CPC2025N

CPC2025N 400V, 120mA Dual Single-Pole Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Forward Current (to Activate) Rating 400 120 30 2 Units VP mArms / mADC  mA The CPC2025N is a miniature device with two independent, normally-open (1-Form-A) solid state relays in an 8-pin SOIC package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. Optically coupled outputs that use the patented OptoMOS architecture are controlled by a highly efficient infrared LED. Features • • • • • • Description 1500Vrms Input/Output Isolation No EMI/RFI Generation Immune to Radiated EM Fields Tape & Reel Version Available Small 8-Pin SOIC Package Flammability Rating UL 94 V-0 The CPC2025N uses IXYS Integrated Circuits' state of the art, double-molded vertical construction packaging to produce one of the world’s smallest relays. It offers substantial board space savings over the competitor’s larger 8-pin SOIC relay. Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Security • Passive Infrared Detectors (PIR) • Data Signaling • Sensor Circuitry • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Medical Equipment—Patient/Equipment Isolation • Industrial Controls Approvals • UL Recognized Component: File E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # CPC2025N CPC2025NTR Description 8-Pin SOIC (50/tube) 8-Pin SOIC (2000/reel) Pin Configuration 1 8 + Control Load 7 2 – Control Load 3 6 + Control Load 4 5 – Control Load Switching Characteristics of Normally-Open (Form-A) Devices Form-A IF 90% 10% ILOAD ton DS-CPC2025N-R05 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC2025N Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage (Peak) Reverse Input Voltage LED Forward Current Peak (10ms) Input Power Dissipation Total Power Dissipation 1 Isolation Voltage, Input to Output (60 Seconds) ESD Rating, Human Body Model Operational Temperature, Ambient Storage Temperature 1 Ratings 400 5 50 1 70 600 Units VP V mA A mW mW 1500 Vrms 8 -40 to +85 -40 to +125 kV °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 5mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics LED Forward Current To Activate 3 To Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 3 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 400 - - V t=10ms IL=120mA VL=400VP IL ILPK RON ILEAK - 20 - 120 ±350 30 1 mArms / mADC mAP  µA ton toff COUT - 0.76 0.36 9 2 1 - 0.3 0.9 - 0.6 0.55 1.36 - 2 1.5 10 IF=5mA, VL=10V IF=0mA, VL=50V, f=1MHz IL=120mA IF=5mA VR=5V IF VF IR VIO=0V, f=1MHz CIO 1 Load current derates linearly from 120mA @ 25oC to 60mA @ 85oC, and must be derated if both poles are operating simultaneously. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60°C) a minimum LED forward current of 4mA is recomended. www.ixysic.com - ms pF mA V µA pF R05 INTEGRATED CIRCUITS DIVISION CPC2025N PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 30 Typical LED Forward Current to Activate (N=50, IL=120mA) 15 Typical On-Resistance Distribution (N=50, IF=2mA, IL=120mA) 30 20 15 10 Device Count (N) 25 Device Count (N) Device Count (N) 25 10 5 5 0.3 Typical Turn-On Time (N=50, IF=5mA, IL=60mA) 0.4 0.5 0.6 0.7 0.8 LED Forward Current (mA) 15 10 5 0 17.5 0.9 0.65 0.70 0.75 0.80 0.85 Turn-On Time (ms) 20 15 10 5 0.34 0.85 20 10 0.65 0.60 0.55 0.50 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 75 100 Typical Load Current vs. Load Voltage (IF=2mA) 50 0 -50 -3 -2 -1 0 1 Load Voltage (V) 2 3 Typical Turn-Off Time vs. LED Forward Current (IL=60mA) 0.37 0.36 1.0 0 431 100 100 1.5 1.0 0 25 50 Temperature (ºC) 80 2.0 0.5 -25 20 40 60 Temperature (ºC) 2.5 1.1 -50 0 Turn-Off Time (ms) Turn-On Time (ms) 1.6 419 422 425 428 Blocking Voltage (VP) -150 -20 Typical Turn-On