LCB716STR

LCB716 60V, 500mA Single-Pole Normally Closed Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 60 500 2 Units VP mArms / mADC  Features • • • • • • • 3750Vrms Input/Output Isolation Low Drive Power Requirements Greater Reliability than Electromechanical Relays No EMI/RFI Generation Small 6-Pin Package Flammability Rating UL 94 V-0 Tape & Reel, Surface Mount Version Available Applications • • • • • • • • • • Description LCB716 is a single-pole, normally closed (1-Form-B) solid state relay that uses optically coupled relay technology to provide an enhanced 3750Vrms isolation barrier between the input and the output of the relay. The efficient MOSFET output switch uses IXYS Integrated Circuits' patented OptoMOS architecture. The optically coupled output is controlled by a highly efficient infrared LED. Approvals • UL Recognized Component: File E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Sensor Circuitry Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (gas, oil, electric and water) Medical Equipment-Patient/Equipment Isolation Security Industrial Controls Part # LCB716 LCB716S LCB716STR Description 6-Pin DIP (50/Tube) 6-Pin Surface Mount (50/Tube) 6-Pin Surface Mount (1000/Reel) Pin Configuration AC/DC Configuration + Control – Control Do Not Use 1 6 2 5 3 4 Load Do Not Use Load DC-Only Configuration + Control – Control Do Not Use 1 6 2 5 3 4 + Load – Load Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 10% toff DS-LCB716-R05 www.ixysic.com 90% ton 1 INTEGRATED CIRCUITS DIVISION LCB716 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Ratings 60 5 50 1 Units VP V mA A Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 100 800 3750 -40 to +85 -40 to +125 mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous, AC/DC Configuration Continuous, DC Configuration Peak On-Resistance 1 AC/DC Configuration DC Configuration Off-State Leakage Current Output Capacitance Switching Speeds Conditions Symbol Min Typ Max Units IL=1A VDRM 60 - - VP IF=0mA IL - - 500 mArms / mADC t < 10ms ILPK - - 1000 ±1.2 mADC AP 1.63 0.4 280 2 0.5 1 -  ILEAK COUT - ton - 0.58 3 toff - 0.76 3 IF=0mA, IL=500mA IF=0mA, IL=1000mA IF=2mA, VL=60V IF=2mA, VL=50V, f=1MHz RON A pF Turn-On Turn-Off Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics IF=5mA, VL=10V IL=500mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 1.36 - 2 1.5 10 mA mA V A Capacitance, Input to Output VIO=0V, f=1MHz CIO - 3 - pF ms 1 Measurement taken within one second of on-time. 2 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION LCB716 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 30 Typical Turn-On Time (N=50, IF=5mA, IL=100mA) 20 25 15 10 Device Count (N) Device Count (N) Device Count (N) 25 20 15 10 5 5 0.507 Typical IF for Switch Operation (N=50, IL=200mA) 25 20 15 10 5 0.16 0.17 0.18 0.19 0.20 LED Forward Current (mA) 10 5 1.53 1.57 1.61 1.65 On-Resistance (:) Typical Turn-On Time vs. LED Forward Current (IL=100mA) 1.3 1.2 421 420 419 418 1.1 -50 0.40 -25 0 25 50 Temperature (ºC) 75 0 100 Typical IF for Switch Operation vs. Temperature (IL=100mA) Turn-On Time (Ps) 0.25 0.20 0.15 0 20 40 60 Temperature (ºC) 80 100 80 Typical Turn-Off Time vs. LED Forward Current (IL=100mA) 1.5 1.0 0.5 0 Typical Turn-On Time vs. Temperature (IL=100mA) 50 Typical Turn-Off Time vs. Temperature (IL=100mA) 4.5 600 500 400 IF=2mA 300 100 -40 10 20 30 40 