• UL Recognized Component: File # E76270
• TUV EN 62368-1: Certificate # B 082667 0008
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security
• Industrial Controls
Ordering Information
Part #
LCB126
LCB126S
LCB126STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1000/Reel)
Pin Configuration
AC/DC Configuration
+ Control
– Control
Do Not Use
1
6
2
5
3
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
– Control
Do Not Use
1
6
2
5
3
4
+ Load
– Load
Switching Characteristics
of Normally Closed Devices
Form-B
IF
ILOAD
10%
toff
DS-LCB126-R08
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90%
ton
1
INTEGRATED CIRCUITS DIVISION
LCB126
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature, Ambient
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate output power linearly 6.67 mW / ºC
Ratings
250
5
50
1
Units
VP
V
mA
A
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
150
800
3750
-40 to +85
-40 to +125
mW
mW
Vrms
°C
°C
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Blocking Voltage
Load Current
Continuous, AC/DC Configuration
Continuous, DC Configuration
Peak
On-Resistance 1
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
Conditions
Symbol
Min
Typ
Max
Units
IL=1A
VDRM
250
-
-
VP
IF=0mA
IL
-
-
170
mArms / mADC
t=10ms
ILPK
-
-
300
±400
mADC
mA
10
4
-
15
5
1
ILEAK
-
ton
-
-
5
IF=5mA, VL=50V, f=1MHz
toff
COUT
-
50
5
-
IL=170mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.4
0.9
-
0.7
1.36
-
5
1.5
10
mA
mA
V
A
VIO=0V, f=1MHz
CIO
-
3
-
pF
IF=0mA, IL=170mA
IF=0mA, IL=300mA
VL=250VP
IF=5mA, VL=10V
RON
A
ms
pF
1 Measurement taken within one second of on-time.
2
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R08
INTEGRATED CIRCUITS DIVISION
LCB126
PERFORMANCE DATA*
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
30
30
25
30
15
10
20
15
10
5
5
0
0
1.364
0.42
0.54 0.66 0.78 0.90
Turn-On Time (ms)
30
30
25
20
15
10
0
0.45
0.63
0.81 0.99 1.17
LED Current (mA)
1.35
25
20
15
10
5
5
0
Typical On-Resistance Distribution
(N=50, IL=170mADC)
35
Device Count (N)
Device Count (N)
Device Count (N)
5
10
0.625 0.875 1.125 1.375 1.625 1.875 2.125
Turn-Off Time (ms)
35
10
15
1.02
Typical IF for Switch Dropout
(N=50, IL=170mADC)
40
15
20
0
0.30
20
25
5
1.366
1.368
1.370
1.372
LED Forward Voltage Drop (V)
Typical IF for Switch Operation
(N=50, IL=170mADC)
25
Device Count (N)
20
Typical Turn-Off Time
(N=50, IF=5mA, IL=170mADC)
35
25
Device Count (N)
Device Count (N)
Typical Turn-On Time
(N=50, IF=5mA, IL=170mADC)
0
1.53
0.45
0.63
0.81 0.99 1.17
LED Current (mA)
1.35
1.53
10.4
10.8
11.2
11.6
12.0
On-Resistance (:)
12.4
Typical Blocking Voltage Distribution
(N=50)
35
Device Count (N)
30
25
20
15
10
5
0
291.25 293.75 296.25 298.75 301.25 303.75
Blocking Voltage (VP)
Typical Turn-On Time
vs. LED Forward Current
(IL=170mADC)
0.634
1.7
1.6
IF=10mA
IF=5mA
IF=2mA
1.5
1.4
1.3
1.2
0.632
0.630
0.628
0.626
0.624
1.1
-50
-25
0
25
50
Temperature (ºC)
75
100
1.0
0.8
0.6
0.4
0.2
0.622
1.0
Typical Turn-Off Time
vs. LED Forward Current
(IL=170mADC)
1.2
Turn-Off Time (ms)
1.8
Turn-On Time (ms)
LED Forward Voltage Drop (V)
Typical LED Forward Voltage Drop
vs. Temperature
0
0
5
10 15 20 25 30 35 40
LED Forward Current (mA)
45
50
0
5
10 15 20 25 30 35 40
LED Forward Current (mA)
45
50
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
R08
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3
INTEGRATED CIRCUITS DIVISION
LCB126
PERFORMANCE DATA*
Typical On-Resistance
vs. Temperature
(IF=5mA, IL=170mADC)
1.2
40
30
20
10
-20
0
20
40
60
Temperature (ºC)
80
0.6
0.4
100
-40
Typical IF for Switch Operation
vs. Temperature
(IL=170mADC)
3.0
-20
0
20
40
60
Temperature (ºC)
80
1.0
2.0
1.5
1.0
0.5
0.5
0
0
-20
0
20
40
60
Temperature (ºC)
80
-40
100
Maximum Load Current
vs. Temperature
(IF=5mA)
200
150
100
50
-20
0
20
40
60
80
Temperature (ºC)
100
120
-20
0
20
40
60
Temperature (ºC)
80
100
1.5
2.0
Typical Load Current
vs. Load Voltage
(IF=5mA)
100
50
0
-50
-100
-20
0
20
40
60
Temperature (ºC)
80
-200
-2.0 -1.5 -1.0 -0.5
0
0.5 1.0
Load Voltage (V)
