PLA132S

PLA132 60V, 600mA Single-Pole Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current Input Control Current On-Resistance (max) Rating 60 600 2 1 Units VP mArms / mADC mA  Description PLA132 is a single-pole, normally open (1-Form-A) solid state relay that uses optically coupled MOSFET technology to provide 3750Vrms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Features • Low Input Control Current: 2mA • 3750Vrms Input/Output Isolation • Low Drive Power Requirements (TTL/CMOS Compatible) • Greater Reliability than Electromechanical Relays • FCC Compatible • VDE Compatible • No EMI/RFI Generation • Small 6-Pin Package • Surface Mount Tape & Reel Version Available The PLA132 can be used to replace mechanical relays, and offers the superior reliability associated with semiconductor devices. Because it has no moving parts, it offers faster, bounce-free switching in a more compact surface mount or thru-hole package. Approvals • UL Recognized Component: File E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Applications • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Security • Industrial Controls • Automotive Part # PLA132 PLA132S PLA132STR Description 6-Pin DIP (50/Tube) 6-Pin Surface Mount (50/Tube) 6-Pin Surface Mount (1,000/Reel) Pin Configuration AC/DC Configuration + Control – Control Do Not Use 1 6 2 5 3 4 Load Do Not Use Load DC Only Configuration + Control – Control Do Not Use 1 6 2 5 3 4 + Load – Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-PLA132-R05 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION PLA132 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Ratings 60 5 50 1 150 800 3750 -40 to +85 -40 to +125 Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Conditions Symbol Min Typ Max Units IL=1A VDRM 60 - - VP - IL t≤10ms ILPK - - 600 1.2 ±2 mArms / mADC ADC AP 0.85 - 1 0.3 1   ILEAK - A IF=0mA, VL=50V, f=1MHz ton toff COUT - 25 5 2 - ms ms pF IL = 600mA IF = 5mA VR = 5V IF IF VF IR 0.2 0.9 - 1.36 - 2 1.5 10 mA mA V A - CI/O - 3 - pF Load Current Continuous, AC/DC Configuration Continuous, DC Configuration Peak On-Resistance 1 AC/DC Configuration DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 IL=600mA IL=1A VL=60VP RON IF = 5mA, VL = 10V Measurement taken within one second of on-time. 2 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION PLA132 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) Device Count (N) 25 20 15 10 5 20 15 10 5 1.364 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) 0.75 Typical IF for Switch Operation (N=50, IL=600mADC) 20 20 15 10 5 0 0.80 0.85 0.90 0.95 1.00 Turn-On Time (ms) 0.41 0.43 0.45 0.47 LED Current (mA) 0.49 10 5 0.29 0.31 0.33 0.35 0.37 0.39 Turn-Off Time (ms) 0.41 Typical On-Resistance Distribution (N=50, IF=5mA, IL=600mA) Typical IF for Switch Dropout (N=50, IL=600mADC) 35 30 15 10 5 25 20 15 10 5 0 0.39 15 1.05 Device Count (N) 25 Device Count (N) 25 20 0 0 0 Device Count (N) 25 Device Count (N) 30 Typical Turn-Off Time (N=50, IF=5mA, IL=100mADC) Typical Turn-On Time (N=50, IF=5mA, IL=100mADC) 0 0.51 0.39 0.41 0.43 0.45 0.47 LED Current (mA) 0.49 0.83 0.51 0.84 0.85 0.86 0.87 0.88 On-Resistance (:) 0.89 Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 69.0 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 1.1 1.0 -50 -25 0 25 50 Temperature (ºC) 75 100 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Typical Turn-Off Time vs. LED Forward Current (IL=80mA) 0.7 0.6 Turn-Off Time (ms) Turn-On Time (ms) LED Forward Voltage Drop (V) 1.7 72.0 Typical Turn-On Time vs. LED Forward Current (IL=80mA) Typical LED Forward Voltage Drop vs. Temperature 1.8 69.5 70.0 70.5 71.0 71.5 Blocking Voltage (VP) 0.5 0.4 0.3 0.2 0.1 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PLA132 IF =5mA IF =10mA -20 0 20 40 60 Temperature (ºC) 80 100 0.60 0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 -40 Typical IF for Switch Operation vs. Temperature (IL=300mA) 1.2 1.2 0.6 0.4 IF =10mA IF =5mA -20 0 20 40 60 Temperature (ºC) 80 0 0 60 20 40 Temperature (ºC) 80 100 -40 Maximum Load Current vs. Temperature (IF=2mA) 1.3 Blocking Voltage (VP) DC 1.0 0.9 0.8 0.7 0.6 AC/DC 0.5 0.4 -40 -20 0 20 40 60 Temperature (ºC) 80 0 20 40 60 80 Temperature (ºC) 100 20 40 60 Temperature (ºC) 80 100 Typical Load Current vs. Load Voltage (IF=2mA) 0 -200 72 0.016 70 0.014 68 66 64 62 -0.4 -0.2 0 0.2 Load Voltage (V) 0.4 0.6 Typical Leakage vs. Temperature Measured Across Pins 4&6 (VL=60V) 0.012 0.010 0.008 0.006 0.004 60 0.002 -40 120 0 200 -600 -0.6 100 58 -20 -20 400 Typical Blocking Voltage vs. Temperature 1.2 1.1 0.7 -400 Leakage (PA) -20 0.8 600 0.4 0.2 0.9 -40 Typical IF for Switch Dropout vs. Temperature (IL=300mA) 0.6 0 1.0 0.6 100 0.8 0.2 -40 Load Current (A) 1.1 Load Current (mA) 0.8 Typical On-Resistance vs. Temperature (IF=2mA, IL=600mADC) 1.2 1.0 LED Current (mA) LED Current (mA) 1.0 Typical Turn-Off Time vs. Temperature (IL=80mA) On-Resistance (:) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 -40 Typical Turn-On Time vs. Temperature (IL=80mA) Turn-Off Time (ms) Turn-On Time (ms) PERFORMANCE DATA* -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Load Current (A) Energy Rating Curve 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 10Ps 100Ps 1ms 10ms 100ms 1s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION PLA132 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification PLA132S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles PLA132S 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device PLA132 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R05 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION PLA132 Mechanical Dimensions PLA132 8.382±0.381 (0.330±0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54±0.127 (0.100±0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144±0.508 (0.360±0.020) 6.350±0.127 (0.250±0.005) 1.524 TYP (0.060 TYP) Pin 1 1.651±0.254 (0.065±0.010) 2.540±0.127 (0.100±0.005) 7.620±0.127 (0.300±0.005) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 5.080±0.127 (0.200±0.005) Controlling dimension: inches 3.302±0.051 (0.130±0.002) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457±0.076 (0.018±0.003) PLA132S 8.382±0.381 (0.330±0.015) 9.524±0.508 (0.375±0.020) Pin 1 0.635±0.127 (0.025±0.005) 2.54 (0.10) 6.350±0.127 (0.250±0.005) 0.457±0.076 (0.018±0.003) 1.651±0.254 (0.065±0.010) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302±0.051 (0.130±0.002) 4.445±0.254 (0.175±0.010) Controlling dimension: inches 1.524 TYP (0.060 TYP) 1.651±0.254 (0.065±0.010) 6 PCB Land Pattern 2.54±0.127 (0.100±0.005) Dimensions mm (inches) www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION PLA132 PLA132STR Tape & Reel 330.2 Dia (13.00 Dia) P1 = 12.00 (0.472) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) A0 = 10.10 (0.398) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-PLA132-R05 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 11/4/2021