CPC1035N

CPC1035N 350V, 100mArms/mADC Single-Pole Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 350 100 35 Units VP mArms / mADC  Features • 1500Vrms Input/Output Isolation • Small 4-Pin SOP Package • Low Drive Power Requirements • High Reliability • No EMI/RFI Generation • Halogen-Free • Flammability Rating UL 94 V-0 • Tape & Reel Version Available Description The CPC1035N is a miniature normally-open, single-pole, (1-Form-A) solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. The efficient MOSFET switches and photovoltaic die use IXYS Integrated Circuits Division’s patented OptoMOS architecture while the optically coupled output is controlled by a highly efficient infrared LED. IXYS Integrated Circuits Division’s state of the art double-molded vertical construction packaging makes the CPC1035N one of the world’s smallest relays. It offers board space savings of at least 20% over the competitor’s larger 4-pin SOP relay. Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Security • Industrial Controls Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1172007 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # CPC1035N CPC1035NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) * For other packaging options consult factory. Pin Configuration + Control – Control 1 4 3 2 Load Load Switching Characteristics of Normally-Open Devices Form-A IF 90% 10% ILOAD ton DS-CPC1035N-R17 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1035N Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 3.33 mW / ºC Ratings 350 5 50 1 70 400 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Input to Output Characteristics Capacitance, Input to Output 1 2 3 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 350 - - V t=10ms IL=100mA VL=350VP IL ILPK RON ILEAK - 30 - 100 ±350 35 1 mArms / mADC mAP  µA IF=0mA, VL=50V, f=1MHz ton toff COUT - 9 2 1 - IL=100mA IF=5mA VR=5V IF IF VF IR 0.3 0.9 - 0.8 0.7 1.36 - 2 1.5 10 mA mA V µA 0.7 1.45 pF IF=5mA, VL=10V CIO VIO=0V, f=1MHz Load current derates linearly from 100mA @ 25oC to 70mA @85oC. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 4mA is recommended. www.ixysic.com ms pF R17 INTEGRATED CIRCUITS DIVISION CPC1035N PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) 20 15 10 5 1.364 10 5 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical On-Resistance Distribution (N=50, IF=2mA, IL=100mA) 20 15 10 5 0.60 0.65 0.70 0.75 0.80 LED Current (mA) 26 27 28 29 30 On-Resistance (:) 31 5 15 10 5 0.60 0.65 0.70 0.75 0.80 LED Current (mA) 0.85 Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) 25 20 20 15 10 5 0 0.50 32 10 0.55 0 0 15 0.85 Typical Turn-On Time (N=50, IF=5mA, IL=100mA) 25 Device Count (N) 25 20 0 0.55 30 Device Count (N) 15 0 0 35 20 Device Count (N) Device Count (N) 25 Typical IF for Switch Dropout (N=50, IL=100mA) 25 Device Count (N) 30 Typical IF for Switch Operation (N=50, IL=100mA) 0.60 0.70 0.80 0.90 1.00 Turn-On Time (ms) 0.21 1.10 0.22 0.23 0.24 0.25 0.26 0.27 Turn-Off Time (ms) Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 377.5 388.5 399.5 410.5 421.5 432.5 443.5 Blocking Voltage (VP) 3.0 1.8 1.7 Typical IF for Switch Operation vs. Temperature (IL=50mA) 2.5 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 LED Current (mA) 1.6 2.0 1.5 1.0 -50 -25 0 25 50 Temperature (ºC) 75 100 1.5 1.0 0 0 1.0 2.0 0.5 0.5 1.1 Typical IF for Switch Dropout vs. Temperature (IL=50mA) 3.0 2.5 LED Current (mA) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature -40 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 80 100 Temperature (ºC) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R17 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1035N PERFORMANCE DATA* 50 0 -50 -100 -150 -3 -1 0 1 2 30 20 10 0 -40 -20 0 20 40 60 80 5 45 0.4 0 I F = 10mA -20 0 20 40 60 10 15 20 25 30 35 40 50 45 80 Typical Turn-Off Time vs. Temperature (IL=50mA) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 100 I F = 10mA I F = 5mA -20 -40 0 20 40 60 80 100 Temperature (ºC) Temperature (ºC) Temperature (ºC) Typical Maximum Load Current vs. Temperature Typical Blocking Voltage vs. Temperature Typical Leakage vs. Temperature Measured Across Pins 3&4 (VL=350V) 0.016 425 0.014 420 0.012 140 120 100 I F =10mA 80 60 I F =5mA 40 20 0 Leakage (µA) 430 160 Blocking Voltage (VP) 180 415 410 405 0.010 0.008 0.006 0.004 400 0.002 395 -40 5 LED Forward Current (mA) I F = 5mA -40 100 0.6 0 Typical Turn-On Time vs. Temperature (IL=50mA) 40 0.8 50 Typical On-Resistance vs. Temperature (IF=10mA, IL=50mA) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 1.0 0.2 10 15 20 25 30 35 40 LED Forward Current (mA) Turn-On Time (ms) On-Resistance (:) 1.2 0 3 Typical Turn-Off Time vs. LED Forward Current (IL=100mA) 1.4 Load Voltage (V) 50 Load Current (mA) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Turn-Off Time (ms) 60 -2 Typical Turn-On Time vs. LED Forward Current (IL=100mA) Turn-Off Time (ms) 100 Turn-On Time (ms) Load Current (mA) 150 Typical Load Current vs. Load Voltage (IF=5mA) -20 0 20 40 60 80 100 120 -40 -20 Temperature (ºC) 0 20 40 60 Temperature (ºC) Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) Load Current (A) Output Capacitance (pF) 30 20 10 0 0 50 100 150 200 250 Load Voltage (V) 300 350 0 -40 100 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve 50 40 80 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R17 INTEGRATED CIRCUITS DIVISION CPC1035N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1035N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles CPC1035N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R17 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1035N MECHANICAL DIMENSIONS CPC1035N 4.089 ± 0.025 (0.161 ± 0.001) Recommended PCB Land Pattern 0.203 ± 0.025 (0.008 ± 0.001) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.025 (0.150 ± 0.001) 0.559 ± 0.127 (0.022 ± 0.005) 0.910 ± 0.025 (0.036 ± 0.001) Pin 1 2.54 Typ (0.100 Typ) Package standoff: 0.051 ± 0.051 (0.0020 ± 0.0020) 0.381 ± 0.025 (0.015 ± 0.001) 3.85 (0.152) 1.54 (0.061) 2.030± 0.025 (0.080± 0.001) 0.481 (0.019) 0-0.1 (0-0.004) 0.60 (0.024) 2.54 (0.10) Dimensions mm (inches) Note: 1. Lead dimensions do not include plating: 1000 microinches max. 2. Controlling dimension: mm CPC1035N device weight = 0.075 grams CPC1035NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) A0=6.50 (0.256) P1=8.00 (0.315) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 6 Specification: DS-CPC1035N-R17 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 8/5/2021