CPC2017N

CPC2017N 60V, 120mA, Dual Single-Pole Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Current to operate Rating 60 120 16 1 Units VP mArms / mADC  mA Features • Designed for use in Security Systems Complying with EN50130-4 • 1500Vrms Input/Output Isolation • No EMI/RFI Generation • Immune to Radiated EM Fields • Tape & Reel Version Available • Small 8-Pin SOIC Package • Flammability Rating UL 94 V-0 Description The CPC2017N is a miniature device with two independent, normally-open (1-Form-A) solid state relays in an 8-pin SOIC package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. Optically coupled outputs that use the patented OptoMOS architecture are controlled by a highly efficient infrared LED. The CPC2017N uses IXYS Integrated Circuits' state of the art, double-molded, vertical construction packaging to produce one of the world’s smallest relays. The CPC2017N offers substantial board space savings over the competitor’s larger 8-pin SOIC relay. Approvals Applications • Security • Passive Infrared Detectors (PIR) • Data Signalling • Sensor Circuitry • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Medical Equipment—Patient/Equipment Isolation • Industrial Controls • UL Recognized Component: File E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # CPC2017N CPC2017NTR Description 8-Pin SOIC (50/tube) 8-Pin SOIC (2000/reel) Pin Configuration 8 1 + Control Load 7 2 – Control Load 6 3 + Control Load 4 5 – Control Load Switching Characteristics of Normally-Open (Form-A) Devices Form-A IF 90% 10% ILOAD ton DS-CPC2017N-R06 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC2017N Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Total Power Dissipation 1 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Ratings 60 5 50 1 600 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 5mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Capacitance, Input to Output Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current 1 2 3 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 60 - - V IF=1mA t =10ms IL=120mA VL=60VP IL ILPK RON ILEAK - 7.1 - 120 ±350 16 1 mArms / mADC mAP  IF=0mA, VL=50V, f=1MHz VIO=0V, f=1MHz ton toff COUT CIO - 1.25 0.45 5 1 3 3 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 0.40 0.35 1.2 - 1 1.4 10 IF=5mA, VL=10V µA ms pF pF mA mA V µA Load current derates linearly from 120mA @ 25oC to 60mA @80oC, and must be derated for both poles operating simultaneously. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 3mA is recommended. www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC2017N PERFORMANCE DATA* 25 20 15 10 5 1.17 35 15 10 5 0.35 0.40 0.45 0.50 0.55 20 15 10 5 7.1 7.2 0.35 15 10 5 0.40 0.45 0.50 LED Current (mA) 0.55 0.60 Typical Turn-Off Time (N=50, IF=5mA, IL=120mA) 25 20 20 15 10 5 0 7.4 7.3 5 0.30 0 0 7.0 10 0.60 Typical Turn-On Time (N=50, IF=5mA, IL=120mA) 25 Device Count (N) 25 6.9 15 LED Current (mA) Typical On-Resistance Distribution (N=50, IF=1mA, IL=120mA) 6.8 20 0 0.30 1.19 1.21 1.23 1.25 LED Forward Voltage Drop (V) 30 Device Count (N) 20 0 0 Typical IF for Switch Dropout (N=50, IL=120mA) 25 Device Count (N) Device Count (N) Device Count (N) 30 25 Typical IF for Switch Operation (N=50, IL=120mA) Device Count (N) 35 Typical LED Forward Voltage Drop (N=50, IF=5mA) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 0.26 0.28 Turn-On Time (ms) On-Resistance (:) 0.30 0.32 0.34 0.36 0.38 Turn-Off Time (ms) Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 80 82 84 86 88 90 92 Blocking Voltage (VP) Typical IF for Switch Operation vs. Temperature (IL=60mA) 1.6 3.0 IF=50mA IF=20mA