LCB717

LCB717 30V, 1.5A Single-Pole Normally Closed Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Current to Operate Rating 30 1.5 0.3 2 Units VP Arms / ADC  mA Features • • • • • • • • • • 1.5A Load Current 0.3 Max On-Resistance 2mA Control Current 3750Vrms Input/Output Isolation Low Drive Power Requirements Greater Reliability than Electromechanical Relays No EMI/RFI Generation Flammability Rating UL 94 V-0 Small 6-Pin Package Tape & Reel, Surface Mount Version Available Applications • • • • • • • • • Sensor Circuitry Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Medical Equipment-Patient/Equipment Isolation Security Industrial Controls Description LCB717 is a single-pole normally closed (1-Form-B) solid state relay that uses optically coupled technology to provide an enhanced 3750Vrms isolation barrier between the input and the output of the relay. The efficient MOSFET switches use IXYS Integrated Circuits' patented OptoMOS architecture. The optically coupled output is controlled by a highly efficient infrared LED. Approvals • UL Recognized Component: File E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # LCB717 LCB717S LCB717STR Description 6-Lead DIP (50/Tube) 6-Lead Surface Mount (50/Tube) 6-Lead Surface Mount (1000/Reel) Pin Configuration AC/DC Configuration + Control – Control Do Not Use 1 6 2 5 3 4 Load Do Not Use Load DC Only Configuration + Control – Control Do Not Use 1 6 2 5 3 4 + Load – Load Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 10% toff DS-LCB717-R03 www.ixysic.com 90% ton 1 INTEGRATED CIRCUITS DIVISION LCB717 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output ESD Rating, Human Body Model Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Ratings 30 5 50 1 Units VP V mA A Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 100 800 3750 8 -40 to +85 -40 to +125 mW mW Vrms kV °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous, AC/DC Configuration Continuous, DC Configuration Peak On-Resistance 1 AC/DC Configuration DC Configuration Switching Speeds Turn-On Turn-Off Off-State Leakage Current Output Capacitance Input Characteristics Input Control Current to Activate 2 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output Conditions Symbol Min Typ Max Units IL=1A VDRM 30 - - VP IF=0mA IL IF=0mA , t < 10ms ILPK - - 1.5 3 5 Arms / ADC ADC A IF=0mA, IL=1.5A IF=0mA, IL=3A RON - - 0.3 0.08  ton - - 2 toff COUT - 160 459 5 1 - IL=1A IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 1.36 - 2 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V IF=2mA, VL=30V IF=2mA, VL=25V, f=1MHz IF=2mA, VL=1V, f=1MHz ILEAK 1 Measurement taken within 1 second of on-time. 2 For high temperature operation (>60ºC) a minimum LED drive current of 4mA is recommended. 2 www.ixysic.com ms A pF R03 INTEGRATED CIRCUITS DIVISION LCB717 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) 20 15 10 5 15 10 5 1.364 0.45 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical LED Current to Operate (N=50, IL=100mA) 25 Device Count (N) 15 10 5 20 15 10 5 2.3 2.6 2.9 3.2 3.5 Turn-Off Time (ms) 3.8 4.1 Typical On-Resistance Distribution (N=50, IF=0mA, IL=1A) 25 20 15 10 5 0 0 34 0.275 0.300 0.325 0.350 0.375 0.400 0.425 LED Forward Current (mA) 35 36 37 38 39 Blocking Voltage (VP) 0.1700 0.1725 0.1750 0.1775 0.1800 0.1825 0.1850 40 On-Resistance (:) Typical Turn-On Time vs. LED Forward Current (IL=100mA) Typical LED Forward Voltage Drop vs. Temperature 550 Typical Turn-Off Time vs. LED Forward Current (IL=100mA) 10 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 540 Turn-Off Time (ms) Turn-On Time (Ps) 1.7 530 520 510 8 6 4 2 1.1 500 1.0 -50 0.50 -25 0 25 50 Temperature (ºC) 75 0 0 100 Typical LED Current to Operate vs. Temperature (IL=750mA) 10 20 30 LED Current (mA) 40 50 0 Typical Turn-On Time vs. Temperature (VL=10V, IL=100mA) 600 0.40 0.35 0.30 0.25 0.20 -40 IF=2mA 500 450 400 0 20 40 60 