PLA192ESTR

PLA192 600V, 150mA Single-Pole Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameters Blocking Voltage Load Current On-Resistance (max) LED Current to Operate Ratings 600 Units VP 150 22 5 mArms / mADC  Description IXYS Integrated Circuits' PLA192 is a single-pole, normally open (1-Form-A) solid state relay that provides 5000Vrms of input to output isolation. mA Features • • • • • • 5000Vrms Input/Output Isolation Low Drive Power Requirements Greater Reliability than Electromechanical Relays No EMI/RFI Generation Small 6-Pin Package Flammability Rating UL 94 V-0 Approvals • UL Recognized Component: File E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Applications • • • • • • • • The PLA192 can be used to replace mechanical relays, while offering the superior reliability associated with semiconductor devices. Employing the patented OptoMOS architecture, the highly efficient infrared LED controls the optically coupled outputs. Because they have no moving parts, they offer bounce-free switching in more compact surface mount or thru-hole packages. Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment: Patient/Equipment Isolation Industrial Controls Ordering Information Part # PLA192 Description 6-Pin DIP (50/Tube) PLA192S 6-Pin Surface Mount (50/Tube) PLA192STR 6-Pin Surface Mount (1000/Reel) Switching Characteristics of Normally Open Devices Pin Configuration Form-A AC/DC Configuration + Control - Control Do Not Use 1 6 2 5 3 4 Load IF Do Not Use 90% Load 10% ILOAD ton toff DC Only Configuration + Control - Control Do Not Use DS-PLA192-R11 1 6 2 5 3 4 + Load - Load www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION PLA192 Absolute Maximum Ratings @ 25ºC (Unless Otherwise Noted) Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Package Dissipation 2 Isolation Voltage, Input to Output (60 Seconds) ESD Rating, Human Body Model Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Rating 600 5 50 1 150 800 Units VP V mA A mW mW 5000 Vrms 4 -40 to +85 -40 to +125 kV ºC ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC (Unless Otherwise Noted) Parameters Output Characteristics Blocking Voltage Load Current Continuous, AC/DC Configuration Continuous, DC-Only Configuration Peak On-Resistance 1 AC/DC Configuration DC-Only Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 600 - - VP - IL t=10ms ILPK - - 150 220 ±400 mArms / mADC mADC mA 13.3 4.15 - 22 8 1  ILEAK - IF=0mA, VL=50V, f=1MHz ton toff COUT - 10 5 5 - IL=100mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 0.22 0.21 1.36 - 5 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF IL=150mA IL=220mA VL=600V IF=5mA, VL=10V RON A ms pF Measurement taken within one second of on-time. www.ixysic.com R11 INTEGRATED CIRCUITS DIVISION PLA192 PERFORMANCE DATA* Typical Turn-On Time (N=50, IF=5mA, IL=100mADC ) Typical LED Forward Voltage Drop (N=50, IF=5mA) Device Count (N) 20 15 10 30 30 25 20 15 10 5 5 0 0 1.364 1.7 1.8 1.9 2.0 Turn-On Time (ms) Device Count (N) 10 5 30 25 20 15 10 0.21 0.22 0.23 0.24 LED Current (mA) 0.25 0.38 DC-Only On-Resistance Distribution (N=50, IF=5mA, IL=220mA) 20 15 10 5 0 0 0.20 0.26 0.29 0.32 0.35 Turn-Off Time (ms) 25 30 5 0 10 0.23 35 15 15 2.1 Typical On-Resistance Distribution (N=50, IF=5mA, IL=150mA) 40 20 20 0 1.6 25 25 5 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=100mA) 30 Device Count (N) 35 Device Count (N) Device Count (N) 25 35 Device Count (N) 30 Typical Turn-Off Time (N=50, IF=5mA, IL=100mADC ) 13.1 0.26 13.2 13.3 13.4 13.5 On-Resistance (:) 13.6 4.05 4.10 4.15 4.20 4.25 On-Resistance (:) 4.30 Typical Blocking Voltage Distribution (N=50) 30 Device Count (N) 25 20 15 10 5 0 700 1.6 3500 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 1.1 360 3000 2500 2000 1500 1000 0 -50 -25 0 25 50 Temperature (ºC) 75 100 359 358 357 356 500 1.0 Typical Turn-Off Time vs. LED Forward Current (IL=100mA) 361 Turn-Off