CPC1390G

CPC1390 Single Pole, Normally Open 4-Pin OptoMOS® Relay INTEGRATED CIRCUITS DIVISION Parameter Peak Blocking Voltage Rating 400 Units VP Load Current On-Resistance (max) 140 22 mArms / mADC  Description The CPC1390G is a single-pole normally-open (1-Form-A) Solid State Relay with an enhanced input to output isolation barrier of 5000Vrms. The relay output is constructed with efficient MOSFET switches that use IXYS Integrated Circuits Division's patented OptoMOS architecture. The input, a highly efficient infrared LED, controls the optically coupled output. Features • • • • • • • 5000Vrms Input/Output Isolation 400VP Blocking Voltage 100% Solid State Low Drive Power Requirements Arc-Free With No Snubbing Circuits No EMI/RFI Generation Small 4-Pin Package Approvals • UL Certified Component: File E76270 • CSA Certified Component: Certificate 1172007 • EN/IEC 60950-1 Certified Component: TUV Certificate B 13 12 82667 003 Applications • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Security • Aerospace • Industrial Controls Ordering Information Part Number CPC1390G CPC1390GV CPC1390GR CPC1390GRTR Description 4-Pin DIP (100/Tube) 4-Pin DIP V-Bend (100/Tube) 4-Pin Surface Mount (100/Tube) 4-Pin Surface Mount (1000/Reel) Pin Configuration + Control – Control 1 4 2 3 Load Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-CPC1390-R08 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1390 Absolute Maximum Ratings @ 25ºC Parameter Peak Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Package Dissipation 2 Isolation Voltage, Input to Output, 60 sec. ESD Rating, Human Body Model Operational Temperature Storage Temperature 1 Derate linearly 1.33mW / ºC 2 Derate linearly 3mW / ºC Ratings 400 5 50 1 100 550 5000 8 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms kV ºC ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameters Output Characteristics Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance Conditions Symbol Min Typ Max Units - IL - - 140 t=10ms IF=2mA, IL=140mA VL=400VP ILPK RON ILEAK - 14 - ±400 22 1 mArms / mADC mAP  IF=10mA, VL=10V (See Timing Diagram) IF=0mA, VL=50V, f=1MHz ton toff COUT - 0.525 0.42 13 1 1 - IL=140mA IF=5mA VR=5V IF IF VF IR 0.2 0.9 - 0.4 1.2 - 2 1.4 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF A ms pF 1 Load current derates linearly from 140mA @ 25ºC to 70mA @ 85ºC. Measurement taken within one second of turn-on time. 3 For applications requiring high-temperature operation (T >60ºC), a minimum LED drive current of 4mA is recommended. A 2 Timing Diagram IF 0 mA IL 0 mA 90% 2 ton 10% toff www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION CPC1390 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Typical LED Forward Voltage Drop (N=50, IF=5mA) Typical Turn-On Time (N=50, IF=10mA, IL=140mA) 20 35 30 25 20 15 10 Device Count (N) 25 Device Count (N) Device Count (N) 30 15 10 5 1.19 1.21 1.23 1.25 LED Forward Voltage Drop (V) 10 Typical On-Resistance Distribution (N=50, IF=2mA, IL=140mADC) Typical IF for Switch Operation (N=50, IL=140mA) 25 0.33 0.420 0.455 0.490 0.525 0.560 0.595 0.630 Turn-On Time (ms) Device Count (N) 20 15 10 5 35 35 30 30 25 20 15 10 5 0 0.30 0.35 0.40 0.45 LED Current (mA) 0.50 14.0 14.5 15.0 1.4 IF=50mA IF=10mA IF=5mA 20 40 60 80 Temperature (ºC) 100 4 3 2 120 1.4 Turn-On Time (ms) 1.0 0.8 0.6 0.4 20 30 LED Current (mA) 40 -20 0 20 40 60 Temperature (ºC) 80 100 0.42 0.41 0.40 0 Typical Turn-On Time vs. Temperature (IL=70mA) 2.5 10 20 30 LED Current (mA) 40 50 Typical Turn-Off Time vs. Temperature (IL=70mA) 0.9 IF=2mA IF=5mA IF=10mA 0.8 2.0 1.5 1.0 0.7 0.6 IF=2mA IF=5mA IF=10mA 0.5 0.4 0.3 0.2 0 -40 486.5 0.43 50 0.5 0.2 477.5 0.38 10 3.0 1.2 468.5 0.39 0 Typical IF for Switch Operation (IL=70mA) 459.5 Typical Turn-Off Time vs. LED Forward Current (IL=70mA) 0.44 Turn-Off Time (ms) 0 10 Blocking Voltage (VP) 0 -20 15 441.5 450.5 1 0.8 -40 20 15.5 Turn-Off Time (ms) Turn-On Time (ms) 1.6 5 1.0 13.5 Typical Turn-On Time vs. LED Forward Current (IL=70mA) Typical LED Forward Voltage Drop vs. Temperature 1.2 25 On-resistance (:) 6 0.47 0 13.0 0.55 1.8 0.38 0.40 0.42 0.45 Turn-Off Time (ms) 5 0 0.25 0.35 Typical Blocking Voltage Distribution (N=50) Device Count (N) 1.17 Device Count (N) 15 0 0 0 LED Forward Voltage Drop (V) 20 5 5 LED Current (mA) Typical Turn-Off Time (N=50, IF=10mA, IL=140mA) -40 -20 0 20 40 60 Temperature (ºC) 80 100 0.1 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R08 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1390 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* 10 5 -40 -20 0 20 40 60 80 100 120 Temperature (ºC) 180 100 160 50 0 -50 -150 -2.5 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 2.5 Load Voltage (V) 60 475 0.030 Leakage (PA) Blocking Voltage (VP) 0.035 465 460 455 160 0.025 0.020 0.015 0.010 0 -40 450 -20 0 20 40 60 80 100 Temperature (ºC) -40 Typical Leakage vs. Temperature Measured Across Pins 3 & 4 (VL=400V) 0.005 -40 120 100 80 480 Maximum Load Current vs. Temperature (IF=2mA) 140 -100 Typical Blocking Voltage vs. Temperature 470 Load Current (mA) 15 150 Output Capacitance (pF) 20 Typical Load Current vs. Load Voltage (IF=2mA) Load Current (mA) On-Resistance (:) 25 Typical On-Resistance vs. Temperature (IF=2mA, IL=100mA Instantaneous) -20 0 20 40 60 80 Temperature (ºC) 100 120 Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) 140 120 100 80 60 40 20 0 -20 0 20 40 60 80 100 Temperature (ºC) 0 50 100 150 Load Voltage (V) 200 Energy Rating Curve 1.2 Load Current (A) 1.0 0.8 0.6 0.4 0.2 0 10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION CPC1390 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1390G, CPC1390GV CPC1390GR MSL 1 MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. Additionally, for the CPC1390GR, the solder reflow profile given in Technical Brief TB-200 "Pb-Free Solder Reflow Profile for Select Devices" must be followed. For the through-hole devices, CPC1390G and CPC1390GV, and any other processes, the guidelines of J-STD-020 must be observed. Device Maximum Body Temperature (Tc) Time CPC1390GR 250ºC 15 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow-up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device, and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R08 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1390 MECHANICAL DIMENSIONS CPC1390G 0.991 (0.039) PC Board Pattern (Top View) 0.254 (0.010) 3.30 ± 0.050 (0.130 ± 0.002) 6 - 0.800 DIA. (6 - 0.031 DIA.) 6.350 ± 0.127 (0.250 ± 0.005) 4.572 ± 0.127 (0.180 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) PIN 1 9.144 ± 0.508 (0.360 ± 0.020) 9º (ALL) 9º (ALL) 7.620 ± 0.250 (0.300 ± 0.010) 2.159 (0.085) 0.457 ± 0.076 (0.018 ± 0.003) 6.350 ± 0.127 (0.250 ± 0.005) 0.508 (0.020) 3.175 (0.125) 2.540 ± 0.127 (0.100 ± 0.005) Dimensions mm (inches) CPC1390GV 0.254 (0.010) 0.991 (0.039) 3.30 ± 0.050 (0.130 ± 0.002) PC Board Pattern (Top View) 10.160 ± 0.508 (0.400 ± 0.020) 6 - 0.800 DIA. (6 - 0.031 DIA.) 6.350 ± 0.050 (0.250 ± 0.002) 4.572 ± 0.050 (0.180 ± 0.002) 9º (ALL) 0.457 ± 0.076 (0.018 ± 0.003) 2.540 ± 0.050 (0.100 ± 0.002) 6 2.540 ± 0.127 (0.100 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 10.160 ± 0.127 (0.400 ± 0.005) Pin 1 9º (ALL) 7.620 ± 0.254 (0.300 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) 1.778 (0.070) 0.127 (0.005) Dimensions mm (inches) 2.92 (0.115) www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION CPC1390 CPC1390GR 2.540 ± 0.127 (0.100 ± 0.005) PCB Land Pattern 3.300 ± 0.050 (0.130 ± 0.002) 0.635 ± 0.254 (0.025 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) 9.525 (0.375) 7.620 ± 0.254 (0.300 ± 0.010) 8.80 (0.346) 1.60 (0.063) PIN #1 0.991 (0.039) 9º ± 1º (ALL) 2.287 (0.09) 3.480 ± 0.076 (0.137 ± 0.003) 4.572 ± 0.127 (0.180 ± 0.005) 0.95 (0.037) 0.254 (0.010) 2.540 ± 0.127 (0.100 ± 0.005) 2.287 ± 0.127 (0.090 ± 0.005) Dimensions mm (inches) 0.102 min / 0.254 max (0.004 min / 0.010 max) CPC1390GRTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00±0.30 (0.630±0.012) B0=5.00 (0.197) K0=4.20 (0.165) K1=3.70 (0.146) A0=10.01 (0.394) P=12.00 (0.472) Dimensions mm (inches) Embossed Carrier Embossment NOTES: 1. All dimensions meet EIA-481-C requirements 2. Unless otherwise noted, tolerances = ±0.10 (0.004) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-CPC1390-R08 ©Copyright 2016, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 1/7/2016