CPC2317N
60V, 120mA Dual Single-Pole Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
LED Current to operate
Rating
60
120
16
1
One Normally-Open Pole & One Normally-Closed Pole
Units
VP
mArms / mADC
mA
Features
•
•
•
•
•
•
This device uses IXYS Integrated Circuits' state of
the art, double-molded vertical construction packaging
to produce one of the world’s smallest relays. It
is ideal for replacing larger, less-reliable reed and
electromechanical relays.
Applications
• Security
• Passive infrared detectors (PIR)
• Data signaling
• Sensor circuitry
• Instrumentation
• Multiplexers
• Data acquisition
• Electronic switching
• I/O subsystems
• Medical equipment—patient/equipment isolation
• Industrial controls
Pin Configuration
1
The CPC2317N is a miniature device with one
independent normally-open (1-Form-A) solid state
relay and one independent normally-closed
(1-Form-B) solid state relay in an 8-pin SOIC package.
It employs optically coupled MOSFET technology to
provide 1500Vrms of input to output isolation.
The optically coupled outputs, which use IXYS
Integrated Circuits' patented OptoMOS architecture,
are controlled by a highly efficient infrared LED.
1500Vrms input/output isolation
No EMI/RFI generation
Immune to radiated EM fields
Small 8-pin SOIC package
Tape & reel version available
Flammability rating UL 94 V-0
Approvals
• UL Recognized Component: File E76270
• TUV EN 62368-1: Certificate # B 082667 0008
Ordering Information
Part #
CPC2317N
CPC2317NTR
Description
8-Pin SOIC (50/tube)
8-Pin SOIC (2000/reel)
Switching Characteristics of
Normally-Open
(Form-A) Devices
8
+ Control
Description
Switching Characteristics of
Normally-Closed
(Form-B) Devices
Load
2
7
– Control
Form-B - Normally Closed
Form-A
Form-B
IF
IF
Load
3
ILOAD
6
+ Control
90%
Load
ILOAD
Form-A - Normally Open
4
– Control
DS-CPC2317N-R06
10%
ton
toff
10%
toff
90%
ton
5
Load
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1
INTEGRATED CIRCUITS DIVISION
CPC2317N
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Symbol
VL(max)
VR
Total Power Dissipation 1
Isolation Voltage, Input to Output
Operational Temperature, Ambient
Storage Temperature
1
IF(max)
PT
VISO
TA
-
Rating
60
5
50
1
600
1500
-40 to +85
-40 to +125
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Unit
VP
V
mA
A
mW
Vrms
°C
°C
Typical values are characteristic of the device at +25°C, and
are the result of engineering evaluations. They are provided for
information purposes only, and are not part of the manufacturing
testing requirements.
Derate linearly 5mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Normally Open (Form-A) Continuous 1
Normally Closed (Form-B) Continuous 1
Peak
On-Resistance 2
Switching Speeds
Turn-On
Turn-Off
Off-State Leakage Current
Output Capacitance
Normally Open (Form-A)
Normally Closed (Form-B)
Input Characteristics
Input Control Current to Activate 3
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
1
2
3
2
Conditions
Symbol
Min
Typ
Max
Units
IL
-
-
120
mArms / mADC
ILPK
RON
-
-
±350
16
mAP
IF=5mA, VL=10V
ton
toff
VL=60VP
ILEAK
-
-
3
3
1
-
5
-
-
10
-
IF=1mA
IF=0mA
t =10ms
IL=120mA
IF=0mA, VL=50V, f=1MHz
IF=1mA, VL=50V, f=1MHz
COUT
ms
µA
pF
IL=100mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.1
0.9
-
0.40
0.35
1.2
-
1
1.4
10
mA
mA
V
µA
VIO=0V, f=1MHz
CIO
-
1
-
pF
Load current derates linearly from 120mA @ 25oC to 60mA @ 85oC, and must be derated for both poles operating simultaneously.
Measurement taken within 1 second of on-time.
For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 3mA is recommended.
