DAA10EM1800PZ
preliminary
Avalanche Rectifier
VRRM
=
1800 V
I FAV
=
10 A
VF
=
1.14 V
Single Diode
Part number
DAA10EM1800PZ
Marking on Product: DAA10EM1800PZ
Backside: anode
1
3
4
Features / Advantages:
Applications:
Package: TO-263 (D2Pak-HV)
● Avalanche rated
● Planar passivated chips
● Very low leakage current
● Very low forward voltage drop
● Improved thermal behaviour
● Diode for main rectification
● For single and three phase
bridge configurations
● Industry standard outline
● RoHS compliant
● Epoxy meets UL 94V-0
● High creepage distance
between terminals
Disclaimer Notice
Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
IXYS reserves the right to change limits, conditions and dimensions.
© 2019 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20190212b
DAA10EM1800PZ
preliminary
Ratings
Rectifier
Conditions
Symbol
VRSM
Definition
max. non-repetitive reverse blocking voltage
TVJ = 25°C
VRRM
max. repetitive reverse blocking voltage
TVJ = 25°C
IR
reverse current
VF
forward voltage drop
I FAV
average forward current
VF0
threshold voltage
rF
slope resistance
R thJC
thermal resistance junction to case
thermal resistance case to heatsink
total power dissipation
I FSM
max. forward surge current
I²t
value for fusing
V
TVJ = 25°C
10
µA
0.7
mA
TVJ = 25°C
1.21
V
1.43
V
1.14
V
IF =
10 A
IF =
20 A
IF =
10 A
IF =
20 A
TVJ = 150 °C
TC = 150 °C
1.45
V
T VJ = 175 °C
10
A
TVJ = 175 °C
0.81
V
32
mΩ
d = 0.5
1.5 K/W
K/W
0.25
TC = 25°C
100
W
t = 10 ms; (50 Hz), sine
TVJ = 45°C
150
A
t = 8,3 ms; (60 Hz), sine
VR = 0 V
160
A
t = 10 ms; (50 Hz), sine
TVJ = 150 °C
130
A
t = 8,3 ms; (60 Hz), sine
VR = 0 V
140
A
t = 10 ms; (50 Hz), sine
TVJ = 45°C
115
A²s
t = 8,3 ms; (60 Hz), sine
VR = 0 V
105
A²s
t = 10 ms; (50 Hz), sine
TVJ = 150 °C
85
A²s
82
A²s
t = 8,3 ms; (60 Hz), sine
VR = 0 V
junction capacitance
VR = 400 V; f = 1 MHz
TVJ = 25°C
PRSM
max. surge reverse dissipation
t p = 10 µs
TVJ = 175 °C
© 2019 IXYS all rights reserved
1800
TVJ = 150°C
CJ
IXYS reserves the right to change limits, conditions and dimensions.
max. Unit
1900
V
VR = 1800 V
for power loss calculation only
R thCH
typ.
VR = 1800 V
rectangular
Ptot
min.
Data according to IEC 60747and per semiconductor unless otherwise specified
4
pF
1.6
kW
20190212b
DAA10EM1800PZ
preliminary
Package
Ratings
TO-263 (D2Pak-HV)
Symbol
I RMS
Definition
Conditions
RMS current
per terminal
min.
TVJ
virtual junction temperature
T op
operation temperature
Tstg
storage temperature
-55
max.
35
Unit
A
-55
175
°C
-55
150
°C
150
°C
1.5
Weight
FC
20
mounting force with clip
d Spp/App
typ.
Product Marking
D
A
A
10
EM
1800
PZ
IXYS Zyyww
Logo
Assembly Line
Date Code
N
4.2
mm
terminal to backside
4.7
mm
Part description
XXXXXXXXX
Part No.
60
terminal to terminal
creepage distance on surface | striking distance through air
d Spb/Apb
g
=
=
=
=
=
=
=
Diode
Avalanche Rectifier
(up to 1800V)
Current Rating [A]
Single Diode
Reverse Voltage [V]
TO-263AB (D2Pak) (2HV)
000000
Assembly Code
Ordering
Standard
Alternative
Ordering Number
DAA10EM1800PZ-TRL
DAA10EM1800PZ-TUB
Equivalent Circuits for Simulation
I
V0
R0
Marking on Product
DAA10EM1800PZ
DAA10EM1800PZ
* on die level
Delivery Mode
Tape & Reel
Tube
Code No.
513894
523835
T VJ = 175 °C
Rectifier
V 0 max
threshold voltage
0.81
V
R0 max
slope resistance *
10.2
mΩ
IXYS reserves the right to change limits, conditions and dimensions.
© 2019 IXYS all rights reserved
Quantity
800
50
Data according to IEC 60747and per semiconductor unless otherwise specified
20190212b
DAA10EM1800PZ
preliminary
Outlines TO-263 (D2Pak-HV)
Dim.
W
Supplier
Option
D1
L1
c2
A1
H
D
E
A
1
4
3
L
e1
D2
A2
c
2x e
2x b2
10.92
(0.430)
W
E1
Inches
min
max
0.160 0.190
typ. 0.004
0.095
0.020 0.039
0.045 0.055
0.016 0.029
0.045 0.055
0.330 0.370
0.315 0.350
0.091
0.380 0.410
0.245 0.335
0,100 BSC
0.169
0.575 0.625
0.070 0.110
0.040 0.066
typ.
0.002
0.0008
All dimensions conform with
and/or within JEDEC standard.
1.78
(0.07)
3.05
(0.120)
3.81
(0.150)
9.02
(0.355)
mm (Inches)
2x b
A
A1
A2
b
b2
c
c2
D
D1
D2
E
E1
e
e1
H
L
L1
Millimeter
min
max
4.06
4.83
typ. 0.10
2.41
0.51
0.99
1.14
1.40
0.40
0.74
1.14
1.40
8.38
9.40
8.00
8.89
2.3
9.65
10.41
6.22
8.50
2,54 BSC
4.28
14.61 15.88
1.78
2.79
1.02
1.68
typ.
0.040
0.02
2.54 (0.100)
Recommended min. foot print
1
3
IXYS reserves the right to change limits, conditions and dimensions.
© 2019 IXYS all rights reserved
4
Data according to IEC 60747and per semiconductor unless otherwise specified
20190212b
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