PLA160
300V, 50mA Single-Pole,
Normally Open Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Maximum Turn-On/Turn-Off Times
Blocking Voltage
Load Current
On-Resistance (max)
Rating
50
300
50
100
Units
s
VP
mArms / mADC
Description
PLA160 is a 300V, 50mA, 100 1-Form-A relay. This
performance leader features the fastest switching
speed (50s) available in an OptoMOS relay.
Approvals
Features
•
•
•
•
•
•
•
•
•
Fastest Switching OptoMOS Relay, 50s
3750Vrms Input/Output Isolation
Low Drive Power Requirements
Greater Reliability than Electromechanical Relays
FCC Compatible
No EMI/RFI Generation
Small 6-Pin Package
Surface Mount Tape & Reel Version Available
Flammability Classification Rating of V-0
• UL Recognized Component: File # E76270
• TUV EN 62368-1: Certificate # B 082667 0008
Ordering Information
Part Number
PLA160
PLA160S
PLA160STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1,000/Reel)
Pin Configuration
Applications
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security Systems
• Industrial Controls
• Reed Relay Replacement
AC/DC Configuration
+ Control
– Control
Do Not Use
1
6
2
5
3
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
– Control
Do Not Use
1
6
2
5
3
4
+ Load
– Load
Switching Characteristics of
Normally Open (Form A) Devices
Form-A
IF
90%
10%
ILOAD
ton
DS-PLA160-R08
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toff
1
INTEGRATED CIRCUITS DIVISION
PLA160
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature, Ambient
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate output power linearly 6.67 mW / ºC
Ratings
300
5
50
1
150
800
3750
-40 to +85
-40 to +125
Units
VP
V
mA
A
mW
mW
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Blocking Voltage
Load Current
Continuous, AC/DC Configuration
Continuous, DC Configuration
Peak
On-Resistance 1
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
2
Conditions
Symbol
Min
Typ
Max
Units
IL=1A
VDRM
300
-
-
VP
-
IL
t=10ms
ILPK
-
-
50
80
±200
mArms / mADC
mADC
mAP
-
60
15
1
100
30
25
10
IF=50mA
IF=80mA
VL=300V
VL=100V
RON
ILEAK
50V, f=1MHz
ton
toff
COUT
IL=50mA
IF=10mA
VR=5V
-
IF=10mA, VL=10V
nA
-
25
42
3
IF
IF
VF
IR
0.4
1.8
-
1.35
1.25
2.4
-
10
2.8
10
mA
mA
V
µA
CI/O
-
3
-
pF
-
50
s
-
pF
Measurement taken within one second of on-time.
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R08
INTEGRATED CIRCUITS DIVISION
PLA160
PERFORMANCE DATA*
Typical LED Forward Voltage Drop
(N=50)
25
Device Count (N)
25
20
15
10
5
2.34
15
10
5
21
23
25
27
Turn-On Time (Ps)
29
38
Device Count (N)
10
15
10
5
0
0
0.9
1.1
1.3
1.5
1.7
LED Current (mA)
42
44
46
Turn-Off Time (Ps)
48
30
20
5
40
Typical On-Resistance Distribution
(N=50, IF=10mA, IL=50mADC)
35
25
15
10
31
Typical IF for Switch Dropout
(N=50, IL=50mADC)
30
20
15
0
19
Typical IF for Switch Operation
(N=50, IL=50mADC)
20
5
2.38
2.42
2.46
2.50
LED Forward Voltage Drop (V)
25
Device Count (N)
25
20
0
0
Turn-Off Time Distribution
(N=50, IF=10mA, IL=50mA)
30
Device Count (N)
Device Count (N)
30
Device Count (N)
35
30
Turn-On Time Distribution
(N=50, IF=10mA, IL=50mA)
25
20
15
10
5
0
1.9
0.9
1.1
1.3
1.5
1.7
LED Current (mA)
60
1.9
61
62
63
64
On-Resistance (:)
65
Typical Blocking Voltage Distribution
(N=50)
18
Device Count (N)
16
14
12
10
8
6
4
2
0
335
45
365
2.8
IF=50mA
IF=30mA
IF=20mA
IF=10mA
2.4
2.0
48
Turn-Off Time (Ps)
3.2
35
30
25
20
15
-20
0
20
40
60
80
Temperature (ºC)
100
120
44
42
38
5
-40
46
40
10
1.6
Typical Turn-Off Time
vs. LED Forward Current
(VL=10V, IL=50mA)
50
40
Turn-On Time (Ps)
LED Forward Voltage Drop (V)
345 350
355 360
Blocking Voltage (VP)
Typical Turn-On Time
vs. LED Forward Current
(VL=10V, IL=50mA)
Typical LED Forward Voltage Drop
vs. Temperature
3.6
340
0
10
20
30
LED Current (mA)
40
50
0
10
20
30
LED Current (mA)
40
50
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
R08
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INTEGRATED CIRCUITS DIVISION
PLA160
PERFORMANCE DATA*
IF=20mA
20
15
10
5
-40
-20
0
20
40
60
Temperature (ºC)
80
Typical IF for Switch Operation
vs. Temperature
(IL=50mADC)
6
45
40
IF=10mA
35
LED Current (mA)
3
2
20
40
60
Temperature (ºC)
80
-40
-20
0
20
40
60
Temperature (ºC)
80
4
3
2
-40
100
Maximum Load Current
vs. Temperature
40
30
-40
100
0
0
-20
0
20
40
60
Temperature (ºC)
80
50
40
30
20