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R06
INTEGRATED CIRCUITS DIVISION
CPC2317N
Common Performance Data*
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
25
Device Count (N)
Device Count (N)
30
25
20
15
10
5
30
20
15
10
5
1.17
1.3
1.2
1.1
1.0
-40
IF=5mA
IF=2mA
IF=1mA
20
40
60
Temperature (ºC)
2.0
1.5
1.0
100
-20
0
20
40
60
Temperature (ºC)
Load Current (A)
85
83
81
79
77
0
92
Maximum Load Current
vs. Temperature
(Form-A IF=2mA, Form-B IF=0mA)
110
100
90
80
20
40
60
Temperature (ºC)
80
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Energy Rating Curve
87
-20
84
86
88
90
Blocking Voltage (VP)
60
-40
89
-40
82
70
Typical Blocking Voltage
vs. Temperature
(Form-A IF=0mA, Form-B IF=2mA)
91
Blocking Voltage (VP)
80
80
120
0.5
0
10
130
0
-20
15
0.60
Load Current (mA)
1.4
0.40 0.45 0.50 0.55
LED Current (mA)
2.5
LED Current (mA)
LED Forward Voltage Drop (V)
3.0
IF=50mA
IF=20mA
IF=10mA
1.5
0.35
Typical IF for Switch Operation
vs. Temperature
(IL=80mA)
Typical LED Forward Voltage Drop
vs. Temperature
1.6
20
0
0.30
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
25
5
0
0
Typical Blocking Voltage Distribution
(N=50)
(Form-A IF=0mA, Form-B IF=2mA)
35
Device Count (N)
35
Typical IF for Switch Operation
(N=50, IL=100mA)
100
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
10s
100s
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
R06
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3
INTEGRATED CIRCUITS DIVISION
CPC2317N
Form-A Performance Data*
25
20
20
15
10
5
1.0
30
15
10
5
1.1
1.2
1.3
1.4
1.5
3.0
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
0.28
0.30 0.32 0.34 0.36
Turn-Off Time (ms)
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
0.7
150
Load Current (mA)
Turn-Off Time (ms)
0.5
0.4
0.3
0.2
3.5
Turn-Off Time (ms)
3.0
IF=2mA
2.5
2.0
IF=5mA
1.5
1.0
-40
0
Typical Turn-On Time
vs. Temperature
(IL=50mA)
-20
0
20
40
60
Temperature (ºC)
0.016
80
100
5
10
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
15
20
25
Typical Load Current vs. Load Voltage
(IF=5mA)
50
0
-50
30
35
40
45
50
-150
-1.5
-0.5
0
0.5
Load Voltage (V)
Typical Turn-Off Time
vs. Temperature
(IL=50mA)
Typical On-Resistance vs. Temperature
(IL=Max Rated @ Temperature)
14
-1.0
1.0
1.5
IF=2mA
IF=5mA
12
IF=5mA
10
Steady State
8
Instantaneous
IF=5mA
6
4
IF=2mA
-40
-20
0
20
40
60
Temperature (ºC)
Typical Leakage vs. Temperature
(Measured Across Pins 5&6)
(IF=0mA, VL=60V)
14
Output Capacitance (pF)
Leakage (PA)
7.4
7.3
LED Forward Current (mA)
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-40
7.0
7.1
7.2
On-Resistance (:)
100
On-Resistance (:)
50
45
6.9
-100
0
10 15 20 25 30 35 40
LED Forward Current (mA)
10
6.8
0.1
5
15
0.38
0.6
0
20
0
0.26
1.6
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
25
5
Turn-On Time (ms)
Turn-On Time (ms)
35
0
0
Turn-On Time (ms)
Typical On-Resistance Distribution
(N=50, IL=100mA)
Typical Turn-Off Time
(N=50, IL=100mA, IF=5mA)
Device Count (N)
25
Device Count (N)
Device Count (N)
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA)
80
100
2
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Output Capacitance vs. Load Voltage
(IF=0mA, f=1MHz)
12
10
8
6
4
-20
0
20
40
60
Temperature (ºC)
80
100
0
10
20
30
40
Load Voltage (V)
50
60
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
4
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R06
INTEGRATED CIRCUITS DIVISION
CPC2317N
Form-B Performance Data*
Typical Turn-On Time
(N=50, IF=2mA, IL=150mA)
25
Device Count (N)
15
10
5
0.28
0.30
0.32 0.34 0.36 0.38
Turn-On Time (ms)
5
25
20
15
10
5
0
0.30
0.40
0.4
0.3
0.2
0.1
0
10
15
20
25
30
35
40
45
50
-20
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
5
10
15
20
25
30
35
Typical Turn-Off Time