LED Forward Current (ma) 4.0 IF=5mA 200 -20 76 77 78 79 Blocking Voltage (VP) 2.0 50 700 0.30 0.10 -40 10 20 30 40 LED Forward Current (mA) 800 0.35 75 0 417 1.0 5 2.5 Turn-Off Time (ms) Turn-On Time (Ps) 1.4 0.83 10 1.69 422 1.5 0.71 0.75 0.79 Turn-Off Time (ms) 15 0 423 IF=10mA IF=5mA IF=2mA 0.67 Typical Blocking Voltage (N=50, IF=2mA) Turn-Off Time (ms) LED Forward Voltage Drop (V) 0.63 15 Typical LED Forward Voltage Drop vs. Temperature 1.6 5 20 1.49 1.7 10 Typical On-Resistance (N=50, IF=0mA, IL=5mA) 0.21 1.8 15 0.622 0 0 LED Current (mA) 0.530 0.553 0.576 0.599 Turn-On Time (ms) 20 Device Count (N) Device Count (N) 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Device Count (N) 1.364 20 0 0 0 Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) 3.5 IF=2mA 3.0 2.5 2.0 1.5 IF=5mA 1.0 -20 0 20 40 60 Temperature (ºC) 80 100 0.5 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LCB716 PERFORMANCE DATA* Typical On-Resistance vs. Temperature (IF=0mA, IL=100mA) 1.4 1.3 0.6 0.6 0.5 0.4 0.4 0.3 0.2 1.2 0.1 1.1 -40 0.0 -20 0 20 40 60 Temperature (ºC) 80 Typical Blocking Voltage vs. Temperature (IF=5mA) 350 90 88 86 84 82 -20 0 20 40 60 Temperature (ºC) 80 100 Typical Load Voltage vs. Load Current (IF=0mA) 0.2 0.0 -0.2 -0.4 -40 100 92 80 -40 Load Current (A) 1.5 94 Blocking Voltage (VP) Load Current (A) 1.6 Leakage Current (nA) On-Resistance (:) 1.7 -20 0 20 40 60 Temperature (ºC) 80 -0.6 -1.0 -0.75 -0.5 -0.25 0.0 0.25 0.5 Load Voltage (V) 100 Typical Leakage vs.Temperature Measured Across Pins 4&6 (IF=5mA, VL=60V) 1.0 Energy Rating Curve 300 1.3 250 200 150 100 1.1 0.9 0.7 0.5 50 0 -40 0.75 1.5 Load Current (A) 1.8 Maximum Load Current vs. Temperature (IF=0mA) -20 0 20 40 60 Temperature (ºC) 80 100 0.3 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION LCB716 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LCB716S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles LCB716S 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device LCB716 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R05 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LCB716 Mechanical Dimensions LCB716 8.382±0.381 (0.330±0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54±0.127 (0.100±0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144±0.508 (0.360±0.020) 6.350±0.127 (0.250±0.005) 1.524 TYP (0.060 TYP) Pin 1 1.651±0.254 (0.065±0.010) 2.540±0.127 (0.100±0.005) 7.620±0.127 (0.300±0.005) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 5.080±0.127 (0.200±0.005) Controlling dimension: inches 3.302±0.051 (0.130±0.002) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457±0.076 (0.018±0.003) LCB716S 8.382±0.381 (0.330±0.015) 9.524±0.508 (0.375±0.020) Pin 1 0.635±0.127 (0.025±0.005) 2.54 (0.10) 6.350±0.127 (0.250±0.005) 0.457±0.076 (0.018±0.003) 1.651±0.254 (0.065±0.010) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302±0.051 (0.130±0.002) 4.445±0.254 (0.175±0.010) Controlling dimension: inches 1.524 TYP (0.060 TYP) 1.651±0.254 (0.065±0.010) 6 PCB Land Pattern 2.54±0.127 (0.100±0.005) Dimensions mm (inches) www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION LCB716 LCB716STR Tape & Reel P1 = 12.00 (0.472) 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) A0 = 10.10 (0.398) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-LCB716-R05 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 11/3/2021