CPC1335PTR

CPC1335 Single Pole OptoMOS® Relay with Bi-directional Transient Protection INTEGRATED CIRCUITS DIVISION Parameters Load Voltage, AC/DC Load Current On-Resistance (max) LED Current to Operate Ratings 350 Units VP 100 35 1 mArms / mADC  mA Transient Protection Characteristics Peak Pulse Power 600W Features • Meets Requirements of EN50130-4 (Installation Class 3) • 3750Vrms Input/Output Isolation • 100% Solid State • Low Drive Power Requirements • High Reliability • No EMI/RFI Generation • Flammability Rating UL 94 V-0 VWM 40.2V Description The CPC1335 is a single-pole, normally open (1-Form-A) solid state relay with bi-directional transient voltage suppressor (TVS) relay protection, which is designed to meet the requirements of EN50130-4 (installation class 3). The relay output is constructed with efficient MOSFET switches that use IXYS Integrated Circuits' patented OptoMOS architecture. The input, a highly efficient infrared LED, controls the optically coupled output. The CPC1335 is available in a space-saving 8-pin SOIC package. Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1172007 • EN/IEC 62368-1 Certified Component: TUV Certificate B 082667 0008 Applications Ordering Information • • • • • • • • Part # CPC1335P CPC1335PTR Security Sensor Circuitry Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Industrial Controls Description 8-Pin SOIC (Flatpack) (50/Tube) 8-Pin SOIC (Flatpack) (1000/Reel) Pin Configuration + Control – Control 1 8 2 7 3 6 4 5 TVS +/TVS -/+ Load Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-CPC1335-R09 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1335 Absolute Maximum Ratings @ 25ºC Parameter SSR Output Blocking Voltage TVS Working Voltage, Maximum (VWM) Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 SSR Output Power Dissipation 2 TVS Peak Pulse Power (PPP) (IPP=9.3A, 10/1000s pulse) Isolation Voltage, Input to Output Operating Temperature, Ambient Storage Temperature 1 Ratings 350 40.2 5 50 1 150 400 600 Units VP V V mA A mW mW W 3750 -40 to +85 -40 to +125 Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / ºC Derate output linearly 6.67 mW / ºC 2 Electrical Characteristics: TVS Parameters Output Characteristics @ 25°C Clamping Voltage Reverse Breakdown Voltage Reverse Leakage Current Conditions Symbol Min Typ Max Units IPP=9.3A I=1mA VWM=40.2V VC VBR IL 44.4 - - 66.5 5 V V A Electrical Characteristics @ 25ºC Parameters Output Characteristics Blocking Voltage Load Current, AC/DC Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 3 Conditions Symbol Min Typ Max Units IL=1A VDRM 350 - - VP IF=2mA t=10ms IL=100mA VL=350VP IL ILPK RON ILEAK - 25 - 100 ±350 35 1 mArms / mADC mAP  A IF=2mA, VL=10V IF=0V, VL=50V, f=1MHz ton toff COUT - 40 10 10 - IL=100mA IF=5mA VR=5V IF VF IR 0.9 - 1.2 - 1 1.4 10 mA V A 3 - pF (See Timing Diagram) VIO=0V, f=1MHz CIO Load current derates linearly from 100mA @ 25ºC to 70ma @ 85ºC Measurement taken within 1 second of on-time For applications requiring high temperature operation (greater than 60ºC) a minimum LED drive current of 3mA is recommended. ms pF Timing Diagram IF 0 mA 90% IL 2 10% 0 mA ton toff www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION CPC1335 PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) Device Count (N) 25 20 15 10 5 20 20 15 10 5 1.19 1.21 1.23 1.25 LED Forward Voltage Drop (V) 0.50 Device Count (N) 20 15 10 5 0 0.26 1.10 35 30 30 25 20 15 10 0.40 0.45 0.50 0.55 LED Current (mA) IF=50mA 1.2 IF=10mA IF=5mA 1.0 27 28 29 30 On-Resistance (:) 31 0.28 20 40 60 80 Temperature (ºC) 100 3500 476 3000 474 2500 2000 1500 1000 120 Turn-On Time (Ps) 0.12 0.08 -40 0 20 40 60 Temperature (ºC) 80 100 470 468 466 10 20 30 40 LED Forward Current (mA) 50 Typical Turn-Off Time vs. Temperature (VL=10V) 1.0 0.9 IF=1mA 2.0 1.5 IF=2mA 1.0 0.0 -40 0 Typical Turn-On Time vs. Temperature (VL=10V) IF=5mA 0.5 -20 443 472 50 2.5 0.16 399 410 421 432 Blocking Voltage (VP) 462 10 20 30 40 LED Forward Current (mA) 3.0 0.20 388 464 0 Typical LED Current to Operate vs. Temperature (IL=70mA) 0.24 10 Typical Turn-Off Time vs. LED Forward Current 0 0 15 Turn-On Time vs. LED Forward Current 0.8 -20 20 377 500 -40 25 32 Turn-Off Time (Ps) 1.4 0.38 0 26 Turn-On Time (Ps) 1.6 0.30 0.32 0.34 0.36 Turn-Off Time (ms) 5 0.60 1.8 0.28 Typical Blocking Voltage Distribution (N=50) 0 0.35 5 35 Typical LED Forward Voltage Drop vs. Temperature LED Forward Voltage Drop (V) 0.70 0.80 0.90 1.00 Turn-On Time (ms) 5 0.30 10 Typical On-Resistance Distribution (N=50, IL=120mA) Typical IF for Switch Operation (N=50, IL=100mA) 25 0.60 Device Count (N) 1.17 15 0 0 0 Device Count (N) 25 Turn-Off Time (ms) Device Count (N) 30 25 Device Count (N) 35 LED Current (mA) Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) Typical Turn-On Time (N=50, IF=5mA, IL=100mA) 0.8 IF=1mA 0.7 0.6 IF=2mA 0.5 IF=5mA 0.4 0.3 -20 0 20 40 60 Temperature (ºC) 80 100 0.2 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R09 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1335 PERFORMANCE DATA* Typical On-Resistance vs. Temperature (IF=3mA, IL=50mA) 150 40 30 20 10 160 50 0 -50 120 100 80 -20 0 20 40 60 Temperature (ºC) 80 100 40 0 425 0.014 415 410 405 -1 0 1 Load Voltage (V) 2 0.010 0.008 0.006 0 20 40 60 80 0 -40 100 -20 0 Temperature (ºC) TVS Diode Breakdown Voltage vs. Temperature (Pins 7 & 8) 52 25 Leakage Current (nA) 51 50 49 48 47 46 45 -40 -20 0 20 40 60 Temperature (ºC) 80 80 100 40 60 80 100 120 1s 10s 100s Time TVS Diode Leakage vs. Temperature (Pins 7 & 8) (VL=40V) TVS Derating Curve 120 100 20 15 10 5 0 -40 100 20 40 60 Temperature (ºC) Peak Pulse Power (% PPP @ 25ºC) -20 20 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms 0.002 -40 0 Energy Rating Curve 0.012 395 -20 Temperature (ºC) 0.004 400 -40 3 Load Current (A) Leakage (PA) 420 -2 Typical Leakage vs. Temperature Measured Across Pins 5 & 6 (VL=350V) Typical Blocking Voltage vs. Temperature 0.016 I F = 2mA 20 -3 430 I F = 5mA 60 -150 -40 Blocking Voltage (VP) 140 -100 0 TVS Breakdown Voltage (V) 180 100 Load Current (mA) On-Resistance (:) 50 Maximum Load Current vs. Temperature Load Current (mA) 60 Typical Load Current vs. Load Voltage (IF=5mA) -20 0 20 40 60 Temperature (ºC) 80 100 80 60 40 20 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 PPP - Peak Pulse Current (% IPP) TVS Pulse Waveform 10/1000 (Ps) 110 100 90 80 70 60 50 40 30 20 10 0 1 10 102 104 103 Time (Ps) 105 106 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION CPC1335 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1335P MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles CPC1335P 245ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R09 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1335 MECHANICAL DIMENSIONS CPC1335P 2.286 MAX. (0.090 MAX.) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 2.54 (0.10) 7.620 ± 0.254 (0.300 ± 0.010) 9.398 ± 0.127 (0.370 ± 0.005) Pin 1 PCB Land Pattern 0.635 ± 0.127 (0.025 ± 0.005) 0.203 ± 0.013 (0.008 ± 0.0005) 9.652 ± 0.381 (0.380 ± 0.015) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 ± 0.025 (0.085 ± 0.001) 0.457 ± 0.076 (0.018 ± 0.003) 0.864 ± 0.120 (0.034 ± 0.004) Dimensions mm (inches) CPC1335PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.50 (0.295) Embossment W = 16.00 (0.63) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 6 Specification: DS-CPC1335-R09 ©Copyright 2021, Littelfuse, Inc. All rights reserved. Printed in USA. 5/4/2021