DPG10IM300UC

DPG10IM300UC HiPerFRED VRRM = 300 V I FAV = 10 A t rr = 35 ns High Performance Fast Recovery Diode Low Loss and Soft Recovery Single Diode Part number DPG10IM300UC Marking on Product: PAOGUI Backside: cathode 1 3 2/4 Features / Advantages: Applications: Package: TO-252 (DPak) ● Planar passivated chips ● Very low leakage current ● Very short recovery time ● Improved thermal behaviour ● Very low Irm-values ● Very soft recovery behaviour ● Avalanche voltage rated for reliable operation ● Soft reverse recovery for low EMI/RFI ● Low Irm reduces: - Power dissipation within the diode - Turn-on loss in the commutating switch ● Antiparallel diode for high frequency switching devices ● Antisaturation diode ● Snubber diode ● Free wheeling diode ● Rectifiers in switch mode power supplies (SMPS) ● Uninterruptible power supplies (UPS) ● Industry standard outline ● RoHS compliant ● Epoxy meets UL 94V-0 Disclaimer Notice Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. IXYS reserves the right to change limits, conditions and dimensions. © 2020 IXYS all rights reserved Data according to IEC 60747and per semiconductor unless otherwise specified 20200211c DPG10IM300UC Ratings Fast Diode Conditions Symbol VRSM Definition max. non-repetitive reverse blocking voltage TVJ = 25°C VRRM max. repetitive reverse blocking voltage TVJ = 25°C IR reverse current, drain current VF forward voltage drop I FAV average forward current VF0 threshold voltage rF slope resistance R thJC thermal resistance junction to case min. typ. max. Unit 300 V 300 V VR = 300 V TVJ = 25°C 1 µA VR = 300 V TVJ = 150°C 0.06 mA IF = 10 A TVJ = 25°C 1.27 V IF = 20 A 1.45 V IF = 10 A 0.98 V IF = 20 A TVJ = 150 °C TC = 150 °C rectangular 1.17 V T VJ = 175 °C 10 A TVJ = 175 °C 0.74 V 17.7 mΩ d = 0.5 for power loss calculation only 2.3 K/W K/W R thCH thermal resistance case to heatsink Ptot total power dissipation I FSM max. forward surge current t = 10 ms; (50 Hz), sine; VR = 0 V TVJ = 45°C VR = 150 V f = 1 MHz TVJ = 25°C 15 pF TVJ = 25 °C 3 A TVJ = 125 °C 5.5 A TVJ = 25 °C 35 ns TVJ = 125 °C 45 ns CJ junction capacitance I RM max. reverse recovery current t rr reverse recovery time 0.5 TC = 25°C IF = IXYS reserves the right to change limits, conditions and dimensions. © 2020 IXYS all rights reserved 10 A; VR = 200 V -di F /dt = 200 A/µs 65 140 Data according to IEC 60747and per semiconductor unless otherwise specified W A 20200211c DPG10IM300UC Package Ratings TO-252 (DPak) Symbol I RMS Definition Conditions RMS current per terminal min. TVJ virtual junction temperature T op operation temperature Tstg storage temperature -55 max. 20 Unit A -55 175 °C -55 150 °C 150 °C 0.3 Weight FC 1) typ. 1) 20 mounting force with clip g 60 N IRMS is typically limited by the pin-to-chip resistance (1); or by the current capability of the chip (2). In case of (1) and a product with multiple pins for one chip-potential, the current capability can be increased by connecting the pins as one contact. Product Marking Date Code D P G 10 IM 300 UC IXYS Logo Part Number Part description XXXXXX yyZ = = = = = = = Diode HiPerFRED extreme fast Current Rating [A] Single Diode Reverse Voltage [V] TO-252AA (DPak) ww Location Ordering Standard Alternative Ordering Number DPG10IM300UC-TRL DPG10IM300UC-TUB Similar Part DPG10I300PA Equivalent Circuits for Simulation I V0 R0 Marking on Product PAOGUI PAOGUI Package TO-220AC (2) * on die level Delivery Mode Tape & Reel Tube Code No. 505682 524908 Voltage class 300 T VJ = 175°C Fast Diode V 0 max threshold voltage 0.74 V R0 max slope resistance * 14.5 mΩ IXYS reserves the right to change limits, conditions and dimensions. © 2020 IXYS all rights reserved Quantity 2500 70 Data according to IEC 60747and per semiconductor unless otherwise specified 20200211c DPG10IM300UC Outlines TO-252 (DPak) 1 3 IXYS reserves the right to change limits, conditions and dimensions. © 2020 IXYS all rights reserved 2/4 Data according to IEC 60747and per semiconductor unless otherwise specified 20200211c DPG10IM300UC Fast Diode 30 0.3 20 A VR = 200 V 25 TVJ = 125°C 10 0.2 20 A VR = 200 V 10 A TVJ = 25°C 125°C 150°C 20 IF 12 TVJ = 125°C 10 A 8 Qrr 5A 5A IRR 15 6 [μC] [A] 10 [A] 0.1 4 5 2 0 0.0 0.0 0.4 0.8 1.2 1.6 2.0 0 0 100 VF [V] 200 300 400 500 0 100 -diF /dt [A/μs] Fig. 1 Forward current IF versus VF 300 400 500 Fig. 3 Typ. reverse recov. current IRR versus -diF /dt Fig. 2 Typ. reverse recov. charge Qrr versus -diF /dt 1.4 200 -diF /dt [A/μs] 80 12 600 10 500 TVJ = 125°C 1.2 VR = 200 V 1.0 60 0.8 8 trr Kf 0.6 IF = 20 A [ns] IRR [V] 4 2 5A 0.0 20 0 300 [ns] 200 10 A Qrr 0.2 tfr IF = 10 A VR = 200 V 6 40 0.4 400 TVJ = 125°C VFR 40 80 120 160 tfr 0 0 TVJ [°C] 100 200 300 400 500 0 -diF /dt [A/μs] Fig. 4 Typ. dynamic parameters Qrr, IRR versus TVJ VFR 100 200 300 400 100 0 500 -diF /dt [A/μs] Fig. 5 Typ. reverse recov. time trr versus -diF /dt Fig. 6 Typ. forward recov. voltage VFR and tfr versus diF /dt 3 10 TVJ = 125°C VR = 200 V 8 Erec [μJ] 2 IF = 5 A 6 ZthJH 10 A 20 A [K/W] 4 1 2 0 0 100 200 300 400 500 -diF /dt [A/μs] Fig. 7 Typ. recovery energy Erec versus -diF /dt IXYS reserves the right to change limits, conditions and dimensions. © 2020 IXYS all rights reserved 0 0.001 0.01 0.1 Rthi [K/W] ti [s] 0.3866 0.7062 0.8127 0.3945 0.0004 0.0025 0.022 0.13 1 10 t [s] Fig. 8 Transient thermal resistance junction to case Data according to IEC 60747and per semiconductor unless otherwise specified 20200211c