LDA212

LDA212 Dual Optocouplers, Bidirectional Input Darlington-Transistor Output INTEGRATED CIRCUITS DIVISION Parameter Breakdown Voltage - BVCEO Current Transfer Ratio CTR (Typical) Saturation Voltage - VCE (sat) Input Control Current - IF Rating 30 8500 Units VP % 1 1 V mA Description LDA212 is a dual bidirectional-input optocoupler with Darlington-transistor outputs. The LDA212 has a minimum current transfer ratio (CTR) of 300% with a typical value of 8500%. Approvals Features • • • • • • 100mA Continuous Load Rating 3750Vrms Input/Output Isolation Bidirectional Input Small 8-Pin Package, Thru-Hole or Surface Mount Machine Insertable, Wave Solderable Surface Mount Tape & Reel Packaging Available Applications • • • • • • Telecom Switching Tip/Ring Circuits Modem Switching (Laptop, Notebook, Pocket Size) Loop Detect Ringing Detect Current Sensing • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1175739 • EN/IEC 60950-1 Certified Component: TUV Certificate B 09 07 49410 006 Ordering Information Part Number LDA212 LDA212S LDA212STR Description 8-Pin DIP (50/tube) 8-Pin Surface Mount (50/tube) 8-Pin Surface Mount (1000/Reel) Pin Configuration 1 8 C A/K 2 7 E K/A 3 6 C A/K 4 K/A Pb DS-LDA212-R05 5 E e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION LDA212 Absolute Maximum Ratings @ 25ºC Parameter Breakdown Voltage Input Control Current Peak (10ms) Power Dissipation Input Power Dissipation 1 Phototransistor 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33mW / ºC 2 Derate linearly 2mW / ºC Ratings 30 100 1 Units VP mA A 150 150 3750 -40 to +85 -40 to +125 mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Electrical Characteristics @ 25ºC Parameter Output Characteristics Phototransistor Breakdown Voltage Phototransistor Dark Current Saturation Voltage Current Transfer Ratio Output Capacitance Input Characteristics Input Control Current Input Voltage Drop Common Characteristics Capacitance, Input to Output Conditions Symbol Min Typ Max Units IC = 100µA VCEO = 5V, IF = 0mA IC = 3mA, IF = 1mA IF = 1mA, VCE = 2V 50V, f =1MHz BVCEO ICEO VCE(sat) CTR COUT 30 300 - 50 50 8500 3 500 1 30000 - V nA V % pF IC = 3mA, VCE = 2V IF = 5mA IF VF 0.9 0.07 1.2 1 1.4 mA V - CI/O - 3 - pF Switching Characteristics @ 25ºC Characteristic Turn-On Time Turn-Off Time Symbol ton toff Test Condition VCC=5V, IF=1mA, RL=500 Switching Time Test Circuit Typ 8 345 Units s VCC RL Pulse Width=5ms Duty Cycle=1% IF VCE IF VCE 90% 10% t on 2 www.ixysic.com t off R05 INTEGRATED CIRCUITS DIVISION LDA212 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* LED Voltage vs. Current LED Voltage vs. Current (Log) 30 20 10 10 1 1.1 1.2 1.3 1.4 1.5 LED Forward Voltage (V) 1.6 1.0 25ºC 10000 85ºC 5000 0 2 4 6 8 LED Forward Current (mA) 10 0.20 0.15 0.10 IF=2mA IF=1mA IF=0.5mA 0.05 0 1 2 3 4 Collector Voltage VCE (V) IF=5mA IF=2mA IF=1mA -20 0 20 40 60 Temperature (ºC) 5 100 ICE Current vs. Temperature (VCE=5V) IF=10mA IF=5mA IF=2mA IF=1mA 150 100 50 6 80 IF=0.2mA IF=0.1mA 0 -40 -20 IF=0.5mA 0 20 40 60 Temperature (ºC) 80 100 Leakage Current vs. Temperature 1200 Leakage (nA) VCE(sat) (V) 1.1 1400 0.90 0.85 0.80 0.75 1000 VCC=10V VCC=5V VCC=3V 800 600 400 200 0.70 -40 -20 0 20 40 60 Temperature (ºC) 80 0 -40 100 0 20 40 60 Temperature (ºC) 80 100 15000 Turn-Off Time (Ps) 8.0 7.9 7.8 7.7 7.6 7.5 7.4 7.3 7.2 7.1 7.0 6.9 6.8 1x102 -20 Turn-Off Time vs. Load Resistance (IF=1mA, VCC=5V) Turn-On Time vs. Load Resistance (IF=1mA, VCC=5V) Turn-On Time (Ps) 1.2 200 VCE(sat) vs. Temperature (IF=1mA, IC=3mA) 0.95 1.3 250 IF=20mA IF=10mA IF=5mA 0.00 0 1.6 0.25 Collector Current IC (mA) 15000 1.2 1.3 1.4 1.5 LED Forward Voltage (V) 1.4 Typical Collector Current vs. Collector Voltage Typical CTR vs. LED Forward Current (VCE=5V) -40ºC 1.1 ICE Current (mA) 1.0 IF=50mA IF=20mA IF=10mA 1.5 1.0 -40 0.1 0 CTR (%) LED Forward Voltage (V) LED Forward Current (mA) LED Forward Current (mA) 40 20000 LED Forward Voltage vs. Temperature 1.6 100 50 1x103 1x104 Load Resistance (:) 1x105 10000 5000 0 1x102 1x103 1x104 Load Resistance (:) 1x105 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LDA212 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating LDA212 / LDA212S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time LDA212 / LDA212S 250ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb 4 e3 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION LDA212 Mechanical Dimensions LDA212 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) 0.457 ± 0.076 (0.018 ± 0.003) 3.302 ± 0.051 (0.130 ± 0.002) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 0.254 ± 0.0127 (0.010 ± 0.0005) 7.620 ± 0.127 (0.300 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LDA212S 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) R05 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LDA212 LDA212STR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) K0 =4.90 (0.193) K1 =4.20 (0.165) Embossed Carrier Embossment W=16.00 (0.63) Bo=10.30 (0.406) Ao=10.30 (0.406) P=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-LDA212-R05 ©Copyright 2012, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012