PBB190STR

PBB190 400V, 130mA Dual Single-Pole Normally Closed Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 400 130 25 Units VP mArms / mADC  Features • • • • • • • 5000Vrms Input/Output Isolation Low Drive Power Requirements Greater Reliability than Electromechanical Relays No EMI/RFI Generation Small 8-Pin Package Flammability Rating UL 94 V-0 Surface Mount, Tape & Reel Version Available Description PBB190 is a dual single-pole, normally closed (1-Form-B) solid state relay with two independently controlled switches that use optically coupled MOSFET technology to provide 5000Vrms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Dual single-pole OptoMOS relays provide a more compact design solution than discrete single-pole relays in a variety of applications by incorporating both relays in a single 8-pin package. Approvals Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Industrial Controls • UL Recognized Component: File E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # PBB190 PBB190S PBB190STR Description 8-Lead DIP (50/Tube) 8-Lead Surface Mount (50/Tube) 8-Lead Surface Mount (1,000/Reel) Pin Configuration + Control - Switch #1 - Control - Switch #1 + Control - Switch #2 - Control - Switch #2 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 10% toff DS-PBB190-R04 www.ixysic.com 90% ton 1 INTEGRATED CIRCUITS DIVISION PBB190 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage LED Forward Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output (60 Seconds) ESD Rating, Human Body Model Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Ratings 400 5 50 1 150 800 Units VP V mA A mW mW 5000 Vrms 8 -40 to +85 -40 to +125 kV °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current 1 Continuous Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics LED Forward Current To Activate 3 To Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 400 - - VP RON ILEAK - - 130 ±400 25 1 mArms / mADC mAP  ton toff COUT - 11 1 2.5 - 0.38 0.35 1.36 - 2 1.5 10 3 - IF=0mA IF=0mA, t=10ms IF=0mA, IL=130mA IF=2mA, VL=400VP IF=5 mA, VL=10V IF=5mA, VL=50V, f=1MHz IL IL=130mA IF=5mA VR=5V VF IR 0.2 0.9 - VIO=0V, f=1MHz CIO - IF 1 If both poles operate simultaneously, then the load current must be derated so that the package power dissipation value is not exceeded. 2 Measurement taken within 1 second of on-time. 3 For high temperature operation (>60ºC), a minimum LED drive current of 4mA is recommended. www.ixysic.com A ms pF mA V µA pF R04 INTEGRATED CIRCUITS DIVISION PBB190 PERFORMANCE DATA* 30 Typical LED Forward Voltage Drop (N=50, IF=5mA) Typical Turn-On Time (N=50, IF=5mA, IL=100mA) 20 Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) 20 20 15 10 Device Count (N) Device Count (N) Device Count (N) 25 15 10 5 15 10 5 5 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical LED Forward Current to Activate (N=50, IL=100mA) 0.838 0.920 1.002 1.084 1.166 1.248 1.330 1.412 Turn-On Time (ms) Turn-Off Time (ms) Typical On-Resistance Distribution (N=50, IF=0mA, IL=100mA) Typical Blocking Voltage Distribution (N=50, IF=2mA) 25 Device Count (N) 20 0.714 0.716 0.718 0.720 0.722 0.724 0.726 0.728 15 10 5 20 15 10 5 13.0 0.29 0.32 0.35 0.38 0.41 0.44 0.47 0.50 LED Forward Current (mA) 13.3 13.5 13.8 14.0 14.3 On-Resistance (:) 735 1.5 1.4 1.3 1.2 725 720 715 -25 0 25 50 Temperature (ºC) 900 75 100 10 20 30 40 LED Forward Current (mA) Turn-On Time vs. Temperature (IL=75mA) 5000 4000 3000 2000 50 0 10 20 30 40 LED Forward Current (mA) 50 Turn-Off Time vs. Temperature (IL=75mA) 4500 700 600 500 IF=5mA 400 0 20 40 60 Temperature (ºC) 80 4000 IF=2mA 3500 3000 2500 2000 IF=5mA 1500 IF=2mA -20 Turn-Off Time (Ps) Turn-On Time (Ps) Typical Turn-Off Time vs. LED Forward Current (IL=100mA) 0 0 800 300 -40 495 1000 710 -50 470 475 480 485 490 Blocking Voltage (VP) 5000 730 1.1 1.0 5 6000 Turn-Off Time (Ps) Turn-On Time (Ps) IF=10mA IF=5mA IF=2mA 10 460 465 1.7 1.6 15 14.5 Typical Turn-On Time vs. LED Forward Current (IL=100mA) Typical LED Forward Voltage Drop vs. Temperature 1.8 20 0 0 0 LED Forward Voltage Drop (V) 25 Device Count (N) 1.364 Device Count (N) 0 0 0 100 1000 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R04 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PBB190 PERFORMANCE DATA* 0.45 0.40 16 15 14 0 20 40 60 Temperature (ºC) 80 12 -40 100 Blocking Voltage (VP) 0.12 0.11 0.10 0.09 0.08 -20 0 20 40 60 Temperature (ºC) -20 100 0 20 40 60 Temperature (ºC) 100 -0.15 -2.0 -1.5 -1.0 350 300 470 250 465 460 455 450 440 -40 -0.5 0.0 0.5 1.0 Load Voltage (V) 1.5 2.0 Typical Leakage vs. Temperature Measured Across Pins 5&6, 7&8 (IF=5mA, VL=400V) 200 150 100 50 445 -20 0 20 40 60 Temperature (ºC) 100 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve Load Current (A) 80 60 40 20 0 100 150 Load Voltage (V) 80 1.0 100 50 80 475 120 0 -0.05 Typical Blocking Voltage vs. Temperature (IF=5mA) Output Capacitance vs. Load Voltage (IF=5mA, f=1MHz) 140 Output Capacitance (pF) 80 0.00 -0.10 480 0.13 0.05 Leakage (nA) -20 0.14 Load Current (A) 17 13 Maximum Load Current vs. Temperature (IF=0mA) -40 0.10 18 Load Current (A) 0.50 Typical Load Current vs. Load Voltage (IF=0mA) 0.15 19 0.55 0.35 -40 On-Resistance vs. Temperature (IF=0mA, IL=75mA) 20 0.60 On Resistance (:) LED Forward Current (mA) 0.65 LED Forward Current to Activate vs. Temperature (IL=75mA) 200 0.8 0.6 0.4 0.2 0.0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION PBB190 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification PBB190S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles PBB190S 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device PBB190 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R04 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION PBB190 Mechanical Dimensions PBB190 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 3.302 ± 0.051 (0.130 ± 0.002) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 0.254 ± 0.0127 (0.010 ± 0.0005) 7.620 ± 0.127 (0.300 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) PBB190S PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) 6 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION PBB190 PBB190STR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) K1 =4.20 (0.165) Embossed Carrier Embossment 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-PBB190-R04 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 11/4/2021