CPC2330N

CPC2330N 350V, 120mA Dual Single-Pole Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Current to operate Rating 350 120 30 2 One Normally-Open Pole & One Normally-Closed Pole Units VP mArms / mADC  mA The CPC2330N is a miniature device with two independent solid state relays, one normally-open (1-Form-A) and the other normally-closed (1-Form-B), in an 8-pin SOIC package with 1500Vrms of input to output isolation. The optically coupled outputs, which use IXYS Integrated Circuits' patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Features • • • • • • Description 1500Vrms Input/Output Isolation Small 8-Pin SOIC Package No EMI/RFI Generation Immune to radiated EM fields Tape & Reel Version Available Flammability Rating UL 94 V-0 Using IXYS Integrated Circuits' state of the art, double-molded vertical construction packaging, the CPC2330N is ideal for replacing larger, less-reliable reed and electromechanical relays. Applications • Telecommunication • Security • Passive Infrared Detectors (PIR) • Data Signalling • Sensor Circuitry • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Medical Equipment—Patient/Equipment Isolation • Industrial Controls Approvals • UL Recognized Component: File E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # CPC2330N CPC2330NTR Description 8-Pin SOIC (50/tube) 8-Pin SOIC (2000/reel) Switching Characteristics of Normally-Open Devices Switching Characteristics of Normally-Closed Devices Form-A Form-B IF IF Pin Configuration 1 8 + Control Load 10% ton 2 7 – Control ILOAD 90% ILOAD toff 10% toff 90% ton Form-B - Normally Closed Load 3 6 + Control Load Form-A - Normally Open 4 – Control DS-CPC2330N-R06 5 Load www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC2330N Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Total Power Dissipation 1 Isolation Voltage, Input to Output ESD Rating, Human Body Model Operational Temperature, Ambient Storage Temperature Soldering Temperature (10 Seconds) 1 Ratings 350 5 50 1 600 1500 8 -40 to +85 -40 to +125 260 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW Vrms kV °C °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 5mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Form-A, Continuous 1 Form-B, Continuous 1 Peak On-Resistance 2 Switching Speeds Turn-On Turn-Off Off-State Leakage Current Form-A Form-B Output Capacitance Form-A Form-B Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 3 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 350 - - V IL - - 120 mArms / mADC ILPK RON - - ±350 30 mAP  IF=5mA, VL=10V ton toff - - 3 3 ms IF=0mA, VL=350VP IF=2mA, VL=350VP ILEAK - 0.001 2 1 5 µA COUT - - pF IL=120mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 1.36 - 2 1.5 10 mA mA V µA VIO=0V, f=1MHz CIO - 1 - pF IF=2mA IF=0mA t =10ms IL=120mA IF=0mA, VL=50V, f=1MHz IF=2mA, VL=50V, f=1MHz 9 6 Load current derates linearly from 120mA @ 25oC to 60mA @ 85oC, and must be derated for both poles operating simultaneously. