DSA120C150QB
Schottky Diode Gen ²
VRRM
=
I FAV
= 2x
60 A
VF
=
0.8 V
150 V
High Performance Schottky Diode
Low Loss and Soft Recovery
Common Cathode
Part number
DSA120C150QB
Backside: cathode
1
2
3
Features / Advantages:
Applications:
Package: TO-3P
● Very low Vf
● Extremely low switching losses
● Low Irm values
● Improved thermal behaviour
● High reliability circuit operation
● Low voltage peaks for reduced
protection circuits
● Low noise switching
● Rectifiers in switch mode power
supplies (SMPS)
● Free wheeling diode in low voltage
converters
● Industry standard outline
compatible with TO-247
● RoHS compliant
● Epoxy meets UL 94V-0
Disclaimer Notice
Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20200127c
DSA120C150QB
Ratings
Schottky
Conditions
Symbol
VRSM
Definition
max. non-repetitive reverse blocking voltage
TVJ = 25°C
VRRM
max. repetitive reverse blocking voltage
TVJ = 25°C
150
IR
reverse current, drain current
VF
forward voltage drop
min.
typ.
VR = 150 V
TVJ = 25°C
900
µA
TVJ = 125°C
5
mA
IF =
TVJ = 25°C
0.93
V
1.13
V
0.80
V
IF =
60 A
TVJ = 125 °C
60 A
I F = 120 A
average forward current
VF0
threshold voltage
rF
slope resistance
R thJC
thermal resistance junction to case
TC = 150 °C
rectangular
1.03
V
T VJ = 175 °C
60
A
TVJ = 175 °C
0.51
V
3.9
mΩ
d = 0.5
for power loss calculation only
0.4 K/W
R thCH
thermal resistance case to heatsink
Ptot
total power dissipation
I FSM
max. forward surge current
t = 10 ms; (50 Hz), sine; VR = 0 V
TVJ = 45°C
CJ
junction capacitance
VR =
TVJ = 25°C
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
V
VR = 150 V
I F = 120 A
I FAV
max. Unit
150
V
K/W
0.3
TC = 25°C
24 V f = 1 MHz
481
Data according to IEC 60747and per semiconductor unless otherwise specified
375
W
1.20
kA
pF
20200127c
DSA120C150QB
Package
Ratings
TO-3P
Symbol
I RMS
Definition
Conditions
RMS current
per terminal
min.
TVJ
virtual junction temperature
T op
operation temperature
Tstg
storage temperature
-55
typ.
max.
70
Unit
A
-55
175
°C
-55
150
°C
150
°C
1)
5
Weight
MD
mounting torque
FC
mounting force with clip
Product Marking
Logo
Part Number
Date Code
Lot#
g
0.8
1.2
Nm
20
120
N
Part description
D
S
A
120
C
150
QB
IXYS
yywwZ
=
=
=
=
=
=
=
Diode
Schottky Diode
low VF
Current Rating [A]
Common Cathode
Reverse Voltage [V]
TO-3P (3)
1234
Location
Ordering
Standard
Ordering Number
DSA120C150QB
Equivalent Circuits for Simulation
I
V0
R0
Marking on Product
DSA120C150QB
* on die level
Delivery Mode
Tube
Tube
Code No.
501788
T VJ = 175°C
Schottky
V 0 max
threshold voltage
0.51
V
R0 max
slope resistance *
1.3
mΩ
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
Quantity
30
Data according to IEC 60747and per semiconductor unless otherwise specified
20200127c
DSA120C150QB
Outlines TO-3P
1
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
2
3
Data according to IEC 60747and per semiconductor unless otherwise specified
20200127c
DSA120C150QB
Schottky
120
100
100
10
80
1
IF
TVJ =
150°C
125°C
25°C
[A]
40
TVJ=175°C
150°C
IR
60
10000
CT
125°C
TVJ = 25°C
1000
[mA]
0.1
[pF]
100°C
75°C
0.01
20
50°C
25°C
0.001
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0
100
50
VF [V]
Fig. 1 Max. forward voltage
drop characteristics
100
150
0
50
100
150
VR [V]
VR [V]
Fig. 2 Typ. reverse current
IR vs. reverse voltage VR
Fig. 3 Typ. junction capacitance
CT vs. reverse voltage VR
60
80
50
DC
60
d = 0.5
40
IF(AV)
P(AV)
40
d=
DC
0.5
0.33
0.25
0.17
0.08
30
[A]
[W]
20
20
10
0
0
0
50
100
150
200
0
10
20 30
TC [°C]
40
50
60
70
IF(AV) [A]
Fig. 5 Forward power loss
characteristics
Fig. 4 Average forward current
IF(AV) vs. case temp TC
0.4
0.3
ZthJC
0.2
Rthi
ti
0.022
0.0002
0.082
0.0032
0.104
0.026
0.165
0.208
0.027
0.79
[K/W]
0.1
0.0
0.001
Note: All curves are per diode
0.01
0.1
1
10
t [s]
Fig. 6 Transient thermal impedance junction to case at various duty cycles
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20200127c
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