CS20-25moT1
VDRM = 2500 V
ITSM = 200 A
High Voltage
Phase Control Thyristor
Backside = anode
4
1
3
Features / Advantages:
Applications:
Package: TO-268AA (D3Pak)
• high voltage thyristor
- for line frequency
- chip technology for long term stability
- planar glass passivated
• controlled rectifiers
- power supplies
- drives
• AC switches
• capacitor discharge control
- flash tubes
- X-ray and laser generators
• Industry standard outline
• RoHS compliant
• Epoxy meets UL 94V-0
Disclaimer Notice
Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
IXYS reserves the right to change limits, test conditions and dimensions.
© 2022 IXYS All rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20220623c
1-3
CS20-25moT1
Rectifier
Ratings
Symbol
Definitions
VDRM/DSM
max.
Unit
max. repetitive/non-repetitive forward blocking voltage
2500
V
VRRM/RSM
max. repetitive/non-repetitive reverse blocking voltage
1650
V
IRRM/DRM
max. repetitive off-state current
VR = VRRM
VD = VDRM
TVJ = 25°C
TVJ = 70°C
50
200
µA
µA
IDSM/RSM
max. non-repetitive off-state current
VR = VRSM; VD = VDSM
TVJ = 70°C
2
mA
ITSM
max. forward surge current
t = 10 ms, sine; VR = 0 V
TVJ = 25°C
200
A
(di/dt)cr
critical rate of rise of current
f = 50 Hz; tp = 200 µs; VD = 2000 V
diG /dt = 0.45 A/µs;
IG = 0.45 A
non repetitive;
IT = 45 A
150
A/µs
(dv/dt)cr
critical rate of rise of voltage
VD = 2200 V
RGK = ; method 1 (linear voltage rise)
5000
V/µs
VT
forward voltage drop
IT = 45 A
TVJ = 25°C
3.0
V
VGT
IGT
gate trigger voltage
gate trigger current
VD = 6 V
TVJ = 25°C
2.5
250
V
mA
VGD
IGD
gate non-trigger voltage
gate non-trigger current
VD = 2/3 VDRM
TVJ = 25°C
0.2
5
V
mA
IL
latching current
tp = 10 µs; VD = 6 V
IG = 0.45 A; diG /dt = 0.45 A/µs
TVJ =
700
mA
IH
holding current
VD = 6 V; RGK =
TVJ = 0°C
TVJ = 70°C
300
mA
mA
100
µs
0.8
K/W
tq
turn-off time
RthJC
thermal resistance junction to case
RthCH
thermal resistance case to heatsink
IXYS reserves the right to change limits, test conditions and dimensions.
© 2022 IXYS All rights reserved
Conditions
VR = 10 V; IT = 20 A; VD = 800 V
di/dt = -20 A/µs; dv/dt = 20 V/µs
tp = 300 µs
min.
typ.
0°C
55
TVJ = 70°C
0.15
Data according to IEC 60747and per semiconductor unless otherwise specified
K/W
20220623c
2-3
CS20-25moT1
Package TO-268AA (D3Pak)
Ratings
Symbol
Definitions
Conditions
IRMS
RMS current
per terminal
TVJ
virtual junction temperature
Top
Tstg
min.
typ.
max.
Unit
70
A
-10
70
°C
operation temperature
-10
70
°C
storage temperature
-40
70
°C
Weight
4
Fc
mounting force with clip
dSpp/App
dSpb/Apb
creepage distance on surface | striking distance through air
20
terminal to terminal
terminal to backside
g
120
N
9.4
5.6
mm
mm
Product Marking
Logo + ESD
IXYS
Part No.
Date Code
Assembly Line
yywwL 123456
Assembly Code
Ordering
Part Name
Marking on Product
Delivering Mode
Base Qty
Ordering Code
Standard
CS20-25moT1-TUB
CS20-25moT1
Tube
30
CS20-25moT1-TUB
Outlines TO-268AA (D3Pak)
Dim.
A
A1
A2
b
b2
C
C2
D
D1
E
E1
e
H
L
L1
L2
L3
L4
IXYS reserves the right to change limits, test conditions and dimensions.
© 2022 IXYS All rights reserved
Millimeter
min
max
4.90
5.10
2.70
2.90
0.02
0.25
1.15
1.45
1.90
2.10
0.40
0.65
1.45
1.60
13.80 14.00
12.40 12.70
15.85 16.05
13.30 13.60
5.45 BSC
18.70 19.10
2.40
2.70
1.20
1.40
1.00
1.15
0.25 BSC
3.80
4.10
Data according to IEC 60747and per semiconductor unless otherwise specified
Inches
min
max
0.193 0.201
0.106 0.114
0.001 0.100
0.045 0.057
0.075 0.083
0.016 0.026
0.057 0.063
0.543 0.551
0.488 0.500
0.624 0.632
0.524 0.535
0.215 BSC
0.736 0.752
0.094 0.106
0.047 0.055
0.039 0.045
0.100 BSC
0.150 0.161
20220623c
3-3
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