Time vs. LED Forward Current (IL=60mA) Typical LED Forward Voltage Drop vs. Temperature 3.0 5 -100 0.45 3.5 10 150 0.70 1.7 15 416 0.75 1.8 20 0.40 0.80 0.40 -40 0 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 LED Forward Voltage (V) 0.36 0.37 0.38 0.39 Turn-Off Time (ms) Load Current (mA) LED Forward Current (mA) 30 0.35 LED Forward Current to Activate vs. Temperature (IL=60mA) LED Forward Voltage vs. LED Forward Current 40 20.5 0 0.90 50 18.5 19.0 19.5 20.0 On-Resistance (:) 25 0 0.60 18.0 Typical Blocking Voltage Distribution (N=50) Typical Turn-Off Time (N=50, IF=5mA, IL=60mA) 25 Device Count (N) 20 Device Count (N) 10 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Device Count (N) 1.364 LED Forward Current (mA) 15 5 0 0 LED Forward Voltage Drop (V) 20 0.35 0.34 0.33 0.32 0.31 0.30 0 10 20 30 40 LED Forward Current (mA) 50 0 10 20 30 40 LED Forward Current (mA) 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC2025N PERFORMANCE DATA* 32 Typical Turn-On Time vs. Temperature (IL=60mA) 2.5 Turn-On Time (ms) On-Resistance (:) 30 28 26 24 22 2.0 1.5 IF=5mA 1.0 0.5 0.4 IF=5mA 0.3 IF=2mA 0.2 0.1 20 18 0 0.5 -20 0 20 40 60 Temperature (ºC) 80 100 -40 Maximum Load Current vs. Temperature (IF=4mA) 140 Blocking Voltage (VP) 100 80 60 40 20 0 0 20 40 60 Temperature (ºC) Output Capacitance (pF) 50 80 100 20 40 60 Temperature (ºC) -40 0.030 430 420 410 0 20 40 60 Temperature (ºC) 80 100 Typical Leakage vs. Temperature Measured Across Pins 5&6, 7&8 (VL=400V) 0.020 0.015 0.010 0.005 400 390 -40 -20 0.025 -20 0 20 40 60 Temperature (ºC) Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) 20 10 10 100 Load Voltage (V) 80 0 -40 100 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve 30 1 100 440 40 0 0.1 80 450 Load Current (A) -20 0 Typical Blocking Voltage vs. Temperature (IF=0mA) 460 120 -40 -20 Leakage (PA) -40 Load Current (mA) Typical Turn-Off Time vs. Temperature (IL=60mA) 0.6 IF=2mA Turn-Off Time (ms) Typical On-Resistance vs. Temperature (IF=20mA, IL=60mA) 1000 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10μs 100μs 1ms 10ms 100ms 1s 10s 100s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION CPC2025N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC2025N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles CPC2025N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R05 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC2025N MECHANICAL DIMENSIONS CPC2025N 1.016 ± 0.025 (0.040 ± 0.001) 9.347 ± 0.203 (0.368 ± 0.008) Pin 1 2.184 MAX (0.086 MAX) 0.432 ± 0.127 (0.017 ± 0.005) Pin to Package Standoff MIN 0.0254 (0.001) (MAX 0.102 (0.004) 0.838 ± 0.102 (0.033 ± 0.004) PCB Land Pattern 5.60 (0.22) 1.30 (0.051) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.051 (0.150 ± 0.002) 2.540 TYP (0.100 TYP) 0.203 ± 0.025 (0.008 ± 0.001) 2.54 (0.100) 0.55 (0.022) Dimensions mm (inches) 0.381 ± 0.051 (0.015 ± 0.002) Note: 1. Lead dimensions do not include plating: 1000 microinches max. CPC2025NTR Tape & Reel 1.75 ± 0.10 330.2 DIA. (13.00 DIA.) 4.00 ± 0.10 P1=8.00 ± 0.10 2.00 ± 0.10 Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 1.20 7.50 ± 0.10 Ø1.50 +0.1, -0 6.50 9.65 ± 0.10 16.00 ± 0.30 Embossed Carrier Direction of feed 3.50 Embossment 6.55 ± 0.10 2.35 ± 0.10 NOTES: 1. All dimensions in millimeters 2. 10 sprocket hole pitch cumulative tolerance ± 0.20. 3. Carrier camber is within 1mm in 250mm. Ø1.50 MIN 2.85 ± 0.10 4. Tape material : Black Conductive Polystyrene Alloy. 5. All dimensions meet EIA-481-C requirements. 6. Thickness : 0.30 ± 0.05mm. For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 6 Specification: DS-CPC2025N-R05 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 9/7/2021