Temperature (ºC) 80 100 Typical Turn-Off Time vs. Temperature (IL=100mA) IF=2mA 10 8 6 IF=5mA 4 IF=10mA 2 0 350 -20 50 12 550 Turn-Off Time (ms) Turn-On Time (Ps) 0.45 10 20 30 40 LED Forward Current (mA) 14 IF=5mA LED Current (mA) 10 2.0 5 1.8 15 0.70 25 20 0 LED Forward Voltage Drop (V) 0.50 0.55 0.60 0.65 Turn-On Time (ms) Typical Blocking Voltage Distribution (N=50, IF=2mA) 30 20 0 0 0 Device Count (N) 20 Device Count (N) Device Count (N) 25 Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) 25 Device Count (N) 30 Typical Turn-On Time (N=50, IF=5mA, IL=100mA) -40 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R03 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LCB717 PERFORMANCE DATA* 2.0 1.6 0.19 0.18 0.17 1.0 Load Current (A) Load Current (A) 0.5 0.0 -0.5 -1.0 1.4 1.2 1.0 0.8 -1.5 -2.0 -0.3 0.15 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Typical On-Resistance vs. Temperature DC-Only Configuration (IF=0mA, IL=1.5A) 3.5 0.060 3.0 Load Current (A) 0.065 0.055 0.050 0.045 0.040 0.2 0.3 -20 0 20 40 60 Temperature (ºC) 80 2.0 1.5 1.0 Leakage Current (nA) 41 40 39 38 37 0 20 40 60 Temperature (ºC) 80 0.04 0.06 0.08 0.10 Load Voltage (V) 0.12 80 100 3.5 3.0 2.5 2.0 -40 0.14 800 35 30 25 20 15 10 5 100 20 40 60 Temperature (ºC) 1.0 0.02 -20 0 20 40 60 Temperature (ºC) 80 100 Output Capacitance vs. Load Voltage (IF=2mA, f=1MHz) 700 600 500 400 300 200 100 0 -20 0 Maximum Load Current vs. Temperature DC-Only Configuration (IF=0mA) Leakage Current vs. Temperature Measured Across Pins 4 & 6 (IF=4mA, VL=30V) 40 42 -20 1.5 0.0 0.00 100 43 -40 -40 Typical Load Current vs. Load Voltage DC-Only Configuration (IF=0mA) 2.5 Typical Blocking Voltage vs. Temperature (IF=4mA) 44 -0.1 0.0 0.1 Load Voltage (V) 0.5 0.035 0.030 -40 0.6 -0.2 Load Current (A) On-Resistance (:) 0.20 0.16 On-Resistance (:) Maximum Load Current vs. Temperature AC/DC Configuration (IF=0mA) 1.5 0.21 Blocking Voltage (VP) Typical Load Current vs. Load Voltage AC/DC Configuration (IF=0mA) Output Capacitance (pF) 0.22 Typical On-Resistance vs. Temperature AC/DC Configuration (IF=0mA, IL=750mA) -40 -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s 0 5 10 15 Load Voltage (V) 20 25 Energy Rating Curve Load Current (A) 6 5 4 3 2 1 10Ps 100Ps 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION LCB717 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LCB717S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles LCB717S 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device LCB717 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R03 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LCB717 Mechanical Dimensions LCB717 8.382±0.381 (0.330±0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54±0.127 (0.100±0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144±0.508 (0.360±0.020) 6.350±0.127 (0.250±0.005) 1.524 TYP (0.060 TYP) Pin 1 1.651±0.254 (0.065±0.010) 2.540±0.127 (0.100±0.005) 7.620±0.127 (0.300±0.005) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 5.080±0.127 (0.200±0.005) Controlling dimension: inches 3.302±0.051 (0.130±0.002) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457±0.076 (0.018±0.003) LCB717S 8.382±0.381 (0.330±0.015) 9.524±0.508 (0.375±0.020) Pin 1 0.635±0.127 (0.025±0.005) 2.54 (0.10) 6.350±0.127 (0.250±0.005) 0.457±0.076 (0.018±0.003) 1.651±0.254 (0.065±0.010) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302±0.051 (0.130±0.002) 4.445±0.254 (0.175±0.010) Controlling dimension: inches 1.524 TYP (0.060 TYP) 1.651±0.254 (0.065±0.010) 6 PCB Land Pattern 2.54±0.127 (0.100±0.005) Dimensions mm (inches) www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION LCB717 LCB717S Tape & Reel P1 = 12.00 (0.472) 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) A0 = 10.10 (0.398) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-LCB717-R03 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 11/3/2021