PLA134S

PLA134 100V, 350mA Single-Pole Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 100 350 3 Units VP mArms / mADC  Features • • • • • • • 3750Vrms Input/Output Isolation Low Drive Power Requirements Greater Reliability than Electromechanical Relays No EMI/RFI Generation Small 6-Pin Package Surface Mount Tape & Reel Version Available Flammability Rating UL 94 V-0 Description The PLA134 is a single-pole, normally open (1-Form-A) Solid State Relay that uses optically coupled MOSFET technology to provide 3750Vrms of input-to-output isolation. With its combination of low on-resistance and high load current handling, the PLA134 is suitable for a variety of industrial applications. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Because Solid State Relays have no moving parts, they can offer faster, bounce-free switching in a more compact surface mount or though hole package than traditional electromechanical relays. Applications • • • • • • • • • Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment—Patient/Equipment Isolation Security Industrial Controls Approvals • UL Recognized Component: File E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part Number PLA134 PLA134S PLA134STR Description 6-Pin DIP (50/Tube) 6-Pin Surface Mount (50/Tube) 6-Pin Surface Mount (1,000/Reel) Pin Configuration AC/DC Configuration + Control – Control N/C 1 6 2 5 3 4 Load Do Not Use Load DC Only Configuration + Control – Control N/C 1 6 2 5 3 4 + Load – Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-PLA134-R07 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION PLA134 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Ratings 100 5 50 1 150 800 3750 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous, AC/DC Configuration Continuous, DC Configuration Peak On-Resistance 1 AC/DC Configuration DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 100 - - VP - IL t=10ms ILPK - - 350 750 ±1 mArms / mADC mADC mAP - - 3 0.8 1  µA IF=350mA IF=750mA VL=100VP RON ILEAK IF=5mA, IL=10mA ton toff - - 5 ms IL=350mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 1.36 - 5 1.5 10 mA mA V µA VIO=0V, f=1MHz CIO - 3 - pF Measurement taken within one second of on-time. www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION PLA134 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) Device Count (N) 25 20 15 10 5 20 15 10 5 1.364 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) 0.9 15 10 5 0.15 0.21 0.27 0.33 Turn-On Time (ms) 0.39 0.065 25 20 20 20 10 5 Device Count (N) 25 Device Count (N) 25 15 15 10 5 0 0 0.75 1.05 1.35 1.65 1.95 LED Current (mA) 0.075 0.085 0.095 Turn-Off Time (ms) 0.105 Typical On-Resistance Distribution (N=50, IF=5mA, IL=350mADC) Typical IF for Switch Dropout (N=50, IL=350mADC) Typical IF for Switch Operation (N=50, IL=350mADC) Device Count (N) 20 0 0 0 Typical Turn-Off Time (N=50, IF=5mA, IL=350mADC) 25 Device Count (N) 30 Typical Turn-On Time (N=50, IF=5mA, IL=350mADC) 15 10 5 0 2.25 0.75 1.05 1.35 1.65 1.95 LED Current (mA) 2.25 2.20 2.25 2.30 2.35 2.40 On-Resistance (:) 2.45 Typical Blocking Voltage Distribution (N=50) Device Count (N) 25 20 15 10 5 0 100 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 1.1 0.25 Turn-Off Time (ms) Turn-On Time (ms) LED Forward Voltage Drop (V) 0.30 1.7 150 Typical Turn-On Time vs. LED Forward Current (IL=200mADC) Typical LED Forward Voltage Drop vs. Temperature 1.8 110 120 130 140 Blocking Voltage (VP) 0.20 0.15 0.10 0.05 0 1.0 -50 -25 0 25 50 Temperature (ºC) 75 100 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 Typical Turn-Off Time vs. LED Forward Current (IL=200mADC) 