100
Typical Leakage vs. Temperature
Measured across Pins 4&6
310
0.030
305
0.025
300
295
290
285
-40
0
-40
-40
Typical Blocking Voltage
vs. Temperature
Blocking Voltage (VP)
250
0.5
-150
Leakage (PA)
-40
1.0
150
Load Current (mA)
LED Current (mA)
1.5
1.5
200
2.5
2.0
IF=5mA
IF=10mA
IF=20mA
2.0
0
100
Typical IF for Switch Dropout
vs. Temperature
(IL=170mADC)
3.0
2.5
LED Current (mA)
0.8
0
-40
Load Current (mA)
1.0
0.2
0
Typical Turn-Off Time
vs. Temperature
(IL=170mADC)
2.5
Turn-Off Time (ms)
50
Turn-On Time (ms)
On-Resistance (:)
60
Typical Turn-On Time
vs. Temperature
(IF=5mA, IL=170mADC)
0.020
0.015
0.010
0.005
-20
0
20
40
60
Temperature (ºC)
80
100
10s
100s
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Energy Rating Curve
1.2
Load Current (A)
1.0
0.8
0.6
0.4
0.2
0
10Ps 100Ps 1ms 10ms 100ms
1s
Time
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
4
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R08
INTEGRATED CIRCUITS DIVISION
LCB126
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product
performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Classification
LCB126S
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell
time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater.
The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering
processes.
Device
Classification Temperature (Tc)
Dwell Time (tP)
Max Reflow Cycles
LCB126S
250ºC
30 seconds
3
For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is
provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder
wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the
last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below.
Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering
process.
Device
LCB126
Maximum Pin Temperature
260ºC
Maximum Body Temperature
250ºC
Maximum Dwell Time
10 seconds*
Wave Cycles
1
*Total cumulative duration of all waves.
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to
the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake
cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability
of the wash parameters used to clean the board, determination of the bake temperature and duration necessary
to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying
methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must
not be exposed to halide flux or solvents.
R08
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5
INTEGRATED CIRCUITS DIVISION
LCB126
LCB126
8.382±0.381
(0.330±0.015)
PCB Hole Pattern
7.239 TYP
(0.285 TYP)
2.54±0.127
(0.100±0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
9.144±0.508
(0.360±0.020)
6.350±0.127
(0.250±0.005)
1.524 TYP
(0.060 TYP)
Pin 1
1.651±0.254
(0.065±0.010)
2.540±0.127
(0.100±0.005)
7.620±0.127
(0.300±0.005)
7.620±0.254
(0.300±0.010)
0.254±0.0127
(0.010±0.0005)
5.080±0.127
(0.200±0.005)
Controlling dimension: inches
3.302±0.051
(0.130±0.002)
4.064 TYP
(0.160 TYP)
Dimensions
mm
(inches)
0.457±0.076
(0.018±0.003)
LCB126S
8.382±0.381
(0.330±0.015)
9.524±0.508
(0.375±0.020)
Pin 1
0.635±0.127
(0.025±0.005)
2.54±0.127
(0.100±0.005)
2.54
(0.10)
6.350±0.127
(0.250±0.005)
0.457±0.076
(0.018±0.003)
1.651±0.254
(0.065±0.010)
7.620±0.254
(0.300±0.010)
0.254±0.0127
(0.010±0.0005)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302±0.051
(0.130±0.002)
4.445±0.254
(0.175±0.010)
Controlling dimension: inches
1.524 TYP
(0.060 TYP)
1.651±0.254
(0.065±0.010)
6
PCB Land Pattern
Dimensions
mm
(inches)
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R08
INTEGRATED CIRCUITS DIVISION
LCB126
LCB126STR Tape & Reel
P1 = 12.00
(0.472)
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
K0 = 4.90
(0.19)
K1 = 3.80
(0.15)
A0 = 10.10
(0.398)
User Direction of Feed
Embossed
Carrier
Embossment
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: https://www.ixysic.com
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.
7
Specification: DS-LCB126-R08
©Copyright 2021, Littelfuse, Inc.
OptoMOS® is a registered trademark of IXYS Integrated Circuits
All rights reserved. Printed in USA.
11/3/2021
