PLB171PTR

PLB171 Single-Pole, Normally Closed 800V, 80mA OptoMOS® Relay INTEGRATED CIRCUITS DIVISION Parameter Load Voltage Load Current On-Resistance (max) Input Control Current Rating 800 80 55 2 Units VP mArms / mADC  mA Features • • • • • • • • Specially designed to provide 7mm of separation between the two output pins, IXYS Integrated Circuits' PLB171 is a single-pole, normally closed (1-Form-B) Solid State Relay that uses optically coupled MOSFET technology to provide an enhanced input-to-output isolation of 5000Vrms. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. 7mm Separation of Output Pins 800VP Blocking Voltage 5000Vrms Input/Output Isolation Low Drive Power Requirements Arc-Free With No Snubbing Circuits No EMI/RFI Generation Surface Mount Package Flammability Rating UL 94 V-0 The PLB171 is designed to replace, and offers superior reliability over, electromechanical relays. This device provides bounce-free switching in a compact surface-mount package. Approvals Applications • • • • • • • • Description Meters (Watt-Hour, Water, Gas) Industrial Controls Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Medical Equipment—Patient/Equipment Isolation • UL Certified Component: File E76270 • EN/IEC 60950-1 Certified Component: Certificate available on our website Ordering Information Part # PLB171P PLB171PTR Description 6-Pin (8-Pin Body) Flatpack (50/Tube) 6-Pin (8-Pin Body) Flatpack, Tape & Reel (1000/Reel) Pin Configuration NC + Control – Control NC 8 1 Load 2 3 5 4 Load Switching Characteristics of Normally Closed Devices Form-B IF I LOAD toff DS-PLB171-R03 www.ixysic.com ton 1 INTEGRATED CIRCUITS DIVISION PLB171 Absolute Maximum Ratings @ 25ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Parameter Ratings Units Blocking Voltage 800 VP Reverse Input Voltage 5 V Input Control Current 50 mA Peak (10ms) 1 A Input Power Dissipation 1 150 mW Total Power Dissipation 2 800 mW ESD, Human Body Model 8 kV Isolation Voltage, Input to Output (60 Seconds) 5000 Vrms Operational Temperature -40 to +85 °C Storage Temperature -40 to +125 °C 1 2 Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / ºC Derate linearly 6.67 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Output (Deactivate) Turn-Off Output (Activate) Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate 3 Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 3 Conditions Symbol Min Typ Max Units IF=0mA IF=0mA , t=10ms IF=0mA, IL= 10mA IF=0mA, IL= 80mA IF=5mA, VL=800VP IL ILPK 58 38 - 80 ±250 90 55 1 mArms / mADC mAP ILEAK - ton toff COUT - 0.42 0.5 8 5 5 - IF=5mA VR=5V IF IF VF IR 50 0.9 - 0.2 1.2 - 2 1.5 10 mA A V µA VIO=0, f=1MHz CIO - 3 - pF RON IF=5mA, IL=80mA (See Timing Diagram) IF=2mA, VL=20VDC, f=1MHz IL=80mA 25oC  A ms pF @85oC. Load derates linearly from 80mA @ to 59mA Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 5mA is recommended. Timing Diagram IF IL 0 mA 90% 10% 0 mA toff 2 ton www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION PLB171 PERFORMANCE DATA* 2.0 1.5 1.4 1.3 1.2 IL=10mA IL=5mA IL=2mA 1.1 0.7 Turn-Off Time (ms) IL=50mA IL=25mA Turn-On Time (ms) 1.5 1.0 0.5 -40 -20 0 20 40 60 Temperature (ºC) 80 0 100 LED Current to Activate vs. Temperature 10 15 20 25 LED Forward Current (mA) 0.50 Activate 0.25 Deactivate -20 0 20 40 60 Temperature (ºC) 80 IF=2mA 2.0 1.5 IF=5mA 1.0 60 IL=80mA 50 40 -20 0 20 40 60 Temperature (ºC) 80 20 40 60 Temperature (ºC) 80 0.2 IF=5mA 80 40 0 -40 -4 -3 -2 -1 0 1 Load Voltage (V) 2 3 950 900 850 100 80 60 40 20 -40 -20 0 20 40 60 Temperature (ºC) 80 80 100 80 100 20 100 -20 0 20 40 60 Temperature (ºC) Output Capacitance vs. Load Voltage (IF=2mA) 90 0 800 20 40 60 Temperature (ºC) 40 0 -40 4 Output Capacitance (pF) Leakage Current (nA) 1000 0 60 Typical Leakage Current vs. Temperature 1050 -20 Maximum Load Current vs. Temperature 100 80 IF=2mA 0.3 80 100 1100 20 40 60 Temperature (ºC) 0.4 100 Typical Blocking Voltage vs. Temperature 0 0.5 -40 -120 0 0.6 100 -80 20 30 Turn-Off Time vs. Temperature (IL=55mA) 120 30 10 15 20 25 LED Forward Current (mA) 0.0 -40 Load Current (mA) 70 5 0.1 Load Current vs. Load Voltage (IF=0mA) IL=2mA -20 0.2 0 0.0 100 Load Current (mA) On-Resistance (:) 80 -40 0.3 0.8 2.5 90 -20 0.4 0.0 30 0.5 100 -40 0.5 0.7 3.0 On-Resistance vs. Temperature (IF=0mA) Blocking Voltage (VP) 5 Turn-On Time vs. Temperature (IL=55mA) 3.5 Turn-On Time (ms) LED Forward Current (mA) 0.75 0.00 -40 0.6 0.1 0.0 1.0 Turn-Off Time (ms) LED Forward Voltage Drop (V) 1.6 Turn-Off Time vs. LED Forward Current (IL=80mA) Turn-On Time vs. LED Forward Current (IL=80mA) LED Forward Voltage Drop vs. Temperature 80 70 60 50 40 30 20 10 0 0 5 10 15 Load Voltage (VDC) 20 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. R03 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PLB171 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification PLB171P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles PLB171P 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. 4 www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION PLB171 Mechanical Dimensions PLB171P 6.350 ± 0.127 (0.250 ± 0.005) 9.398 ± 0.127 (0.370 ± 0.005) Recommended PCB Land Pattern Leadframe to package standoff MIN=0.000 MAX=0.102 (0.004) 2.286 MAX (0.090) MAX See Note 3 7.620 TYP (0.300) TYP 7.62 (0.30) 7.620 ± 0.254 (0.300 ± 0.010) 8.70 (0.3425) Pin 1 0.457 ± 0.076 (0.018 ± 0.003) 2.540 ± 0.127 (0.100 ± 0.005) 0.203 ± 0.025 (0.008 ± 0.001) 0.635 ± 0.127 (0.025 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 2.159 ± 0.025 (0.085 ± 0.001) 0.864 ± 0.102 (0.034 ± 0.004) 1.55 (0.0610) Notes: 1. Coplanarity = 0.102mm (0.004”) MAX 2. Leadframe thickness does not include solder plating (1000 microinches MAX) 3. Sum of package height, standoff, and coplanarity shall not exceed 2.286mm (0.090”) 2.54 (0.10) 0.65 (0.0255) Dimensions mm (inches) PLB171PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) Embossment W = 16.00 (0.63) 7.50 (0.295) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 5 Specification: DS-PLB171-R03 ©Copyright 2018, IXYS Integrated Circuits OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 6/29/2018