LOC111S

LOC111 Linear Optocoupler INTEGRATED CIRCUITS DIVISION Parameter LED Operating Range K3, Transfer Gain Isolation, Input to Output Rating 2-10 0.733-1.072 3750 Description Units mA - Vrms Features • • • • • • • • • 0.01% Servo Linearity THD -87dB Typical Wide Bandwidth (>200kHz) Couples Analog and Digital Signals High Gain Stability Low Input/Output Capacitance Low Power Consumption 8-Pin Flatpack or DIP Package Surface Mount and Tape & Reel Versions Available Applications • Modem Transformer Replacement With No Insertion Loss • Digital Telephone Isolation • Power Supply Feedback Voltage/Current • Medical Sensor Isolation • Audio Signal Interfacing • Isolation of Process Control Transducers The LOC111 Single Linear Optocoupler features an infrared LED optically coupled with two photodiodes. One feedback (input) photodiode is used to generate a control signal that provides a servomechanism to the LED drive current, thus compensating for the LED's nonlinear time and temperature characteristics. The other (output) photodiode provides an output signal that is linear with respect to the servo LED current. The product features wide bandwidth, high input to output isolation, and excellent servo linearity. Approvals • UL Recognized Component: File # E76270 • CSA Certified Component: Certificate # 1175739 • EN/IEC 60950-1 Certified Component: TUV Certificate # B 13 12 82667 003 Ordering Information Part Number LOC111 LOC111P LOC111PTR LOC111S LOC111STR Description 8-Pin DIP (50/Tube) 8-Pin Flatpack (50/Tube) 8-Pin Flatpack (1000/Reel) 8-Pin Surface Mount (50/tube) 8-Pin Surface Mount (1000/Reel) Each tube or reel will contain only devices of one K3-sorted value. Devices will be individually marked with the letter of their K3 bin. K3 Sorted Bins Bin D = 0.733 - 0.805 Bin E = 0.806 - 0.886 Bin F = 0.887 - 0.974 Bin G = 0.975 - 1.072 Devices of any available bin will be shipped. Pin Configuration - LED + LED C1 A1 DS-LOC111-R09 www.ixysic.com 1 8 2 7 3 6 4 5 N/C N/C C2 A2 1 INTEGRATED CIRCUITS DIVISION LOC111 Absolute Maximum Ratings @ 25ºC Parameter Reverse LED Voltage Input Control Current Peak (10ms) Input Power Dissipation1 Total Package Dissipation2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / °C 2 Derate linearly 6.67 mW / °C Ratings 5 100 1 150 500 3750 -40 to +85 -40 to +125 Units V mA A mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Input Characteristics LED Voltage Drop Reverse LED Current Coupler/Detector Characteristics Dark Current K1, Servo Gain (IC1/IF) K2, Forward Gain (IC2/IF) K3, Transfer Gain (K2/K1=IC2/IC1) K3, Transfer Gain Linearity (non-servoed) K3 Temperature Coefficient Common-Mode Rejection Ratio Total Harmonic Distortion Frequency Response 1 Input/Output Capacitance 1 2 Conditions Symbol Min Typ Max Units IF = 2 - 10mA VR = 5V VF IR 0.9 - 1.2 - 1.4 10 V A IF=0mA, VC1-A1=VC2-A2=15V ID K1 K2 K3 K3 K3/T CMRR THD 0.008 0.006 0.733 -96 25 0.030 0.030 1.072 1 -80 nA % % / ºC dB dB f-3dB - - kHz CIO - 1 1 0.005 130 -87 200 40 3 - pF IF=2 - 10mA, VC1-A1=VC2-A2=15V IF=2 - 10mA IF=2 - 10mA, VC1-A1=VC2-A2= 5V V=20VP-P , RL=2k, f=100Hz f0=350Hz, 0dBm Photoconductive Configuration Photovoltaic Configuration VIO=0V, f=1MHz Refer to Application Note, AN-107, for LOC111 Configurations. www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION LOC111 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* LED Forward Current vs. LED Forward Voltage LED Current (mA) 50 40 30 20 LED Forward Voltage Drop (V) 100 60 LED Current (mA) Typical LED Forward Voltage Drop vs. Temperature LED Forward Current vs. LED Forward Voltage 10 1 0.1 10 1.0 1.1 1.2 1.3 1.4 0.01 1.5 1.1 1.2 1.3 1.4 1.5 LED Forward Voltage (V) LED Forward Voltage (V) Servo Gain vs. LED Current & Temperature Servo-Photocurrent vs. LED Current & Temperature Servo-Photocurrent (PA) 0ºC 25ºC 50ºC 70ºC 85ºC 0.012 0.008 0.004 0ºC 25ºC 50ºC 70ºC 85ºC 120 100 80 60 40 20 0 0.000 0 2 4 6 8 LED Current (mA) 10 12 0 2 4 6 8 LED Current (mA) 10 IF=50mA IF=20mA IF=10mA 1.5 1.4 1.3 1.2 IF=5mA IF=2mA IF=1mA 1.1 1.0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Normalized Servo-Photocurrent vs. LED Current & Temperature 140 0.016 Servo Gain 1.0 Normalized Servo-Photocurrent 0 1.6 12 4.0 0ºC 25ºC 50ºC 70ºC 85ºC 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 2 4 6 8 LED Current (mA) 10 12 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R09 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LOC111 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LOC111 / LOC111S LOC111P MSL 1 MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (TC) Dwell Time (tp) Max Reflow Cycles LOC111 LOC111S LOC111P 250ºC 250ºC 240ºC 30 seconds N/A 3 3 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. 4 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION LOC111 Mechanical Dimensions LOC111 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LOC111P 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 7.620 ± 0.254 (0.300 ± 0.010) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 ± 0.127 (0.025 ± 0.005) 8.70 (0.3425) 1.55 (0.0610) 0.203 ± 0.013 (0.008 ± 0.0005) 9.652 ± 0.381 (0.380 ± 0.015) PCB Land Pattern 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) Dimensions mm (inches) LOC111S 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) R09 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LOC111 LOC111PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) Embossment W = 16.00 (0.63) 7.50 (0.295) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 LOC111STR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) K0 =4.90 (0.193) K1 =4.20 (0.165) Embossed Carrier Embossment W=16.00 (0.63) Bo=10.30 (0.406) Ao=10.30 (0.406) P=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-LOC111-R09 ©Copyright 2016, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 2/1/2016