XCA170S

XCA170 350V, 100mA Single-Pole Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Control Current to Operate Ratings 350 100 50 2 Units VP mArms / mADC  mA Features • • • • • • • • • 3750Vrms Input/Output Isolation Low Drive Power Requirements Greater Reliability than Electromechanical Relays FCC Compatible VDE Compatible No EMI/RFI Generation Small 6-Pin Package Flammability Rating UL 94 V-0 Surface Mount Tape & Reel Version Available Description The XCA170 is a 350V, 100mA, 50, normally open (1-Form-A) solid state relay that features high sensitivity and that, using optically coupled MOSFET technology, provides 3750Vrms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Useful as a replacement for mechanical relays, the XCA170 offers the superior reliability associated with semiconductor devices. Because it has no moving parts, it offers faster, bounce-free switching in a more compact surface mount or through hole package. Approvals • UL Recognized Component: File E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Security • Industrial Controls Ordering Information Part # XCA170 XCA170S XCA170STR Description 6-Pin DIP (50/Tube) 6-Pin Surface Mount (50/Tube) 6-Pin Surface Mount (1,000/Reel) Pin Configuration AC/DC Configuration + Control – Control Do Not Use 1 6 2 5 3 4 Load Do Not Use Load DC Only Configuration + Control – Control Do Not Use 1 6 2 5 3 4 + Load – Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-XCA170-R06 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION XCA170 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Ratings 350 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous, AC/DC Configuration Continuous, DC Configuration Peak On-Resistance 1 AC/DC Configuration DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 350 - - VP - IL - - t=10ms ILPK - - 100 180 ±350 mArms / mADC mADC mA 31 10 - 50 15 1  ILEAK - µA IF=0mA, VL=50V, f=1MHz ton toff COUT - 25 5 5 - ms ms pF IL = 120mA IF = 5mA VR = 5V IF IF VF IR 0.4 0.9 - 0.7 1.36 - 2 1.5 10 mA mA V µA VIO=0V, f=1MHz CIO - 3 - pF IL=100mA IL=180mA VL=350V RON IF = 5mA, VL = 10V Measurement taken within 1 second of on-time. www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION XCA170 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) Device Count (N) 25 20 15 10 5 20 15 10 5 0 0 1.364 0.67 15 10 5 0.75 0.83 0.91 0.99 1.06 Turn-On Time (ms) 1.14 0.11 Typical IF for Switch Dropout (N=50, IL=100mADC) 25 25 20 20 20 15 10 5 Device Count (N) 25 Device Count (N) Device Count (N) 20 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=100mADC) 15 10 5 0 0 0.44 0.50 0.56 0.62 0.69 0.75 LED Current (mA) Typical Turn-Off Time (N=50, IL=100mADC) 25 Device Count (N) 30 Typical Turn-On Time (N=50, IL=100mADC) 0.14 0.17 0.19 0.22 0.25 Turn-Off Time (ms) 0.28 Typical On-Resistance Distribution (N=50, IL=100mADC) 15 10 5 0 0.44 0.81 0.50 0.56 0.62 0.69 LED Current (mA) 0.75 0.81 29.09 29.86 30.63 31.40 32.16 32.93 33.70 On-Resistance (:) Typical Blocking Voltage Distribution (N=50) Device Count (N) 25 20 15 10 5 0 424.0 429.3 434.5 439.7 444.9 450.1 455.4 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=100mADC) 1.7 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 1.1 1.0 -50 -25 0 25 50 Temperature (ºC) 75 100 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Turn-Off Time (ms) 1.8 Turn-On Time (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 Typical Turn-Off Time vs. LED Forward Current (IL=100mADC) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R06 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION XCA170 PERFORMANCE DATA* 1.8 IF=5mA 1.4 Turn-Off Time (ms) Turn-On Time (ms) 1.6 1.2 1.0 IF=10mA 0.8 IF=20mA 0.6 0.4 0.2 0 -40 -20 0 100 120 20 40 60 80 Temperature (ºC) 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 -40 6 5 5 4 3 2 1 60 -20 0 20 40 60 80 Temperature (ºC) 40 30 20 0 -20 0 20 40 60 80 Temperature (ºC) 100 120 -40 3 2 -40 120 100 80 60 40 20 0 -20 -40 -60 -80 -100 -120 -20 0 20 40 60 Temperature (ºC) 80 100 120 0.016 450 0.014 IF=10mA IF=5mA IF=2mA 60 40 445 440 435 430 20 425 0 -40 420 -20 0 20 40 60 80 Temperature (ºC) 100 Leakage (PA) Blocking Voltage (VP) 455 140 100 20 40 60 80 Temperature (ºC) 100 120 -3 -2 -1 0 1 Load Voltage (V) 2 3 4 0.012 0.010 0.008 0.006 0.004 0.002 -40 120 0 Typical Leakage vs. Temperature Measured Across Pins 4&6 160 80 -4 Typical Blocking Voltage vs. Temperature Maximum Load Current vs. Temperature 120 -20 Typical Load Current vs. Load Voltage (IF=2mA) Typical IF for Switch Dropout vs. Temperature (IL=100mADC) 4 100 120 50 10 0 -40 Load Current (mA) 70 1 0 Typical On-Resistance vs. Temperature (IF=2mA, IL=100mADC) Load Current (mA) 6 LED Current (mA) LED Current (mA) Typical IF for Switch Operation vs. Temperature (IL=100mADC) Typical Turn-Off Time vs. Temperature (IL=100mADC) On-Resistance (:) Typical Turn-On Time vs. Temperature (IL=100mADC) -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Load Current (A) Energy Rating Curve 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION XCA170 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification XCA170S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles XCA170S 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device XCA170 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R06 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION XCA170 Mechanical Dimensions XCA170 8.382±0.381 (0.330±0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54±0.127 (0.100±0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144±0.508 (0.360±0.020) 6.350±0.127 (0.250±0.005) 1.524 TYP (0.060 TYP) Pin 1 1.651±0.254 (0.065±0.010) 2.540±0.127 (0.100±0.005) 7.620±0.127 (0.300±0.005) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 5.080±0.127 (0.200±0.005) Controlling dimension: inches 3.302±0.051 (0.130±0.002) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457±0.076 (0.018±0.003) XCA170S 8.382±0.381 (0.330±0.015) 9.524±0.508 (0.375±0.020) Pin 1 0.635±0.127 (0.025±0.005) 2.54 (0.10) 6.350±0.127 (0.250±0.005) 0.457±0.076 (0.018±0.003) 1.651±0.254 (0.065±0.010) 7.620±0.254 (0.300±0.010) 0.254±0.0127 (0.010±0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302±0.051 (0.130±0.002) 4.445±0.254 (0.175±0.010) Controlling dimension: inches 1.524 TYP (0.060 TYP) 1.651±0.254 (0.065±0.010) 6 PCB Land Pattern 2.54±0.127 (0.100±0.005) Dimensions mm (inches) www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION XCA170 XCA170STR Tape & Reel P1 = 12.00 (0.472) 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) A0 = 10.10 (0.398) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 7 Specification: DS-XCA170-R06 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 12/23/2021