CPC1030N

CPC1030N 350V, 120mArms/mADC Single-Pole Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 350 120 30 Units VP mArms / mADC  Features • 1500Vrms Input/Output Isolation • Small 4-Pin SOP Package • Low Drive Power Requirements • High Reliability • No EMI/RFI Generation • Tape & Reel Version Available • Flammability Rating UL 94 V-0 Description The CPC1030N is a miniature single-pole, normally-open (1-Form-A) solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. The efficient MOSFET switches and photovoltaic die use IXYS Integrated Circuits Division’s patented OptoMOS architecture while the optically coupled output is controlled by a highly efficient infrared LED. IXYS Integrated Circuits Division’s state of the art double-molded vertical construction packaging makes the CPC1030N one of the world’s smallest relays. It offers board space savings of at least 20% over the competitor’s larger 4-pin SOP relay. Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Security • Industrial Controls Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1172007 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # CPC1030N CPC1030NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) Pin Configuration + Control – Control 1 4 3 2 Load Load Switching Characteristics of Normally-Open Devices Form-A IF 90% 10% ILOAD ton DS-CPC1030N-R18 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1030N Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 2 Ratings 350 5 50 1 70 400 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / ºC Derate output power linearly 3.33 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Input/Output Characteristics Capacitance Input to Output 1 2 3 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 350 - - V t=10ms IL=120mA VL=350VP IL ILPK RON ILEAK - 19.5 - 120 ±350 30 1 mArms / mADC mAP  µA IF=0mA, VL=50V, f=1MHz ton toff COUT - 9 2 1 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.3 0.9 - 0.6 1.36 - 2 1.5 10 mA mA V µA 1 - pF IF=5mA, VL=10V VIO=1V, f=1MHz CIO Load current derates linearly from 120mA @ 25oC to 60mA @85oC. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 4mA is recommended. www.ixysic.com ms pF R18 INTEGRATED CIRCUITS DIVISION CPC1030N PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 30 Typical IF for Switch Operation (N=50, IL=120) 15 25 15 10 Device Count (N) Device Count (N) Device Count (N) 25 20 10 5 0 0.3 Typical Turn-On Time Distribution (N=50, IF=5mA, IL=60mA) 10 10 5 0.5 0.6 0.7 LED Current (mA) 0.8 18.75 19.00 19.25 19.50 19.75 20.00 20.25 On Resistance (:) 0.9 Typical Blocking Voltage Distribution (N=50, IF=0mA) 25 20 Device Count (N) 15 0.4 Typical Turn-Off Time Distribution (N=50, IF=5mA, IL=60mA) 25 Device Count (N) Device Count (N) 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) 15 10 600 650 700 750 800 Turn-On Time (Ps) 850 340 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 360 370 380 Turn-Off Time (Ps) 390 1.1 416 150 0.75 0.70 0.65 0.60 0.55 0.50 -25 0 25 50 Temperature (ºC) 75 100 -40 30 20 10 -20 0 20 40 60 Temperature (ºC) 80 50 0 -50 -3 3500 370 3000 360 2500 2000 1500 1000 -2 -1 0 1 Load Voltage (V) 2 3 Typical Turn-Off Time vs. LED Forward Current (IL=60mA) 350 340 330 320 310 500 0 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 Forward Voltage (V) 100 100 Turn-Off Time (Ps) Turn-On Time (Ps) 40 Typical Load Current vs. Load Voltage (IF=2mA) Typical Turn-On Time vs. LED Forward Current (IL=60mA) LED Forward Voltage vs. LED Forward Current 50 431 -150 0.40 -50 419 422 425 428 Blocking Voltage (VP) -100 0.45 1.0 10 400 Load Current (mA) 0.80 LED Current (mA) 0.85 1.6 350 Typical IF for Switch Operation vs. Temperature (IL=60mA) Typical LED Forward Voltage Drop vs. Temperature 1.7 15 0 900 1.8 20 5 5 0 0 LED Forward Voltage Drop (V) 15 0 0 1.364 Forward Current (mA) 20 5 5 20 Typical On-Resistance Distribution (N=50, IF=5mA, IL=120mA) 300 0 0 10 20 30 LED Current (mA) 40 50 0 10 20 30 40 LED Forward Current (mA) 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R18 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1030N PERFORMANCE DATA* Typical On-Resistance vs. Temperature (IF=2mA, IL=60mA) 35 Typical Turn-On Time vs. Temperature (IL=60mA) 2500 550 25 20 500 Turn-Off Time (Ps) Turn-On Time (Ps) On-Resistance (:) IF=2mA 30 2000 1500 Typical Turn-Off Time vs. Temperature (IL=60mA) IF=5mA 1000 450 400 IF=5mA 350 IF=2mA 300 250 200 500 -40 15 -40 -20 0 20 40 60 Temperature (ºC) 80 100 140 460 120 450 100 80 60 40 20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 80 Temperature (ºC) 100 120 430 420 410 80 100 20 15 10 5 400 0 -40 -20 0 20 40 60 Temperature (ºC) 40 30 20 10 0 100 150 200 250 Load Voltage (V) 300 350 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve Load Current (A) Output Capacitance (pF) 20 40 60 Temperature (ºC) 25 50 50 0 30 440 Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) 0 -20 Typical Leakage vs. Temperature Measured Across Pins 3&4 (IF=0mA, VL=350V) Typical Blocking Voltage vs. Temperature (IF=0mA) 390 0 -40 Leakage (nA) Blocking Voltage (VP) Load Current (mA) Maximum Load Current vs. Temperature (IF=4mA) 150 -20 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10μs 100μs 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R18 INTEGRATED CIRCUITS DIVISION CPC1030N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1030N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles CPC1030N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R18 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1030N MECHANICAL DIMENSIONS CPC1030N 4.089 ± 0.025 (0.161 ± 0.001) Recommended PCB Land Pattern 0.203 ± 0.025 (0.008 ± 0.001) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.025 (0.150 ± 0.001) 0.559 ± 0.127 (0.022 ± 0.005) 0.910 ± 0.025 (0.036 ± 0.001) Pin 1 2.54 Typ (0.100 Typ) 3.85 (0.152) 1.54 (0.061) 2.030± 0.025 (0.080± 0.001) 2.54 (0.10) Dimensions mm (inches) Package standoff: 0.051 ± 0.051 (0.0020 ± 0.0020) 0.481 (0.019) 0-0.1 (0-0.004) 0.60 (0.024) Note: 1. Lead dimensions do not include plating: 1000 microinches max. 2. Controlling dimension: mm 0.381 ± 0.025 (0.015 ± 0.001) CPC1030NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) A0=6.50 (0.256) P1=8.00 (0.315) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 6 Specification: DS-CPC1030N-R18 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits Division 8/5/2021