Time (Ps) 4000 Turn-On Time (Ps) LED Forward Voltage Drop (V) 4500 1.7 750 Typical Turn-On Time vs. LED Forward Current (IL=100mA) Typical LED Forward Voltage Drop vs. Temperature 1.8 710 720 730 740 Blocking Voltage (VP) 355 0 10 20 30 LED Current (mA) 40 50 0 10 20 30 40 Forward Current (mA) 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R11 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PLA192 0.30 Typical Turn-On Time vs. Temperature (IL=100mA) 4500 4000 0.28 0.26 0.24 0.22 0.20 0.18 IF=2mA 3500 3000 2500 IF=5mA 2000 1500 IF=10mA 1000 500 -40 0.16 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Typical AC/DC On-Resistance vs. Temperature (IF=5mA, IL=150mA) 18 IF=10mA IF=5mA IF=2mA 450 400 350 300 250 200 -20 0 20 40 60 Temperature (ºC) 80 100 -40 Typical DC-Only On-Resistance vs. Temperature (IF=5mA, IL=220mA) 7 Typical Turn-Off Time vs. Temperature (IL=100mA) 500 Turn-Off Time (Ps) Typical IF for Switch Operation vs. Temperature (IL=100mA) Turn-On Time (Ps) LED Current to Operate (mA) PERFORMANCE DATA* -20 0 20 40 60 Temperature (ºC) 80 100 80 100 Maximum Load Current vs. Temperature (IF=5mA) 250 14 12 10 20 40 60 Temperature (ºC) 80 100 Typical Load Current vs. Load Voltage AC/DC Configuration (IF=5mA) Current (A) 0.05 0.00 -0.05 0 20 40 60 Temperature (ºC) 80 -0.15 0.00 -3 0.06 -2 -1 0 1 Voltage (V) 2 3 180 0.04 0.03 0.02 0.01 0 -40 -20 0 20 40 60 Temperature º(C) 80 100 0.2 0.4 0.6 0.8 Voltage (V) 1.0 0 20 40 60 Temperature (ºC) 770 1.2 Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) 760 750 740 730 720 710 -40 1.2 160 -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s Energy Rating Curve (IF=5mA) 1.0 140 120 100 80 60 40 0.8 0.6 0.4 0.2 20 0 0.1 -20 Typical Blocking Voltage vs. Temperature 700 0.0 Typical Leakage vs. Temperature Measured across Pins 4&6 (VL=600V) 0.05 100 -40 Typical Load Current vs. Load Voltage DC-Only Configuration (IF=5mA) 0.10 0.05 AC/DC Configuration 150 100 0.15 -0.10 200 50 -20 0.20 Output Capacitance (pF) Current (A) 2 0.25 0.10 Leakage (PA) 3 Blocking Voltage (VP) 0 4 Load Current (A) 0.15 -20 5 1 -40 8 -40 Load Current (mA) 16 On-Resistance (:) On-Resistance (:) DC-Only Configuration 6 1 10 100 Load Voltage (V) 1000 0 10Ps 100Ps 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R11 INTEGRATED CIRCUITS DIVISION PLA192 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification PLA192S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles PLA192S 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device PLA192 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R11 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION PLA192 MECHANICAL DIMENSIONS PLA192 8.382±0.381 (0.330±0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54±0.127 (0.100±0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144±0.508 (0.360±0.020) 6.350±0.127 (0.250±0.005) 1.524 TYP (0.060 TYP) Pin 1 1.651±0.254 (0.065±0.010) 2.540±0.127 (0.100±0.005) 7.620±0.127 (0.300±0.005) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 5.080±0.127 (0.200±0.005) Controlling dimension: inches 3.302±0.051 (0.130±0.002) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457±0.076 (0.018±0.003) PLA192S 8.382±0.381 (0.330±0.015) 9.524±0.508 (0.375±0.020) Pin 1 0.635±0.127 (0.025±0.005) 2.54±0.127 (0.100±0.005) 2.54 (0.10) 6.350±0.127 (0.250±0.005) 0.457±0.076 (0.018±0.003) 1.651±0.254 (0.065±0.010) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302±0.051 (0.130±0.002) 4.445±0.254 (0.175±0.010) Controlling dimension: inches 1.524 TYP (0.060 TYP) 1.651±0.254 (0.065±0.010) 6 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R11 INTEGRATED CIRCUITS DIVISION PLA192 PLA192STR P1 = 12.00 (0.472) 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) A0 = 10.10 (0.398) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-PLA192-R11 ©Copyright 2022, Littelfuse, Inc. All rights reserved. Printed in USA. 6/6/2022