CPC1317PTR

CPC1317 Single-Pole OptoMOS® Relay with Bidirectional Transient Protection INTEGRATED CIRCUITS DIVISION Parameter Load Voltage, AC/DC Load Current On-Resistance (max) LED Current to Operate Rating 70 150 16 1 Units VP mArms / mADC  mA Transient Protection Characteristics Peak Pulse Power 600W Features • Meets Requirements of EN50130-4 (Installation Class 3) • 3750Vrms Input/Output Isolation • 100% Solid State • Low Drive Power Requirements • High Reliability • No EMI/RFI Generation • Flammability Rating UL 94 V-0 Applications • • • • • • • • Security Sensor Circuitry Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Industrial Controls VWM 40.2V Description The CPC1317 is a single-pole, normally open (1-Form-A) solid state relay with bi-directional transient voltage suppressor (TVS) relay protection, which is designed to meet the requirements of EN50130-4 (installation class 3). The relay output is constructed with efficient MOSFET switches and photovoltaic die that use IXYS Integrated Circuits Division's patented OptoMOS architecture. The input, a highly efficient infrared LED, controls the optically coupled output. The CPC1317 is available in a space-saving 8-pin SOIC package. Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1172007 • EN/IEC 62368-1 Certified Component: TUV Certificate B 082667 0008 Ordering Information Part # CPC1317P CPC1317PTR Description 8-Pin SOIC (Flatpack) (50/tube) 8-Pin SOIC (Flatpack) (1000/reel) Pin Configuration + Control – Control 1 8 2 7 3 6 4 5 TVS +/TVS -/+ Load Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-CPC1317-R06 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1317 Absolute Maximum Ratings @ 25ºC Parameter SSR Output Blocking Voltage TVS Working Voltage, Maximum Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 SSR Output Power Dissipation 2 TVS Peak Pulse Power (IPP=9.3A, 10/1000s pulse) Isolation Voltage, Input to Output Operating Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output linearly 6.67 mW / ºC Ratings 70 40.2 5 50 1 150 400 600 Units VP V V mA A mW mW W 3750 -40 to +85 -40 to +125 Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. TVS Electrical Characteristics Parameter Clamping Voltage Reverse Breakdown Voltage Reverse Leakage Current Conditions IPP=9.3A I=1mA VWM=40.2V Symbol VC VBR IL Min 44.4 - Typ - Max 66.5 5 Units V V A SSR Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current, AC/DC Continuous Peak On-Resistance 1 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 2 Input Dropout Current to Deactivate Input Voltage Drop Common Characteristics Capacitance, Input to Output 1 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 70 - - VP t=10ms IL=150mA, IF=1mA VL=70VP IL ILPK RON ILEAK - 7 - 150 ±400 16 1 mArms / mADC mAP  µA IF=5mA, VL=10V IF=0mAVL=50V, f=1MHz ton toff COUT - 25 2.5 2.5 - IL=150mA IF=5mA IF IF VF 0.1 0.9 1.2 1 1.4 mA mA V 3 - pF (See Timing Diagram) CIO VIO=0V, f=1MHz Measurement taken within 1 second of turn-on time. For applications requiring high temperature operation (> 60oC) a minimum LED drive current of 3mA is recommended. ms pF Timing Diagram IF 0 mA IL 0 mA 90% 2 ton 10% toff www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC1317 PERFORMANCE DATA* Typical Turn-On Time (N=50, IF=5mA, IL=100mA) 25 20 Device Count (N) Device Count (N) 20 15 10 5 15 10 5 0 0 75 80 85 90 95 Turn-On Time (Ps) 100 0.35 0.40 0.45 0.50 0.55 0.60 Turn-Off Time (ms) 6.9 7.0 7.1 7.2 On-Resistance (:) 7.3 7.4 Typical Blocking Voltage Distribution (N=50) 35 25 30 25 20 15 10 20 Device Count (N) Device Count (N) 15 10 5 0 1.6 1.4 1.3 IF=5mA IF=2mA