10
0
-10
-20
-30
-40
-50
100
-3
80
380
0.07
70
375
0.06
50
IF=20mA
IF=10mA
IF=5mA
40
30
20
365
360
355
350
345
10
340
0
335
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
0
20
40
60
Temperature (ºC)
80
100
-2
-1
0
1
Load Voltage (V)
2
3
Typical Leakage vs. Temperature
Measured across Pins 4&6
(VL=300VP)
370
Leakage (PA)
60
-20
Typical Load Current vs. Load Voltage
(IF=10mA)
Typical Blocking Voltage
vs. Temperature
Blocking Voltage (VP)
Load Current (mA)
0
1
1
50
10
-20
5
4
60
20
Typical IF for Switch Dropout
vs. Temperature
(IL=50mADC)
6
5
LED Current (mA)
IF=20mA
30
-40
100
70
50
On-Resistance (:)
25
Typical On-Resistance
vs. Temperature
(IL=50mADC, IF=10mA)
80
Load Current (mA)
Turn-On Time (Ps)
55
Typical Turn-Off Time vs. Temperature
(VL=10V)
IF=10mA
30
Turn-Off Time (Ps)
35
Typical Turn-On Time vs. Temperature
(VL=10V)
0.05
0.04
0.03
0.02
0.01
-40
-20
0
20
40
60
Temperature (ºC)
80
100
10s
100s
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Energy Rating Curve
0.45
Load Current (A)
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
4
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R08
INTEGRATED CIRCUITS DIVISION
PLA160
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product
performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Classification
PLA160S
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell
time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater.
The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering
processes.
Device
Classification Temperature (Tc)
Dwell Time (tP)
Max Reflow Cycles
PLA160S
250ºC
30 seconds
3
For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is
provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder
wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the
last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below.
Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering
process.
Device
PLA160
Maximum Pin Temperature
260ºC
Maximum Body Temperature
250ºC
Maximum Dwell Time
10 seconds*
Wave Cycles
1
*Total cumulative duration of all waves.
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to
the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake
cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability
of the wash parameters used to clean the board, determination of the bake temperature and duration necessary
to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying
methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must
not be exposed to halide flux or solvents.
R08
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5
INTEGRATED CIRCUITS DIVISION
PLA160
Mechanical Dimensions
PLA160
8.382±0.381
(0.330±0.015)
PCB Hole Pattern
7.239 TYP
(0.285 TYP)
2.54±0.127
(0.100±0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
6.350±0.127
(0.250±0.005)
Pin 1
1.524 TYP
(0.060 TYP)
1.651±0.254
(0.065±0.010)
2.540±0.127
(0.100±0.005)
9.144±0.508
(0.360±0.020)
7.620±0.127
(0.300±0.005)
7.620±0.254
(0.300±0.010)
0.254±0.0127
(0.010±0.0005)
5.080±0.127
(0.200±0.005)
Controlling dimension: inches
3.302±0.051
(0.130±0.002)
4.064 TYP
(0.160 TYP)
Dimensions
mm
(inches)
0.457±0.076
(0.018±0.003)
PLA160S
8.382±0.381
(0.330±0.015)
9.524±0.508
(0.375±0.020)
Pin 1
0.635±0.127
(0.025±0.005)
2.54
(0.10)
6.350±0.127
(0.250±0.005)
0.457±0.076
(0.018±0.003)
1.651±0.254
(0.065±0.010)
7.620±0.254
(0.300±0.010)
0.254±0.0127
(0.010±0.0005)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302±0.051
(0.130±0.002)
4.445±0.254
(0.175±0.010)
Controlling dimension: inches
1.524 TYP
(0.060 TYP)
1.651±0.254
(0.065±0.010)
6
PCB Land Pattern
2.54±0.127
(0.100±0.005)
Dimensions
mm
(inches)
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R08
INTEGRATED CIRCUITS DIVISION
PLA160
PLA160STR Tape & Reel
330.2 Dia
(13.00 Dia)
P1 = 12.00
(0.472)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
K0 = 4.90
(0.19)
K1 = 3.80
(0.15)
A0 = 10.10
(0.398)
User Direction of Feed
Embossed
Carrier
Embossment
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: https://www.ixysic.com
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.
7
Specification: DS-PLA160-R08
©Copyright 2021, Littelfuse, Inc.
OptoMOS® is a registered trademark of IXYS Integrated Circuits
All rights reserved. Printed in USA.
11/5/2021
