PLA171PTR

PLA171 800V, 100mA Single-Pole, Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameter Load Voltage Load Current On-Resistance (max) Input Control Current Rating 800 100 50 2 Units VP mArms / mADC  mA Features • • • • • • • Description Specially designed to provide 7mm of separation between the two output pins, IXYS Integrated Circuits' PLA171 is a single-pole, normally open (1-Form-A) Solid State Relay that uses optically coupled MOSFET technology to provide an enhanced input to output isolation of 5000Vrms. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. 7mm Separation of Output Pins 800VP Blocking Voltage 5000Vrms Input/Output Isolation Low Drive Power Requirements No EMI/RFI Generation Small Surface Mount Package Flammability Rating UL 94 V-0 The PLA171 is designed to replace, and offers superior reliability over, electromechanical relays. This device provides bounce-free switching in a compact surface-mount package. Approvals Applications • • • • • • • • • Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment—Patient/Equipment Isolation Automotive High-Voltage Circuitry Industrial Controls • UL Certified Component: File E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # PLA171P PLA171PTR Description 6-Pin (8-Pin Body) Flatpack (50/Tube) 6-Pin (8-Pin Body) Flatpack, Tape & Reel (1000/Reel) Pin Configuration NC + Control – Control NC 8 1 Load 2 3 5 4 Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-PLA171-R05 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION PLA171 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 ESD, Human Body Model Isolation Voltage, Input to Output (60 Seconds) Operational Temperature, Ambient Storage Temperature 1 2 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Ratings Units 800 VP 5 V 50 mA 1 A 150 mW 800 mW 8 kV 5000 Vrms -40 to +85 °C -40 to +125 °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / ºC Derate output power linearly 6.67 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current 1 Continuous Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 3 2 25oC Conditions Symbol Min Typ Max Units IL=1A VDRM 800 - - VP IF=2mA IF=2mA , t=10ms IF=2mA, IL= 100mA IF=5mA, IL=1mA IF=0mA, VL=800V IL ILPK 40 70 - 100 ±350 50 85 1 mArms / mADC mAP ILEAK - IF=0mA, VL=50V, f=1MHz ton toff COUT - 0.42 0.15 11 5 5 - IL=100mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 0.39 1.36 - 2 1.5 10 mA mA V µA VIO=0V, f=1MHz CIO - 3 - pF RON IF=5mA, VL=10V  µA ms pF @85oC. Load derates linearly from 100mA @ to 55mA Measurement taken within one second of on-time. For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 5mA is recommended. www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION PLA171 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) Device Count (N) Device Count (N) 25 20 15 10 Typical Turn-On Time (N=50, IF=5mA, IL=100mA) 25 5 20 15 10 5 0 0 1.364 15 10 5 0 0.36 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=100mA) 15 Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) 20 Device Count (N) 30 0.38 0.40 0.42 0.44 0.46 Turn-On Time (ms) 0.48 0.135 0.140 0.145 0.150 0.155 0.160 0.165 Turn-Off Time (ms) Typical Blocking Voltage Distribution (N=50) Typical On-Resistance Distribution (N=50, IF=2mA, IL=100mA) 35 15 10 5 Device Count (N) Device Count (N) Device Count (N) 30 25 20 15 10 10 5 5 0 0 0.33 0.35 0.37 0.39 0.41 LED Current (mA) 0.43 0 40.0 0.45 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 42.5 956 0.5 0.4 0.3 0 25 50 Temperature (ºC) 75 100 0 LED Current to Operate vs. Temperature (IL=55mA) 0.50 0.45 0.40 10 0.35 -20 0 20 40 60 Temperature (ºC) 0.152 0.150 20 30 LED Current (mA) 40 50 0 10 80 100 0.20 0.8 0.18 0.7 IF=2mA 0.6 0.5 0.3 -40 IF=5mA -20 0 20 40 60 Temperature (ºC) 20 30 LED Current (mA) 40 50 Typical Turn-Off Time vs. Temperature 0.9 0.4 -40 0.154 Typical Turn-On Time vs. Temperature Turn-On Time (ms) 0.55 0.156 Turn-Off Time (ms) -25 1004 0.148 0.1 1.0 972 980 988 996 Blocking Voltage (VP) 0.158 0.6 0.2 1.1 964 Typical Turn-Off Time vs. LED Forward Current (IL=55mA) 0.160 Turn-Off Time (ms) 1.6 -50 LED Current (mA) Turn-On Time (ms) LED Forward Voltage Drop (V) 0.7 1.7 41.0 41.5 42.0 On-Resistance (:) Typical Turn-On Time vs. LED Forward Current (IL=55mA) Typical LED Forward Voltage Drop vs. Temperature 1.8 40.5 80 100 IF=2mA 0.16 0.14 IF=5mA 0.12 0.10 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PLA171 PERFORMANCE DATA* Typical On-Resistance vs. Temperature (IF=5mA) 70 Typical Load Current vs. Load Voltage (IF=2mA) 100 110 50 40 IL=55mA 30 50 0 -50 -100 -20 0 20 40 60 Temperature (ºC) 80 80 1020 70 Leakage Current (nA) Blocking Voltage (VP) Typical Blocking Voltage vs. Temperature 1040 1000 980 960 940 920 900 -40 -20 0 20 40 60 Temperature (ºC) 80 100 100 90 80 70 60 50 -6 100 -4 -2 0 2 Voltage (V) 4 6 Typical Leakage Current vs. Temperature (VL=800V) 40 30 20 0 20 40 60 Temperature (ºC) 80 0 20 40 60 Temperature (ºC) 80 100 10s 100s Energy Rating Curve 50 -20 -20 1.0 60 10 -40 -40 Load Current (A) 20 -40 Load Current (mA) Load Current (mA) On-Resistance (:) IL=30mA 60 Maximum Load Current vs. Temperature (IF=5mA) 100 0.8 0.6 0.4 0.2 0.0 10Ps 100Ps 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION PLA171 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification PLA171P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles PLA171P 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R05 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION PLA171 Mechanical Dimensions PLA171P Recommended PCB Land Pattern 2.286 MAX (0.090) MAX See Note 3 7.620 TYP (0.300) TYP 6.350 ± 0.127 (0.250 ± 0.005) 9.398 ± 0.127 (0.370 ± 0.005) 0.051±0.051 (0.002±0.002) 7.62 (0.30) 7.620 ± 0.254 (0.300 ± 0.010) 8.70 (0.3425) Pin 1 0.203 ± 0.025 (0.008 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 2.540 ± 0.127 (0.100 ± 0.005) 0.635 ± 0.127 (0.025 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 2.159 ± 0.025 (0.085 ± 0.001) 0.864 ± 0.102 (0.034 ± 0.004) 1.55 (0.0610) Notes: 1. Coplanarity = 0.102mm (0.004”) MAX 2. Leadframe thickness does not include solder plating (1000 microinches MAX) 3. Sum of package height, standoff, and coplanarity shall not exceed 2.286mm (0.090”) 4. Controlling dimension: Inches 2.54 (0.10) 0.65 (0.0255) Dimensions mm (inches) PLA171PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.50 (0.295) Embossment W = 16.00 (0.63) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 6 Specification: DS-PLA171-R05 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 11/5/2021