CPC1964BX6

CPC1964BX6 Rapid Turn-On AC Power Switch INTEGRATED CIRCUITS DIVISION Parameter AC Operating Voltage Load Current On-State Voltage Drop Blocking Voltage Rating 20 - 240 1.5 1.4 600 Units Vrms Arms VP (at IL = 1.5AP) VP Load Current up to 1.5Arms 600VP Blocking Voltage High Surge Current: 15A Rapid Turn-On (Non-Zero-Cross Turn-On) 5mA Sensitivity Creepage Distance: 0.220" on Output Pins 12.5mm External Creepage Distance DC Control, AC Output Optically Isolated Low EMI and RFI Generation High Noise Immunity Flammability Rating UL 94 V-0 Approvals • UL Recognized Component: File E69938 • CSA Certified Component: Certificate 1172007 Ordering Information Part # CPC1964BX6 Applications • • • • • • • • • • • • • CPC1964BX6 is an AC Solid State Switch utilizing dual power SCR outputs. This device features Rapid Turn-On (non-zero-cross) control of the output SCRs, which makes it ideal for precisely switching AC loads independent of the load voltage phase. The optically coupled input and output circuits provide 5000Vrms of isolation and noise immunity between the control and load circuits. As a result, the CPC1964BX6 is well suited for industrial environments where electromagnetic interference would disrupt the operation of plant facility communication and control systems. Features • • • • • • • • • • • • Description HVAC Control (Heating, Ventilation, Air Conditioning) Lighting Programmable Control Process Control Power Control Panels Remote Switching Gas Pump Electronics Contactors Large Relays Solenoids Motors Heaters Meters Description 8-Pin Power SOIC (25/Tube) Pin Configuration 8 AC Load 7 6 AC Load 5 R 1 N/C 2 + LED 3 – LED 4 N/C Rapid Turn-On (Non Zero-Cross) Waveforms Control AC Load Voltage Load Current Voltage Across Relay DS-CPC1964BX6-R02 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC1964BX6 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage (VDRM) Reverse Input Voltage Input Control Current Peak (10ms) di/dt Critical Rate of Rise of On-State Current Input Power Dissipation 1 Total Power Dissipation 2 ESD, Human Body Model i2t Fusing Current (1/2 Sine Wave, 60Hz) Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 20 mW / ºC Ratings 600 5 50 1 Units VP V mA A 20 A/s 150 2400 4 2 5000 -40 to +85 -40 to +125 mW mW kV A2s Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameters Output Characteristics Load Current, Continuous Maximum Surge Current Off State Leakage Current On-State Voltage Drop Off-State dV/dt Switching Speeds Turn-on Turn-off Holding Current Latching Current Operating Frequency Input Characteristics Input Control Current to Activate 1 Input Drop-out Voltage Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 Conditions Symbol Min Typ Max Units VL=20-240Vrms t < 16ms VDRM IL=1.5AP - IL IP 0.07 1000 1.21 - 1.5 15 100 1.4 - Arms A AP VP V/s ton toff IH IL 20 20 44 48 - 500 0.5 75 75 500 s cycles mA mA Hz 60Hz IF=5mA VR=5V IF VF IR 0.8 0.9 - 1.2 - 5 1.5 10 mA V V A VIO=0V, f=1MHz CIO - - 3 pF IF = 5mA, Resistive VL=20V, 60Hz - ILEAK dV/dt For high-noise environments, or for high-frequency operation, use IF > 10mA. www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION CPC1964BX6 PERFORMANCE DATA* 35 30 30 Device Count (N) 30 Device Count (N) Typical IF for Switch Operation