PLA110
400V, 150mA Single-Pole
Normally Open Relay
INTEGRATED CIRCUITS DIVISION
Parameters
Blocking Voltage
Load Current
On-Resistance (max)
Ratings
400
Units
VP
150
22
mArms / mADC
Description
PLA110 is a normally open (1-Form-A) solid
state relay that uses optically coupled MOSFET
technology to provide 3750Vrms of input to output
isolation. Its optically coupled outputs, which use the
patented OptoMOS architecture, are controlled by a
highly efficient infrared LED.
Features
•
•
•
•
•
•
•
•
3750Vrms Input to Output Isolation
Low Drive Power Requirements
Greater Reliability than Electromechanical Relays
No EMI/RFI Generation
FCC Compatible
VDE Compatible
Small 6-Pin Package
Flammability Rating UL 94 V-0
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, PocketSize)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment Patient/Equipment Isolation
• Security
• Industrial Controls
The PLA110 can be used to replace mechanical
relays, and offers the superior reliability associated
with semiconductor devices. Because it has no
moving parts, it offers faster, bounce-free switching
in a more compact surface mount or thru-hole
package.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate # 1175739
• TUV EN 62368-1: Certificate # B 082667 0008
Ordering Information
Part #
PLA110
PLA110S
PLA110STR
Description
6-Lead DIP (50/Tube)
6-Lead Surface Mount (50/Tube)
6-Lead Surface Mount (1000/Reel)
Pin Configuration
AC/DC Configuration
+ Control
- Control
NC
1
6
2
5
3
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
- Control
NC
1
6
2
5
3
4
+ Load
- Load
Switching Characteristics of
Normally Open Devices
Form-A
IF
90%
10%
ILOAD
ton
DS-PLA110-R09
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1
INTEGRATED CIRCUITS DIVISION
PLA110
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Package Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature, Ambient
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate output power linearly 6.67 mW / ºC
Min
3750
-40
-40
Max
400
5
50
1
150
800
+85
+125
Units
VP
V
mA
A
mW
mW
Vrms
ºC
ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Electrical Characteristics @ 25ºC
Parameters
Output Characteristics
Blocking Voltage
Load Current
Continuous, AC/DC Configuration
Continuous, DC Configuration
Peak
On-Resistance 1
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
Conditions
Symbol
Min
Typ
Max
Units
IL=1A
VDRM
400
-
-
VP
-
IL
t=10ms
ILPK
-
-
150
250
±400
mArms / mADC
mADC
mAP
-
22
7
1
ILEAK
-
IF=0mA, VL=50V, f=1MHz
ton
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COUT
-
25
1
0.5
-
IL=150mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.4
0.9
-
0.7
1.36
-
5
1.5
10
mA
mA
V
A
VIO=0V, f=1MHz
CIO
-
3
-
pF
IL=150mA
IL=250mA
VL=400VP
IF=5mA, VL=10V
RON
A
ms
pF
Measurement taken within one second of on-time.
2
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R09
INTEGRATED CIRCUITS DIVISION
PLA110
PERFORMANCE DATA*
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
Device Count (N)
20
15
10
5
25
20
20
15
10
5
1.364
1.366
1.368
1.370
1.372
LED Forward Voltage Drop (V)
0.23
Typical IF for Switch Operation
(N=50, IL=150mADC)
25
0.26
0.29
0.32
0.35
Turn-On Time (ms)
Device Count (N)
10
5
5
0.12
0.17
0.22
0.27
0.32
Turn-Off Time (ms)
0.37
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=150mADC)
35
30
20
15
10
5
25
20
15
10
5
0
0
1.35
1.65
1.95
LED Current (mA)
10
0.38
25
15
1.05
15
Typical IF for Switch Dropout
(N=50)
20
0.75
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mADC)
0
0
0
Device Count (N)
25
Device Count (N)
Device Count (N)
25
Device Count (N)
30
Typical Turn-On Time
(N=50, IF=5mA, IL=100mADC)
0
0.75
2.25
1.05
1.35
1.65
1.95
LED Current (mA)
2.25
15
16
17
18
19
On-Resistance (:)
20
Typical Blocking Voltage Distribution
(N=50)
35
Device Count (N)
30
25
20
15
10
5
0
441.5 450.5 459.5 468.5 477.5
Blocking Voltage (VP)
Typical Turn-On Time
vs. LED Forward Current
(IL=150mADC)
0.35
1.6
IF=10mA
IF=5mA
IF=2mA
1.5
1.4
1.3
1.2
0.30
0.25
0.20
0.15
0.10
1.0
-25
0
25
50
Temperature (ºC)
75
100
0.08
0.06
0.04
0
0
-50
0.10
0.02
0.05
1.1
Typical Turn-Off Time
vs. LED Forward Current
(IL=150mADC)
0.12
Turn-Off Time (ms)
0.40
1.7
Turn-On Time (ms)
LED Forward Voltage Drop (V)
Typical LED Forward Voltage Drop
vs. Temperature
1.8
486.5
0
5
10
15 20 25 30 35 40
Forward Current (mA)
45
50
0
5
10
15 20 25 30 35 40
Forward Current (mA)
45
50
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
R09
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3
INTEGRATED CIRCUITS DIVISION
PLA110
PERFORMANCE DATA*
Typical On-Resistance vs. Temperature
AC/DC Configuration
(IL=150mADC)
0.6
IF=5mA
IF=10mA
15
10
5
0.3
0.2
0.25
0.20
0.15
0.10
0.05
0
20
40
60
Temperature (ºC)
80
100
-40
20
40
60
80
Temperature (ºC)
100
0
-40
120
LED Current (mA)
IF=10mA
6
5
2.0
1.5
1.0
0
