CPC1010N

CPC1010N 250V, 170mArms/mADC Single-Pole, Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 250 170 11.5 Units VP mArms / mADC  Features • 1500Vrms Input/Output Isolation • Small 4-Pin SOP Package • Low Drive Power Requirements • High Reliability • No EMI/RFI Generation • Tape & Reel Version Available • Flammability Rating UL 94 V-0 Description The CPC1010N is a miniature single-pole, normally open (1-Form-A) solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. The efficient MOSFET switches and photovoltaic die use IXYS Integrated Circuits Division’s patented OptoMOS architecture while the optically coupled output is controlled by a highly efficient infrared LED. IXYS Integrated Circuits Division’s state of the art double-molded vertical construction packaging makes the CPC1010N one of the world’s smallest relays. It offers board space savings over the competitor’s larger 4-pin SOP relay. Applications • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Security • Industrial Controls Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1172007 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # CPC1010N CPC1010NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) Pin Configuration + Control – Control 1 4 3 2 Load Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-CPC1010N-R03 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1010N Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 2 Ratings 250 5 50 1 70 400 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / ºC Derate output power linearly 3.33 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Input/Output Characteristics Capacitance, Input to Output 1 2 3 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 250 - - V t=10ms IL=170mA VL=250VP IL ILPK RON ILEAK - 8.5 - 170 ±350 11.5 1 mArms / mADC mAP  µA IF=0mA, VL=20V, f=1MHz ton toff COUT - 9 3 3 - IL=100mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 0.6 1.36 - 2 1.5 10 mA mA V µA 1 - pF IF=5mA, VL=10V CIO VIO=0V, f=1MHz Load current derates linearly from 170mA @ 25oC to 105mA @85oC. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 4mA is recommended. www.ixysic.com ms pF R03 INTEGRATED CIRCUITS DIVISION CPC1010N PERFORMANCE DATA* 200 0.45 1.7 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 1.1 1.0 150 Load Current (mA) LED Forward Current (mA) LED Forward Voltage Drop (V) 1.8 0.40 0.35 0.30 -25 0 25 50 Temperature (ºC) 75 100 50 0 -50 -100 -150 0.25 -50 100 -40 Typical Turn-On Time vs. LED Forward Current -20 0 20 40 60 Temperature (ºC) 80 100 -200 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 Load Voltage (V) 1.0 0.5 0.40 16 0.35 14 0.30 0.25 0.20 0.15 0.10 20 30 LED Current (mA) 40 50 0 3.5 0.50 3.0 0.45 2.5 IF=2mA 2.0 1.5 IF=5mA 1.0 0.5 IF=10mA 40 -40 50 0 20 40 60 Temperature (ºC) 80 0.40 0.35 0.30 0.25 0.20 -40 100 Typical Blocking Voltage vs. Temperature (IF=0mA) Leakage Current (nA) 280 270 0 20 40 60 Temperature (ºC) 80 -20 0 20 40 60 Temperature (ºC) 80 80 100 80 100 160 140 120 100 -40 100 14 290 -20 20 40 60 Temperature (ºC) 180 100 100 12 10 8 6 4 2 0 -40 -20 0 20 40 60 Temperature (ºC) Typical Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) Typical Leakage vs. Temperature (IF=0mA, VL=250V) 300 260 -40 0 200 IF=10mA IF=5mA IF=2mA Output Capacitance (pF) -20 -20 Maximum Load Current vs. Temperature 0.10 310 Blocking Voltage (VP) 20 30 LED Current (mA) 0.15 0.0 -40 IL=170mA 8 Typical Turn-Off Time vs. Temperature (VL=10V) Turn-Off Time (ms) Turn-On Time (ms) Typical Turn-On Time vs. Temperature (VL=10V) 10 Load Current (mA) 10 10 4 0.00 0 12 6 0.05 0.0 2.0 IL=20mA On-Resistance (:) Turn-Off Time (ms) 1.5 1.5 Typical On-Resistance vs. Temperature (IF=2mA) Typical Turn-Off Time vs. LED Forward Current 2.0 Turn-On Time (ms) Typical Load Current vs. Load Voltage (IF=2mA) Typical IF to Operate vs. Temperature (IL=100mA) Typical LED Forward Voltage Drop vs. Temperature 80 60 40 20 0 -20 0 20 40 60 Temperature (ºC) 80 100 0 50 100 150 Load Voltage (V) 200 250 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R03 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1010N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1010N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles CPC1010N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. 4 www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION CPC1010N MECHANICAL DIMENSIONS CPC1010N 4.089 ± 0.025 (0.161 ± 0.001) Recommended PCB Land Pattern 0.203 ± 0.025 (0.008 ± 0.001) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.025 (0.150 ± 0.001) 0.559 ± 0.127 (0.022 ± 0.005) 0.910 ± 0.025 (0.036 ± 0.001) Pin 1 2.54 Typ (0.100 Typ) 3.85 (0.152) 1.54 (0.061) 2.030± 0.025 (0.080± 0.001) 2.54 (0.10) Dimensions mm (inches) Package standoff: 0.051 ± 0.051 (0.0020 ± 0.0020) 0.481 (0.019) 0-0.1 (0-0.004) 0.60 (0.024) Note: 1. Lead dimensions do not include plating: 1000 microinches max. 2. Controlling dimension: mm 0.381 ± 0.025 (0.015 ± 0.001) CPC1010NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) A0=6.50 (0.256) P1=8.00 (0.315) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 5 Specification: DS-CPC1010N-R03 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 8/5/2021