IF=1mA 1.1 1.0 -40 -20 0.16 0.18 0.20 LED Current (mA) 0 0.22 84 80 1000 480 800 600 400 5 10 15 LED Forward Current (mA) Turn-On Time (Ps) 0.20 0 20 40 60 Temperature (ºC) 0 80 100 IF=1mA 20 700 400 300 200 IF=5mA 0 -40 5 10 15 LED Forward Current (mA) Turn-Off Time vs. Temperature 100 -20 465 800 500 0.15 -40 470 Turn-On Time vs. Temperature 0.25 90 475 20 600 0.30 86 87 88 89 Blocking Voltage (VP) 460 0 100 85 Typical Turn-Off Time vs. LED Forward Current 0 20 40 60 Temperature (ºC) 10 485 LED Current to Operate vs. Temperature (IL=100mA) 0.35 0.14 200 0 15 1200 Turn-On Time (Ps) IF=50mA IF=20mA IF=10mA 1.5 20 Typical Turn-On Time vs. LED Forward Current LED Forward Voltage vs. Temperature 1.2 0.12 1.22 1.23 1.24 1.25 LED Forward Voltage Drop (V) Turn-Off Time (Ps) 1.21 25 5 0 Turn-Off Time (Ps) Device Count (N) 5 6.8 Typical IF for Switch Operation (N=50, IL=100mA) 5 LED Forward Voltage (V) 10 0.65 30 LED Current (mA) 15 0 105 Typical LED Forward Voltage Drop (N=50, IF=5mA) 35 Typical On-Resistance Distribution (N=50, IL=100mA) 20 Device Count (N) 25 Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) IF=5mA 600 500 400 IF=1mA 300 -20 0 20 40 60 Temperature (ºC) 80 100 200 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R06 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1317 PERFORMANCE DATA* 155 0.15 150 Load Current (mA) 10 9 8 7 145 140 135 130 6 125 5 -40 120 -20 0 20 40 60 Temperature (ºC) 80 0.00 -0.05 -0.10 0 20 40 60 Temperature (ºC) 80 100 -0.20 -1.5 1000 92 10 800 88 86 84 -40 Load Current (mA) 12 90 8 6 0 20 40 60 Temperature (ºC) 80 4 2 -40 100 TVS Diode Breakdown Voltage vs. Temperature (Pins 7 & 8) 52 25 Leakage Current (nA) 51 50 49 48 47 46 45 -40 -20 0 20 40 60 Temperature (ºC) 80 0 20 40 60 Temperature (ºC) 80 1.0 1.5 400 200 0 10Ps 100Ps 1ms 10ms 100ms Time 100 TVS Diode Leakage vs. Temperature (Pins 7 & 8) (VL=40V) 1s 10s 100s 80 100 TVS Derating Curve 120 100 20 15 10 5 0 -40 100 -20 -0.5 0.0 0.5 Load Voltage (V) 600 0 -20 -1.0 Energy Rating Curve 94 Leakage Current (PA) Blocking Voltage (VP) -20 Leakage Current vs. Temperature Measured Between Pins 5 & 6 (VL=70V) Blocking Voltage vs. Temperature (Pins 5 & 6) TVS Breakdown Voltage (V) 0.05 -0.15 -40 100 0.10 Peak Pulse Power (% PPP @ 25ºC) On-Resistance (:) 11 Typical Load Current vs. Load Voltage (IF=1mA) 0.20 Load Current (A) 12 Maximum Load Current vs. Temperature (IF=1mA) On-Resistance vs. Temperature (IF=1mA, IL=50mA) -20 0 20 40 60 Temperature (ºC) 80 100 80 60 40 20 0 -40 -20 0 20 40 60 Temperature (ºC) PPP - Peak Pulse Current (% IPP) TVS Pulse Waveform 10/1000 (Ps) 110 100 90 80 70 60 50 40 30 20 10 0 1 10 100 1000 104 Time (Ps) 105 106 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC1317 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1317P MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles CPC1317P 245ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R06 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1317 MECHANICAL DIMENSIONS CPC1317P 2.286 MAX. (0.090 MAX.) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 2.54 (0.10) 7.620 ± 0.254 (0.300 ± 0.010) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 PCB Land Pattern 0.635 ± 0.127 (0.025 ± 0.005) 0.203 ± 0.013 (0.008 ± 0.0005) 9.652 ± 0.381 (0.380 ± 0.015) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) Dimensions mm (inches) CPC1317PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.50 (0.295) Embossment W = 16.00 (0.63) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 6 Specification: DS-CPC1317-R06 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 5/4/2021