PLA110LS

PLA110L 400V, 150mA Single-Pole, Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 400 150 25 Units VP mArms / mADC  Features • Current Limiting • 3750Vrms Input/Output Isolation • Low Drive Power Requirements • Greater Reliability than Electromechanical Relays • No EMI/RFI Generation • Small 6-Pin Package • Flammability Rating UL 94 V-0 • Surface Mount and Tape & Reel Version Available Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Industrial Controls Description PLA110L is a current-limited, normally open (1-Form-A) solid state relay that uses optically coupled MOSFET technology to provide 3750Vrms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. The PLA110L can be used to replace mechanical relays. It offers the superior reliability associated with semiconductor devices, it has no moving parts, and it offers faster, bounce-free switching in a more compact surface mount or thru-hole package. Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate # 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # PLA110L PLA110LS PLA110LSTR Description 6-Pin Dip (50/Tube) 6-Pin Surface Mount (50/Tube) 6-Pin Surface Mount (1000/Reel) Pin Configuration AC/DC Configuration + Control – Control NC 1 6 2 5 3 4 Load Do Not Use Load DC Only Configuration + Control – Control NC 1 6 2 5 3 4 + Load – Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-PLA110L-R08 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION PLA110L Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage Input to Output Operational Temperature, Ambient Storage Temperature Symbol VDRM VR 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC IF PIN PT VISO TA TSTG Ratings 400 5 50 1 150 800 3750 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous, AC/DC Configuration Continuous, DC Configuration Current Limiting On-Resistance 1 AC/DC Configuration DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 Conditions Symbol Min Typ Max Units IL=1A, VDRM 400 - - V - IL - ICL 190 235 150 250 280 mArms / mADC mADC mA - 25 9 1  ILEAK - µA IF=0mA, VL=50V, f=1MHz ton toff COUT - 25 1 0.5 - ms ms pF IL=150mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 0.7 1.36 - 5 1.5 10 mA mA V µA VIO=0V, f=1MHz CIO - 3 - pF IL=150mA IL=250mA VL=400VP IF=5mA, VL=10V RON Measurement taken within one second of on-time. www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION PLA110L PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) 20 15 10 5 1.364 15 10 5 0.15 0.21 0.27 0.33 0.39 Turn-On Time (ms) Device Count (N) 10 5 5 0.05 0.07 0.09 0.11 0.13 Turn-Off Time (ms) 0.15 Typical On-Resistance Distribution (N=50, IF=5mA, IL=150mADC) 35 30 20 15 10 5 25 20 15 10 5 0 0 1.35 1.65 1.95 LED Current (mA) 10 0.45 25 15 1.05 15 Typical IF for Switch Dropout (N=50) 20 0.75 20 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=150mADC) 25 Device Count (N) 20 0 0 Typical Turn-Off Time (N=50, IF=5mA, IL=150mADC) 25 Device Count (N) Device Count (N) 25 Device Count (N) 30 Typical Turn-On Time (N=50, IF=5mA, IL=150mADC) 0 0.75 2.25 1.05 1.35 1.65 1.95 LED Current (mA) 2.25 13.1 13.7 14.3 14.9 15.5 On-Resistance (:) 16.1 Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 441.5 450.5 459.5 468.5 477.5 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=150mADC) 0.35 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 0.10 0.30 0.25 0.20 0.15 0.10 0.05 1.1 -50 -25 0 25 50 Temperature (ºC) 75 100 0.08 0.06 0.04 0.02 0 0 1.0 Typical Turn-Off Time vs. LED Forward Current (IL=150mADC) 0.12 Turn-Off Time (ms) 0.40 1.7 Turn-On Time (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 1.8 486.5 0 5 10 15 20 25 30 35 40 Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 Forward Current (mA) 45 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R08 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PLA110L PERFORMANCE DATA* Typical Turn-On Time vs. Temperature (IL=150mADC) 3.0 0.14 1.5 1.0 IF=5mA IF=10mA IF=20mA 0.5 0 20 40 60 80 Temperature (ºC) 100 0.10 0.08 0.06 0.04 0.02 -40 Typical IF for Switch Operation vs. Temperature (IL=150mADC) 3.0 2.0 1.5 1.0 20 40 60 Temperature (ºC) 80 0.5 0 0 20 40 60 Temperature (ºC) 80 100 10 5 -40 -40 Typical IF for Switch Dropout vs. Temperature (IL=150mADC) 150 1.0 0 -20 15 100 1.5 Maximum Load Current vs. Temperature -20 0 20 40 60 Temperature (ºC) 80 Typical Leakage vs. Temperature Measured Across Pins 4&6 -20 0 20 40 60 80 Temperature (ºC) 100 120 Leakage (PA) 0.030 0 -40 470 465 460 455 450 -40 Typical Load Current vs. Load Voltage (IF=5mA) -150 -2.5 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 2.5 Load Voltage (V) 100 0.035 50 100 -50 475 IF=20mA IF=10mA IF=5mA 80 0 480 100 20 40 60 Temperature (ºC) 50 250 150 0 100 300 200 -20 -100 Typical Blocking Voltage vs. Temperature Blocking Voltage (VP) Load Current (mA) 0 2.0 0.5 -40 -20 2.5 LED Current (mA) LED Current (mA) 2.5 20 0 0 120 Load Current (mA) 3.0 -20 On-Resistance (:) Turn-Off Time (ms) Turn-On Time (ms) 2.0 Typical On-Resistance vs. Temperature (IF=5mA, IL=150mADC) 25 0.12 2.5 0 -40 Typical Turn-Off Time vs. Temperature (IF=5mA, IL=150mADC) 0.025 0.020 0.015 0.010 0.005 -20 0 20 40 60 Temperature (ºC) 80 100 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION PLA110L Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification PLA110LS MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles PLA110LS 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device PLA110L Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R08 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION PLA110L Mechanical Dimensions PLA110L 8.382±0.381 (0.330±0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54±0.127 (0.100±0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144±0.508 (0.360±0.020) 6.350±0.127 (0.250±0.005) 1.524 TYP (0.060 TYP) Pin 1 1.651±0.254 (0.065±0.010) 2.540±0.127 (0.100±0.005) 7.620±0.127 (0.300±0.005) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 5.080±0.127 (0.200±0.005) Controlling dimension: inches 3.302±0.051 (0.130±0.002) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457±0.076 (0.018±0.003) PLA110LS 8.382±0.381 (0.330±0.015) 9.524±0.508 (0.375±0.020) Pin 1 0.635±0.127 (0.025±0.005) 2.54±0.127 (0.100±0.005) 2.54 (0.10) 6.350±0.127 (0.250±0.005) 0.457±0.076 (0.018±0.003) 1.651±0.254 (0.065±0.010) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302±0.051 (0.130±0.002) 4.445±0.254 (0.175±0.010) Controlling dimension: inches 1.524 TYP (0.060 TYP) 1.651±0.254 (0.065±0.010) 6 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION PLA110L PLA110LSTR Tape & Reel P1 = 12.00 (0.472) 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) A0 = 10.10 (0.398) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-PLA110L-R08 © Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 11/4/2021