vs. Temperature
(IF=2mA, IL=50mA)
0.40
80
100
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
5.6
Typical Load Current vs. Load Voltage
100
50
0
-50
45
50
-1
-0.75 -0.5 -0.25
0
0.25
0.5
0.75
1
Load Voltage (V)
8
Typical On-Resistance vs. Temperature
(IF=0mA, IL=150mA)
6
5
4
3
2
-40
-20
0
20
40
60
80
100
-40
-20
Temperature (ºC)
Typical Leakage vs. Temperature
Measured Across Pins 7&8
(IF=2mA, VL=60V)
40
Output Capacitance (pF)
Leakage (µA)
5.2
5.3
5.4
5.5
On-Resistance (:)
7
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-40
5.1
150
40
Typical Turn-On Time
vs. Temperature
(IF=2mA, IL=50mA)
20
40
60
Temperature (ºC)
5.0
-150
0
LED Forward Current (mA)
0
0.42
-100
LED Forward Current (mA)
Turn-Off Time (ms)
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-40
5
0.34 0.36 0.38 0.40
Turn-Off Time (ms)
Load Current (mA)
Turn-Off Time (ms)
0.5
0
0.32
Typical Turn-Off Time
vs. LED Forward Current
(IL=50mA)
0.6
Turn-On Time (ms)
10
Typical Turn-On Time
vs. LED Forward Current
(IL=50mA)
0.7
Turn-On Time (ms)
15
0
0
Typical On-Resistance Distribution
(N=50, IL=150mA)
30
20
On-Resistance (:)
Device Count (N)
20
35
Device Count (N)
25
Typical Turn-Off Time
(N=50, IF=2mA, IL=150mA)
0
20
40
60
80
100
Temperature (ºC)
Output Capacitance vs. Load Voltage
(IF=0.5mA)
35
30
25
20
15
10
5
-20
0
20
40
60
Temperature (ºC)
80
100
0
10
20
30
40
Load Voltage (V)
50
60
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
R06
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5
INTEGRATED CIRCUITS DIVISION
CPC2317N
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Classification
CPC2317N
MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum
dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification
Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes.
Device
Classification Temperature (Tc)
Dwell Time (tP)
Max Reflow Cycles
CPC2317N
260ºC
30 seconds
3
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage
to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow
up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the
variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to halide flux or solvents.
6
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R06
INTEGRATED CIRCUITS DIVISION
CPC2317N
MECHANICAL DIMENSIONS
CPC2317N
1.016 ± 0.025
(0.040 ± 0.001)
9.347 ± 0.203
(0.368 ± 0.008)
Pin 1
2.184 MAX
(0.086 MAX)
0.432 ± 0.127
(0.017 ± 0.005)
Pin to Package Standoff
MIN 0.0254 (0.001)
(MAX 0.102 (0.004)
0.838 ± 0.102
(0.033 ± 0.004)
PCB Land Pattern
5.60
(0.22)
1.30
(0.051)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.051
(0.150 ± 0.002)
2.540 TYP
(0.100 TYP)
0.203 ± 0.025
(0.008 ± 0.001)
0.381 ± 0.051
(0.015 ± 0.002)
2.54
(0.100)
0.55
(0.022)
Dimensions
mm
(inches)
Note:
1. Lead dimensions do not include plating: 1000 microinches max.
CPC2317NTR Tape & Reel
1.75 ± 0.10
330.2 DIA.
(13.00 DIA.)
4.00 ± 0.10
P1=8.00 ± 0.10
2.00 ± 0.10
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
1.20
7.50 ± 0.10
Ø1.50
+0.1, -0
6.50 9.65 ± 0.10
16.00 ± 0.30
Embossed Carrier
Direction of feed
3.50
Embossment
6.55 ± 0.10
2.35 ± 0.10
NOTES:
1. All dimensions in millimeters
2. 10 sprocket hole pitch cumulative tolerance ± 0.20.
3. Carrier camber is within 1mm in 250mm.
Ø1.50 MIN
2.85 ± 0.10
4. Tape material : Black Conductive Polystyrene Alloy.
5. All dimensions meet EIA-481-C requirements.
6. Thickness : 0.30 ± 0.05mm.
For additional information please visit our website at: https://www.ixysic.com
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.
7
Specification: DS-CPC2317N-R06
©Copyright 2021, Littelfuse, Inc.
OptoMOS® is a registered trademark of IXYS Integrated Circuits
All rights reserved. Printed in USA.
9/7/2021
