DPG60I300HA
HiPerFRED
VRRM
=
300 V
I FAV
=
60 A
t rr
=
35 ns
High Performance Fast Recovery Diode
Low Loss and Soft Recovery
Single Diode
Part number
DPG60I300HA
Backside: cathode
3
1
Features / Advantages:
Applications:
Package: TO-247
● Planar passivated chips
● Very low leakage current
● Very short recovery time
● Improved thermal behaviour
● Very low Irm-values
● Very soft recovery behaviour
● Avalanche voltage rated for reliable operation
● Soft reverse recovery for low EMI/RFI
● Low Irm reduces:
- Power dissipation within the diode
- Turn-on loss in the commutating switch
● Antiparallel diode for high frequency
switching devices
● Antisaturation diode
● Snubber diode
● Free wheeling diode
● Rectifiers in switch mode power
supplies (SMPS)
● Uninterruptible power supplies (UPS)
● Industry standard outline
● RoHS compliant
● Epoxy meets UL 94V-0
Disclaimer Notice
Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20200211c
DPG60I300HA
Ratings
Fast Diode
Conditions
Symbol
VRSM
Definition
max. non-repetitive reverse blocking voltage
TVJ = 25°C
VRRM
max. repetitive reverse blocking voltage
TVJ = 25°C
IR
reverse current, drain current
VF
forward voltage drop
min.
typ.
300
TVJ = 25°C
1
µA
VR = 300 V
TVJ = 150°C
0.35
mA
IF =
TVJ = 25°C
1.40
V
1.72
V
1.10
V
IF =
60 A
TVJ = 150 °C
60 A
I F = 120 A
average forward current
VF0
threshold voltage
rF
slope resistance
R thJC
thermal resistance junction to case
V
VR = 300 V
I F = 120 A
I FAV
max. Unit
300
V
TC = 130 °C
rectangular
1.45
V
T VJ = 175 °C
60
A
TVJ = 175 °C
0.69
V
5.8
mΩ
d = 0.5
for power loss calculation only
0.55 K/W
K/W
R thCH
thermal resistance case to heatsink
Ptot
total power dissipation
I FSM
max. forward surge current
t = 10 ms; (50 Hz), sine; VR = 0 V
TVJ = 45°C
VR = 150 V f = 1 MHz
TVJ = 25°C
80
pF
TVJ = 25 °C
3.5
A
CJ
junction capacitance
I RM
max. reverse recovery current
t rr
reverse recovery time
0.3
TC = 25°C
IF =
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
60 A; VR = 150 V
-di F /dt = 200 A/µs
275
550
W
A
TVJ = 125 °C
9
A
TVJ = 25 °C
35
ns
TVJ = 125 °C
65
ns
Data according to IEC 60747and per semiconductor unless otherwise specified
20200211c
DPG60I300HA
Package
Ratings
TO-247
Symbol
I RMS
Definition
Conditions
RMS current
per terminal
min.
TVJ
virtual junction temperature
T op
operation temperature
Tstg
storage temperature
-55
typ.
max.
70
Unit
A
-55
175
°C
-55
150
°C
150
°C
6
Weight
MD
mounting torque
FC
mounting force with clip
Product Marking
0.8
1.2
Nm
20
120
N
Part description
D
P
G
60
I
300
HA
IXYS
Logo
g
=
=
=
=
=
=
=
Diode
HiPerFRED
extreme fast
Current Rating [A]
Single Diode
Reverse Voltage [V]
TO-247AD (2)
XXXXXXXXX
Part Number
Date Code
yywwZ
1234
Lot#
Location
Ordering
Standard
Ordering Number
DPG60I300HA
Similar Part
DPG60IM300PC
Equivalent Circuits for Simulation
I
V0
R0
Marking on Product
DPG60I300HA
Package
TO-263AB (D2Pak) (2)
* on die level
Delivery Mode
Tube
Code No.
585818
Voltage class
300
T VJ = 175°C
Fast
Diode
V 0 max
threshold voltage
0.69
V
R0 max
slope resistance *
3.2
mΩ
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
Quantity
30
Data according to IEC 60747and per semiconductor unless otherwise specified
20200211c
DPG60I300HA
Outlines TO-247
A
E
A2
D2
Ø P1
ØP
S
Q
D1
D
2x E2
4
1
2
3
L1
E1
L
2x b2
2x b
e
C
A1
3
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
Sym.
Inches
min.
max.
Millimeter
min.
max.
A
A1
A2
D
E
E2
e
L
L1
ØP
Q
S
b
b2
b4
c
D1
D2
E1
Ø P1
0.185 0.209
0.087 0.102
0.059 0.098
0.819 0.845
0.610 0.640
0.170 0.216
0.430 BSC
0.780 0.800
0.177
0.140 0.144
0.212 0.244
0.242 BSC
0.039 0.055
0.065 0.094
0.102 0.135
0.015 0.035
0.515
0.020 0.053
0.530
0.29
4.70
5.30
2.21
2.59
1.50
2.49
20.79 21.45
15.48 16.24
4.31
5.48
10.92 BSC
19.80 20.30
4.49
3.55
3.65
5.38
6.19
6.14 BSC
0.99
1.40
1.65
2.39
2.59
3.43
0.38
0.89
13.07
0.51
1.35
13.45
7.39
1
Data according to IEC 60747and per semiconductor unless otherwise specified
20200211c
DPG60I300HA
Fast Diode
120
0.7
100
0.6
20
18
IF = 120 A
60 A
30 A
80
0.5
IF
14
IRM
Qrr
60
[A]
12
0.4
TVJ = 150°C
40
[A] 10
[μC]
8
0.3
20
TVJ = 125°C
VR = 200 V
25°C
0.4
0.8
1.2
1.6
4
0
2.0
VF [V]
Fig. 1 Forward current
IF versus VF
200
400
600
0
-diF /dt [A/μs]
Fig. 2 Typ. reverse recov. charge
Qrr versus -diF /dt
1.4
1000
TVJ = 125°C
VR = 200 V
1.2
70
800
tfr
trr
60
IF = 120 A
60 A
30 A
50
Qrr
0.2
0
40
40
80
120
160
9
8
700
7
600
6
500
5
400
4
300
3
200
400
VFR
[V]
600
0
-diF /dt [A/μs]
200
400
2
600
-diF /dt [A/μs]
Fig. 5 Typ. reverse recov. time
trr versus -diF /dt
Fig. 4 Typ. dynamic parameters
Qrr, IRM versus TVJ
Fig. 6 Typ. forward recovery voltage
VFR & time tfr versus diF /dt
1.0
14
IF = 120 A
12
60 A
30 A
10
Erec
10
VFR
200
0
TVJ [°C]
16
600
[ns]
[ns]
0.6
IRM
400
TVJ = 125°C
VR = 200 V
IF = 60 A
tfr
900
1.0
0.4
200
-diF /dt [A/μs]
Fig. 3 Typ. reverse recov. current
IRM versus -diF /dt
80
Kf 0.8
TVJ = 125°C
VR = 200 V
6
0.2
0.0
IF = 120 A
60 A
30 A
16
ZthJC
8
[K/W]
[μJ] 6
4
TVJ = 125°C
VR = 200 V
2
0
200
400
600
0.1
10 0
-diF /dt [A/μs]
Fig. 7 Typ. recovery energy
Erec versus -diF /dt
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
10 1
10 2
10 3
10 4
t [ms]
Fig. 8 Transient thermal impedance junction to case
Data according to IEC 60747and per semiconductor unless otherwise specified
20200211c
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