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 4mA is recommended. www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC2330N Common Performance Data* 30 Typical LED Forward Voltage Drop (N=50, IF=5mA) Device Count (N) 25 20 15 10 5 0 1.364 Maximum Load Current vs. Temperature Typical LED Forward Voltage Drop vs. Temperature Energy Rating Curve 0.9 140 1.8 0.8 1.7 1.6 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 120 Load Current (A) Load Current (mA) LED Forward Voltage Drop (V) 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) 100 80 60 0.7 0.6 0.5 0.4 0.3 0.2 1.1 0.1 10Ps 100Ps 1ms 10ms 100ms Time 40 1.0 -50 -25 0 25 50 Temperature (ºC) 75 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 1s 10s 100s FORM-A Performance Data* 45 Typical IF for Switch Operation (N=50, IL=120mA) Typical Turn-On Time (N=50, IF=5mA, IL=60mA) 20 Typical Turn-Off Time (N=50, IF=5mA, IL=60mA) 25 30 25 20 15 10 Device Count (N) 35 Device Count (N) Device Count (N) 40 15 10 5 20 15 10 5 5 0 0 0.18 0.19 0.20 0.21 LED Forward Current (mA) Device Count (N) 25 0.22 0 0.75 0.80 0.85 0.90 0.95 1.00 Turn-On Time (ms) Typical On-Resistance Distribution (N=50, IF=2mA, IL=120mA) 20 25 Device Count (N) 0.17 15 10 5 1.05 0.311 0.318 0.325 0.332 0.339 0.346 0.353 Turn-Off Time (ms) Typical Blocking Voltage Distribution (N=50, IF=0mA) 20 15 10 5 0 0 18.75 19.00 19.25 19.50 19.75 20.00 20.25 On-Resistance (:) 416 419 422 425 428 Blocking Voltage (VP) 431 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R06 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC2330N FORM-A Performance Data (Cont.)* Typical IF for Switch Operation (IL=60mA) 0.24 7 0.18 0.16 0.14 5 4 3 2 0 20 40 60 Temperature (ºC) 80 Typical On-Resistance vs. Temperature (IF=20mA, IL=60mA) 32 Turn-On Time (ms) 28 26 24 22 20 18 -40 -20 0 20 40 60 Temperature (ºC) 80 Typical Load Current vs. Load Voltage (IF=0mA) 0.15 Blocking Voltage (VP) 0.05 0.00 -0.05 -0.10 -0.15 -3 -2 -1 0 1 Load Voltage (V) 2 3 20 30 LED Current (mA) 40 10 20 30 LED Current (mA) 40 50 Typical Turn-Off Time vs. Temperature (IL=60mA) 1.0 0.8 0.6 IF=5mA 0.4 IF=2mA 0.2 0 -20 0 20 40 60 Temperature (ºC) 80 100 -40 Typical Blocking Voltage vs. Temperature (IF=0mA) 0.030 450 440 430 420 410 400 390 -40 -20 0 20 40 60 Temperature (ºC) 80 100 -20 0 20 40 60 Temperature (ºC) 80 100 Leakage Current vs. Temperature Measured Across Pins 5 & 6 (IF=0mA, VL=350V) 0.025 0.020 0.015 0.010 0.005 0.000 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) 50 Output Capacitance (pF) 0 50 IF=5mA 460 0.10 10 IF=2mA -40 100 0.32 Typical Turn-On Time vs. Temperature (IL=60mA) 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 30 0.34 0.28 0 100 0.36 Turn-Off Time (ms) 0 Leakage Current (PA) -20 0.38 0.30 1 0.12 -40 On-Resistance (:) Turn-Off Time (ms) Turn-On Time (ms) LED Current (mA) 0.20 Typical Turn-Off Time vs. LED Forward Current (IL=60mA) 0.40 6 0.22 Load Current (A) Typical Turn-On Time vs. LED Forward Current (IL=60mA) 40 30 20 10 0 0.1 1 10 100 Load Voltage (V) 1000 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC2330N FORM-B Performance Data* Typical Turn-On Time (N=50, IF=5mA, IL=60mA) 25 15 10 5 0 25 20 15 10 5 0.14 0.16 0.18 0.20 LED Current (mA) 0.24 0.26 0.28 0.30 0.32 0.34 Turn-On Time (ms) Typical On-Resistance Distribution (N=50, IF=0mA, IL=120mA) 25 15 10 5 23.75 24.50 25.25 26.00 26.75 27.50 28.25 On-Resistance (:) 0.20 0.6 0.5 0.4 0.3 0.2 0 20 40 60 Temperature (ºC) 80 0.38 15 10 5 400 410 420 430 440 450 Blocking Voltage (VP) 460 470 Typical Turn-Off Time vs. LED Forward Current 0.318 1.2 0.316 1.0 0.314 