Resistive Load (N=50, IL=1.5A, VL=120VAC 60Hz) On-State Forward Voltage Drop (N=50, IF=5mA, IL=1.5A) 25 20 15 10 25 Device Count (N) 35 Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 20 15 10 0 0 1.25 1.26 1.27 1.28 1.29 LED Forward Voltage (V) 15 10 5 5 5 20 0 1.200 1.205 1.210 1.215 1.220 1.225 1.230 Forward Voltage (VP) 1.30 1.5 1.7 1.9 2.1 2.3 LED Current (mA) 2.5 2.7 Typical Blocking Voltage Distribution (N=50) Device Count (N) 25 20 15 10 5 0 747 Typical LED Forward Voltage Drop vs. Temperature Turn-On Time vs. Temperature 20 IF=5mA 1.3 1.2 Turn-On Time (Ps) 60 Turn-On Time (Ps) LED Forward Voltage (V) 768 70 IF=50mA IF=20mA IF=10mA IF=5mA 1.4 753 756 759 762 765 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current 1.6 1.5 750 50 40 30 20 15 IF=10mA 10 5 10 1.1 0 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 0 50 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Typical IF for Switch Operation Resistive Load (IL=350mA, 60Hz) 2.9 LED Forward Current (mA) 10 20 30 40 LED Forward Current (mA) 2.8 2.7 2.6 2.5 2.4 2.3 2.2 2.1 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. R02 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1964BX6 PERFORMANCE DATA* Holding Current (RL=1.9:) On-State Voltage vs. Temperature 1.25 60 50 40 30 20 1.20 IL=1.5A 1.15 1.10 IL=1A 1.05 1.00 IL=0.5A 0.95 -40 -20 0 20 40 60 Temperature (ºC) 80 -40 100 Blocking Voltage vs. Temperature -20 0 20 40 60 Temperature (ºC) 80 100 850 800 750 700 0 20 40 60 Temperature (ºC) 80 900 850 800 750 100 -40 Load Current (AP) 20 -0.5 0.0 0.5 1.0 1.5 10 700 -20 -1.0 Typical Leakage Current vs. Temperature Leakage Current (PA) Blocking Voltage (VP) 900 @ 85ºC @ 25ºC @ -40ºC Load Voltage (V) 950 -40 2.5 2.0 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -1.5 Blocking Voltage vs. Temperature 950 Blocking Voltage (VP) Load Current (A) 70 On-State Voltage (VP) Holding current (mA) 80 Typical Load Current vs. Load Voltage (IF=5mA) -20 0 20 40 60 Temperature (ºC) 80 100 VL=600V VL=300V 1 0.1 0.01 0.001 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Maximum Surge Current vs. Time TJ=50ºC Before Surge 15 10 5 0 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION CPC1964BX6 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1964BX6 MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles CPC1964BX6 245ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R02 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1964BX6 MECHANICAL DIMENSIONS CPC1964BX6 21.082 ± 0.381 (0.830 ± 0.015) Pin 8 16.764 ± 0.381 (0.660 ± 0.015) 0.127 ± 0.076 (0.005 ± 0.003) 15.90 (0.626) 10.160 ± 0.254 (0.400 ± 0.010) 2.00 (0.079) 0.889 ± 0.127 (0.035 ± 0.005) Pin 1 0.762 ± 0.102 (0.030 ± 0.004) 5.080 ± 0.127 (0.200 ± 0.005) 7.622 ± 0.127 (0.300 ± 0.005) Recommended PCB Pattern 3.302 ± 0.051 (0.130 ± 0.002) 1.524 typ (0.060) 1.016 ± 0.127 (0.040 ± 0.005) 1.651 ± 0.102 (0.065 ± 0.004) 5.080 ± 0.127 (0.200 ± 0.005) 0.381 ± 0.025 (0.015 ± 0.001) Dimensions Unless Otherwise Noted mm Note: Pin-to-pin tolerances are non-cumulative. (inches) 5.080 (0.200) 7.622 (0.300) 5.080 (0.200) 0.95 (0.037) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1964BX6-R02 ©Copyright 2018, IXYS Integrated Circuits All rights reserved. Printed in USA. 6/29/2018