0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R07 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PLA134 PERFORMANCE DATA* Typical Turn-Off Time vs. Temperature (IF=5mA, IL=200mADC) Typical Turn-On Time vs. Temperature (IF=5mA, IL=200mADC) 0.7 0.11 0.4 0.3 0.2 0.08 0.07 0.06 0.05 0.04 0.03 0 -40 -20 0 20 40 60 Temperature (ºC) 80 0 -40 100 Typical IF for Switch Operation vs. Temperature (IL=200mADC) 3.0 20 40 60 Temperature (ºC) 80 1.5 1.0 2.0 1.5 1.0 20 40 60 Temperature (ºC) 80 100 Load Current (mA) 0 -100 -200 -300 20 40 60 Temperature (ºC) 80 20 40 60 Temperature (ºC) 80 100 IF=5mA 2.0 1.5 IF=10mA 1.0 0.5 -40 100 -20 0 20 40 60 Temperature (ºC) 80 100 Maximum Load Current vs. Temperature DC Configuration 900 800 400 300 IF=10mA 200 IF=5mA 100 700 600 500 IF=10mA 400 IF=5mA 300 200 100 -1.0 -0.5 0 0.5 Load Voltage (V) 1.0 0 -40 1.5 Typical Blocking Voltage vs. Temperature -20 0 20 40 60 80 Temperature (ºC) 100 0.018 150 0.016 Leakage (PA) 100 75 50 20 40 60 Temperature (ºC) 80 100 0.012 0.010 0.008 0.006 0 -40 20 40 60 80 Temperature (ºC) 100 120 10s 100s 2.0 1.6 1.2 0.8 0.4 0.002 0 0 Energy Rating Curve 0.004 25 -20 2.4 0.014 125 -20 0 -40 120 Typical Leakage vs. Temperature Measured Across Pins 4&6 175 0 -40 0 500 100 -400 -1.5 -20 600 300 0 Typical On-Resistance vs. Temperature DC-Only Configuration (IL=350mADC) Maximum Load Current vs. Temperature AC/DC Configuration Typical Load Current vs. Load Voltage (IF=5mA) 200 -20 0 -40 Load Current (mA) 0 1 2.5 Load Current (A) 400 -20 IF=5mA Instantaneous 2 -40 0 -40 3 3.0 0.5 0 4 100 On-Resistance (:) 2.0 0.5 Load Current (mA) 0 2.5 LED Current (mA) LED Current (mA) 2.5 IF=10mA 0 -20 Typical IF for Switch Dropout vs. Temperature (IL=200mADC) 3.0 IF=5mA 5 0.09 On-Resistance (:) Turn-Off Time (ms) Turn-On Time (ms) 0.5 0.1 Blocking Voltage (VP) 6 0.10 0.6 Typical On-Resistance vs. Temperature AC/DC Configuration (IL=350mADC) -20 0 20 40 60 Temperature (ºC) 80 100 0 10Ps 100Ps 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION PLA134 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification PLA134S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles PLA134S 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device PLA134 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R07 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION PLA134 Mechanical Dimensions PLA134 8.382±0.381 (0.330±0.015) 7.239 TYP (0.285 TYP) 2.54±0.127 (0.100±0.005) PCB Hole Pattern 6 - 0.800 DIA. (6 - 0.031 DIA.) 6.350±0.127 (0.250±0.005) Pin 1 1.524 TYP (0.060 TYP) 1.651±0.254 (0.065±0.010) 2.540±0.127 (0.100±0.005) 9.144±0.508 (0.360±0.020) 7.620±0.127 (0.300±0.005) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 5.080±0.127 (0.200±0.005) Controlling dimension: inches 3.302±0.051 (0.130±0.002) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457±0.076 (0.018±0.003) PLA134S 8.382±0.381 (0.330±0.015) 9.524±0.508 (0.375±0.020) Pin 1 0.635±0.127 (0.025±0.005) 2.54 (0.10) 6.350±0.127 (0.250±0.005) 0.457±0.076 (0.018±0.003) 1.651±0.254 (0.065±0.010) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302±0.051 (0.130±0.002) 4.445±0.254 (0.175±0.010) Controlling dimension: inches 1.524 TYP (0.060 TYP) 1.651±0.254 (0.065±0.010) 6 PCB Land Pattern 2.54±0.127 (0.100±0.005) Dimensions mm (inches) www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION PLA134 PLA134STR Tape & Reel 330.2 Dia (13.00 Dia) P1 = 12.00 (0.472) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) A0 = 10.10 (0.398) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-PLA134-R07 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 11/4/2021