0.312 0.310 0.308 0.8 0.6 0.4 0.2 0 0 100 Typical On-Resistance vs. Temperature (IF=0mA, IL=60mA) 45 0.26 0.29 0.32 0.35 Turn-Off Time (ms) 20 0.306 -20 0.23 Typical Blocking Voltage Distribution (N=50, IF=2mA) Turn-Off Time (ms) Turn-On Time (ms) LED Current (mA) 0.36 Typical Turn-On Time vs. LED Forward Current Typical IF for Switch Operation (IL=60mA) 0.7 0.1 -40 10 0 0 0.8 15 0 0.22 Device Count (N) Device Count (N) 20 20 5 0 0.12 Typical Turn-Off Time (N=50, IF=5mA, IL=60mA) 30 Device Count (N) 20 Device Count (N) Device Count (N) 25 Typical IF for Switch Operation (N=50, IL=120mA) 10 20 30 LED Current (mA) 40 0 50 Typical Turn-On Time vs. Temperature (IL=60mA) 0.50 10 20 30 LED Current (mA) 40 50 Typical Turn-Off Time vs. Temperature (IL=60mA) 2.0 35 30 25 Turn-Off Time (ms) 40 Turn-On Time (ms) On-Resistance (:) 0.45 0.40 0.35 IF=5mA 0.30 0.25 IF=2mA 0.20 1.6 IF=2mA 1.2 0.8 0.4 0.15 20 -40 -20 0 20 40 60 Temperature (ºC) 80 100 0.10 -40 IF=5mA 0 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R06 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC2330N FORM-B PERFORMANCE DATA (Cont.)* Typical Load Current vs. Load Voltage (IF=0mA) 465 Blocking Voltage (VP) Load Current (A) 0.10 0.05 0.00 -0.05 -0.10 -4 -3 -2 -1 0 1 Load Voltage (V) 2 3 460 4 455 450 445 4 Output Capacitence (pF) 70 3 2 1 440 -40 -0.15 Leakage Current vs. Temperature Measured Across Pins 7 & 8 (IF=2mA, VL=350V) 5 Leakage (PA) 0.15 Typical Blocking Voltage vs. Temperature (IF=5mA) 0 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Output Capacitance vs. Load Voltage (IF=2mA, f=1MHz) 60 50 40 30 20 10 0 0.1 1 10 100 Load Voltage (V) 1000 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 6 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC2330N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC2330N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles CPC2330N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R06 www.ixysic.com 7 INTEGRATED CIRCUITS DIVISION CPC2330N Mechanical Dimensions CPC2330N 1.016 ± 0.025 (0.040 ± 0.001) 9.347 ± 0.203 (0.368 ± 0.008) Pin 1 2.184 MAX (0.086 MAX) 0.432 ± 0.127 (0.017 ± 0.005) Pin to Package Standoff MIN 0.0254 (0.001) (MAX 0.102 (0.004) 0.838 ± 0.102 (0.033 ± 0.004) PCB Land Pattern 5.60 (0.22) 1.30 (0.051) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.051 (0.150 ± 0.002) 2.540 TYP (0.100 TYP) 0.203 ± 0.025 (0.008 ± 0.001) 0.381 ± 0.051 (0.015 ± 0.002) 2.54 (0.100) 0.55 (0.022) Dimensions mm (inches) Note: 1. Lead dimensions do not include plating: 1000 microinches max. CPC2330NTR Tape & Reel 1.75 ± 0.10 330.2 DIA. (13.00 DIA.) 4.00 ± 0.10 P1=8.00 ± 0.10 2.00 ± 0.10 Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 1.20 7.50 ± 0.10 Ø1.50 +0.1, -0 6.50 9.65 ± 0.10 16.00 ± 0.30 Embossed Carrier Direction of feed 3.50 Embossment 6.55 ± 0.10 2.35 ± 0.10 NOTES: 1. All dimensions in millimeters 2. 10 sprocket hole pitch cumulative tolerance ± 0.20. 3. Carrier camber is within 1mm in 250mm. Ø1.50 MIN 2.85 ± 0.10 4. Tape material : Black Conductive Polystyrene Alloy. 5. All dimensions meet EIA-481-C requirements. 6. Thickness : 0.30 ± 0.05mm. For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 8 Specification: DS-CPC2330N-R06 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 9/29/2021