20
40
60
Temperature (ºC)
80
100
Typical On Resistance
vs. Temperature
(IF=5mA; IL=100mA Instantaneous)
150
25
Load Current (mA)
20
15
10
5
-20
0
20
40
60
Temperature (ºC)
80
-40
-20
0
20
40
60
80
Temperature (ºC)
100
1.5
1.0
100
50
0
-50
250
150
Load Current (A)
Leakage (PA)
1.0
0.025
0.020
0.015
0.010
0
20
40
60
Temperature (ºC)
80
100
0
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
0.8
0.6
0.4
0.2
0.005
-20
IF=10mA
IF=5mA
Energy Rating Curve
0.030
450
-40
IF=10mA
IF=5mA
AC/DC Configuration
0
-40
475
455
100
50
1.2
460
80
DC Configuration
100
0.035
465
20
40
60
Temperature (ºC)
200
480
470
0
300
Typical Leakage vs. Temperature
Measured across Pins 4&6
Typical Blocking Voltage
vs. Temperature
-20
Maximum Load Current
vs. Temperature
(N=50)
Typical Load Current vs. Load Voltage
(IF=5mA)
-150
-2.5 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 2.5
Load Voltage (V)
120
100
2.0
-40
100
-100
0
80
0
-40
Load Current (mA)
-20
20
40
60
Temperature (ºC)
0.5
0
-40
0
2.5
0.5
0
-20
Typical IF for Switch Dropout
vs. Temperature
(IL=100mADC)
3.0
2.5
8
7
0
Typical IF for Switch Operation
vs. Temperature
(IL=100mADC)
3.0
IF=5mA
9
-20
LED Current (mA)
-20
Typical On-Resistance
vs. Temperature - DC Configuration
(IL=150mADC)
10
On-Resistance (:)
IF=10mA
0
-40
On-Resistance (:)
0.4
0.1
0
Blocking Voltage (VP)
0.30
0.5
Turn-Off Time (ms)
20
Typical Turn-Off Time
vs. Temperature
(IF=5mA, IL=100mADC)
0.35
IF=5mA
Turn-On Time (ms)
On-Resistance (:)
25
Typical Turn-On Time
vs. Temperature
(IL=100mADC)
-20
0
20
40
60
Temperature (ºC)
80
100
0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
10s
100s
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
4
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R09
INTEGRATED CIRCUITS DIVISION
PLA110
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product
performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Classification
PLA110S
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell
time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater.
The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering
processes.
Device
Classification Temperature (Tc)
Dwell Time (tP)
Max Reflow Cycles
PLA110S
250ºC
30 seconds
3
For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is
provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder
wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the
last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below.
Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering
process.
Device
PLA110
Maximum Pin Temperature
260ºC
Maximum Body Temperature
250ºC
Maximum Dwell Time
10 seconds*
Wave Cycles
1
*Total cumulative duration of all waves.
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to
the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake
cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability
of the wash parameters used to clean the board, determination of the bake temperature and duration necessary
to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying
methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must
not be exposed to halide flux or solvents.
R09
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5
INTEGRATED CIRCUITS DIVISION
PLA110
Mechanical Dimensions
PLA110
8.382±0.381
(0.330±0.015)
PCB Hole Pattern
7.239 TYP
(0.285 TYP)
2.54±0.127
(0.100±0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
9.144±0.508
(0.360±0.020)
6.350±0.127
(0.250±0.005)
1.524 TYP
(0.060 TYP)
Pin 1
1.651±0.254
(0.065±0.010)
2.540±0.127
(0.100±0.005)
7.620±0.127
(0.300±0.005)
7.620±0.254
(0.300±0.010)
0.254±0.0127
(0.010±0.0005)
5.080±0.127
(0.200±0.005)
Controlling dimension: inches
3.302±0.051
(0.130±0.002)
4.064 TYP
(0.160 TYP)
Dimensions
mm
(inches)
0.457±0.076
(0.018±0.003)
PLA110S
8.382±0.381
(0.330±0.015)
9.524±0.508
(0.375±0.020)
Pin 1
0.635±0.127
(0.025±0.005)
2.54
(0.10)
6.350±0.127
(0.250±0.005)
0.457±0.076
(0.018±0.003)
1.651±0.254
(0.065±0.010)
7.620±0.254
(0.300±0.010)
0.254±0.0127
(0.010±0.0005)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302±0.051
(0.130±0.002)
4.445±0.254
(0.175±0.010)
Controlling dimension: inches
1.524 TYP
(0.060 TYP)
1.651±0.254
(0.065±0.010)
6
PCB Land Pattern
2.54±0.127
(0.100±0.005)
Dimensions
mm
(inches)
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R09
INTEGRATED CIRCUITS DIVISION
PLA110
PLA110STR Tape & Reel
330.2 Dia
(13.00 Dia)
P1 = 12.00
(0.472)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
K0 = 4.90
(0.19)
K1 = 3.80
(0.15)
A0 = 10.10
(0.398)
User Direction of Feed
Embossed
Carrier
Embossment
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: https://www.ixysic.com
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.
7
Specification: DS-PLA110-R09
©Copyright 2021, Littelfuse, Inc.
All rights reserved. Printed in USA.
11/4/2021
