CPC1130NTR

CPC1130N 350V, 120mArms/mADC Single-Pole Normally Closed Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 350 120 30 Units VP mArms / mADC  Features • 1500Vrms Input/Output Isolation • Low Drive Power Requirements • High Reliability • No EMI/RFI Generation • Small 4-Pin SOP Package • Tape & Reel Version Available • Flammability Rating UL 94 V-0 Description The CPC1130N is a miniature normally-closed, single-pole (1-Form-B) solid state relay that uses optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. The efficient MOSFET switches and photovoltaic die use IXYS Integrated Circuits' patented OptoMOS® architecture while the optically coupled output is controlled by a highly efficient infrared LED. The CPC1130N offers board space savings of at least 20% when compared to competitive 4-pin SOP solid state relays. Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Industrial Controls Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1172007 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # CPC1130N CPC1130NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) Pin Configuration + Control – Control 1 4 3 2 Load Load Switching Characteristics of Normally-Closed Devices Form-B IF ILOAD 10% toff DS-CPC1130N-R09 www.ixysic.com 90% ton 1 INTEGRATED CIRCUITS DIVISION CPC1130N Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 3.33 mW / ºC Ratings 350 5 50 1 150 400 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 3 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 350 - - V t =10ms IL=120mA IF=2mA, VL=350VP IL ILPK RON ILEAK - 25 - 120 ±350 30 5 mArms / mADC mAP  µA IF=2mA, VL=50V, f=1MHz ton toff COUT - 25 2 2 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.3 0.9 - 0.6 0.55 1.36 - 2 1.5 10 mA mA V µA 1 - pF IF=5mA, VL=10V CIO VIO=0V, f=1MHz Load current derates linearly from 120mA @ 25oC to 80mA @ 85oC. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60°C) a minimum LED drive current of 4mA is recomended. www.ixysic.com ms pF R09 INTEGRATED CIRCUITS DIVISION CPC1130N PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) 20 15 10 5 1.364 10 5 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical On-Resistance Distribution (N=50, IL=120mA) 20 15 10 5 0.50 0.55 0.60 0.65 LED Current (mA) 0.70 23.5 24 24.5 25 25.5 On-Resistance (:) 26 5 15 10 5 0.50 0.55 0.60 0.65 0.70 LED Current (mA) 0.75 Typical Turn-Off Time (N=50, IF=5mA, IL=120mA) 25 20 20 15 10 5 0 0.21 26.5 10 0.45 0 0 15 0.75 Typical Turn-On Time (N=50, IF=5mA, IL=120mA) 25 Device Count (N) 25 20 0 0.45 30 Device Count (N) 15 0 0 35 20 Device Count (N) Device Count (N) 25 Typical IF for Switch Dropout (N=50, IL=120mA) 25 Device Count (N) 30 Typical IF for Switch Operation (N=50, IL=120mA) 0.22 0.23 0.24 0.25 0.26 Turn-On Time (ms) 0.50 0.27 0.60 0.70 0.80 0.90 1.00 Turn-Off Time (ms) 1.10 Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 395 425 150 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 Load Current (mA) 2.5 LED Current (mA) LED Forward Voltage Drop (V) 3.0 1.7 405 410 415 420 Blocking Voltage (VP) Typical IF for Switch Operation vs. Temperature (IL=50mA) Typical LED Forward Voltage Drop vs. Temperature 1.8 400 2.0 1.5 1.0 -50 -25 0 25 50 Temperature (ºC) 75 100 50 0 -50 -150 0 1.0 100 -100 0.5 1.1 Typical Load Current vs. Load Voltage (IF=5mA) -40 -20 0 20 40 60 Temperature (ºC) 80 100 -6 -4 -2 0 2 4 6 Load Voltage (V) *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R09 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1130N PERFORMANCE DATA* 0.7 Turn-Off Time (ms) 0.5 0.4 0.3 0.2 0.1 0 15 20 25 30 35 40 45 50 35 30 25 20 15 10 0 5 10 15 20 25 30 35 40 45 50 -40 -20 0 20 40 60 80 100 LED Forward Current (mA) LED Forward Current (mA) Temperature (ºC) Typical Turn-On Time vs. Temperature (IL=50mA) Typical Turn-Off Time vs. Temperature (IL=50mA) Maximum Load Current vs. Temperature (IF=0mA, IL=AC Peak) IF=10mA IF=5mA -40 -20 0 20 40 60 80 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 IF=5mA -20 0 20 40 60 80 Temperature (ºC) Typical Blocking Voltage vs. Temperature Typical Leakage vs. Temperature Measured Across Pins 3&4 (IF=5mA, VL=350V) 425 0.016 420 0.014 415 410 405 400 -40 -20 0 20 40 60 Temperature (ºC) 80 100 0.012 0.010 0.008 0.006 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 80 60 40 -40 -20 0 20 40 60 80 Temperature (ºC) 100 120 Energy Rating Curve 0.002 390 120 0 100 0.004 395 140 20 IF=10mA -40 100 180 160 Temperature (ºC) Leakage (PA) Blocking Voltage (VP) 10 40 Load Current (mA) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 5 Turn-Off Time (ms) Turn-On Time (ms) 0 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Typical On-Resistance vs. Temperature (IF=5mA, IL=120mA) Load Current (A) Turn-On Time (ms) 0.6 Typical Turn-Off Time vs. LED Forward Current (IL=120mA) On-Resistance (:) Typical Turn-On Time vs. LED Forward Current (IL=120mA) 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10μs 100μs 1ms 10ms 100ms 1s 10s 100s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION CPC1130N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1130N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles CPC1130N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R09 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1130N MECHANICAL DIMENSIONS CPC1130N 4.089 ± 0.025 (0.161 ± 0.001) Recommended PCB Land Pattern 0.203 ± 0.025 (0.008 ± 0.001) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.025 (0.150 ± 0.001) 0.559 ± 0.127 (0.022 ± 0.005) 0.910 ± 0.025 (0.036 ± 0.001) Pin 1 2.54 Typ (0.100 Typ) 2.030± 0.025 (0.080± 0.001) 0.481 (0.019) 0-0.1 (0-0.004) 0.60 (0.024) 3.85 (0.152) 1.54 (0.061) 2.54 (0.10) Dimensions mm (inches) Package standoff: 0.051 ± 0.051 (0.0020 ± 0.0020) Note: 1. Lead dimensions do not include plating: 1000 microinches max. 2. Controlling dimension: mm 0.381 ± 0.025 (0.015 ± 0.001) CPC1130NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) P1=8.00 (0.315) A0=6.50 (0.256) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. Specification: DS-CPC1130N-R09 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 8/5/2021 6