IF=10mA 1.4 1.2 1.0 -40 150 2.5 1.3 1.1 Typical Load Current vs. Load Voltage (IF=1mA) IF=5mA IF=2mA IF=1mA Load Current (mA) 1.5 LED Current (mA) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 2.0 1.5 1.0 0 20 40 60 Temperature (ºC) 80 100 50 0 -50 -100 0.5 0 -20 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 -150 -1.5 -1.0 -0.5 0 0.5 Load Voltage (V) 1.0 1.5 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R06 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC2017N Typical Turn-On Time vs. LED Forward Current (IL=120mA) 3.0 2.7 2.4 2.1 1.8 1.5 1.2 0.9 0.6 0.3 0 IF=2mA On-Resistance (:) Turn-Off Time (ms) 0.5 0.4 0.3 0.2 20 25 30 35 40 45 50 0 10 15 20 25 30 35 40 50 45 LED Forward Current (mA) LED Forward Current (mA) Typical Turn-On Time vs. Temperature (IL=50mA) Typical Turn-Off Time vs. Temperature (IL=50mA) IF=2mA 2.5 2.0 IF=5mA 1.5 -20 0 20 40 60 Temperature (ºC) 80 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 IF=5mA 0.016 89 0.014 Leakage (PA) 83 81 -20 0 20 40 60 Temperature (ºC) -20 0 20 40 60 Temperature (ºC) 80 100 90 80 0.008 0.006 0 -40 -40 14 0.010 100 80 100 Typical Leakage vs. Temperature (Measured Across Pins 5&6, 7&8) (VL=60V) 0.002 -40 20 40 60 Temperature (ºC) 110 100 0.012 77 0 60 80 0.004 79 -20 70 91 85 Instantaneous IF=5mA 6 130 IF=2mA Typical Blocking Voltage vs. Temperature 87 8 120 -40 100 Steady State Maximum Load Current vs. Temperature (IF=2mA) Load Current (mA) 3.0 1.0 -40 Blocking Voltage (VP) 5 Output Capacitance (pF) 3.5 15 IF=5mA 10 2 -40 0 10 12 4 0.1 5 Typical On-Resistance vs. Temperature (IL=60mA) 14 0.6 0 Turn-On Time (ms) Typical Turn-Off Time vs. LED Forward Current (IL=120mA) 0.7 Turn-Off Time (ms) Turn-On Time (ms) PERFORMANCE DATA* -20 0 20 40 60 Temperature (ºC) 80 100 Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) 12 10 8 6 4 -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s 0 10 20 30 40 Load Voltage (V) 50 60 Load Current (A) Energy Rating Curve 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 10Ps 100Ps 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC2017N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC2017N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles CPC2017N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R06 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC2017N MECHANICAL DIMENSIONS CPC2017N 1.016 ± 0.025 (0.040 ± 0.001) 9.347 ± 0.203 (0.368 ± 0.008) Pin 1 2.184 MAX (0.086 MAX) 0.432 ± 0.127 (0.017 ± 0.005) Pin to Package Standoff MIN 0.0254 (0.001) (MAX 0.102 (0.004) 0.838 ± 0.102 (0.033 ± 0.004) PCB Land Pattern 5.60 (0.22) 1.30 (0.051) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.051 (0.150 ± 0.002) 2.540 TYP (0.100 TYP) 0.203 ± 0.025 (0.008 ± 0.001) 0.381 ± 0.051 (0.015 ± 0.002) 2.54 (0.100) 0.55 (0.022) Dimensions mm (inches) Note: 1. Lead dimensions do not include plating: 1000 microinches max. CPC2017NTR Tape & Reel 1.75 ± 0.10 330.2 DIA. (13.00 DIA.) 4.00 ± 0.10 P1=8.00 ± 0.10 2.00 ± 0.10 Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 1.20 7.50 ± 0.10 Ø1.50 +0.1, -0 6.50 9.65 ± 0.10 16.00 ± 0.30 Embossed Carrier Direction of feed 3.50 Embossment 6.55 ± 0.10 2.35 ± 0.10 NOTES: 1. All dimensions in millimeters 2. 10 sprocket hole pitch cumulative tolerance ± 0.20. 3. Carrier camber is within 1mm in 250mm. Ø1.50 MIN 2.85 ± 0.10 4. Tape material : Black Conductive Polystyrene Alloy. 5. All dimensions meet EIA-481-C requirements. 6. Thickness : 0.30 ± 0.05mm. For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 6 Specification: DS-CPC2017N-R06 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 9/7/2021