DSA300I45NA
preliminary
Schottky Diode Gen ²
VRRM
=
45 V
I FAV
=
300 A
VF
=
0.76 V
High Performance Schottky Diode
Low Loss and Soft Recovery
Single Diode
Part number
DSA300I45NA
Backside: Isolated
2
1
3
4
Features / Advantages:
Applications:
Package: SOT-227B (minibloc)
● Very low Vf
● Extremely low switching losses
● Low Irm values
● Improved thermal behaviour
● High reliability circuit operation
● Low voltage peaks for reduced
protection circuits
● Low noise switching
● Rectifiers in switch mode power
supplies (SMPS)
● Free wheeling diode in low voltage
converters
● Isolation Voltage: 3000 V~
● Industry standard outline
● RoHS compliant
● Epoxy meets UL 94V-0
● Base plate: Copper
internally DCB isolated
● Advanced power cycling
Disclaimer Notice
Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20200127b
DSA300I45NA
preliminary
Ratings
Schottky
Conditions
Symbol
VRSM
Definition
max. non-repetitive reverse blocking voltage
TVJ = 25°C
VRRM
max. repetitive reverse blocking voltage
TVJ = 25°C
IR
reverse current, drain current
VF
forward voltage drop
min.
typ.
45 V
TVJ = 25°C
3
mA
45 V
TVJ = 150°C
30
mA
TVJ = 25°C
0.84
V
1.14
V
0.76
V
TVJ = 125 °C
I F = 300 A
I F = 600 A
VF0
threshold voltage
rF
slope resistance
R thJC
thermal resistance junction to case
TC = 100 °C
rectangular
1.10
V
T VJ = 150 °C
300
A
TVJ = 150 °C
0.41
V
1.12
mΩ
d = 0.5
for power loss calculation only
0.15 K/W
R thCH
thermal resistance case to heatsink
Ptot
total power dissipation
I FSM
max. forward surge current
t = 10 ms; (50 Hz), sine; VR = 0 V
TVJ = 45°C
CJ
junction capacitance
VR =
TVJ = 25°C
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
V
VR =
I F = 600 A
average forward current
45
VR =
I F = 300 A
I FAV
max. Unit
45
V
K/W
0.1
TC = 25°C
5 V f = 1 MHz
16.5
Data according to IEC 60747and per semiconductor unless otherwise specified
830
W
4.80
kA
nF
20200127b
DSA300I45NA
preliminary
Package
Ratings
SOT-227B (minibloc)
Symbol
I RMS
Definition
Conditions
RMS current
per terminal
min.
TVJ
virtual junction temperature
T op
operation temperature
Tstg
storage temperature
-40
typ.
max.
150
Unit
A
-40
150
°C
-40
125
°C
150
°C
1)
30
Weight
g
MD
mounting torque
1.1
1.5
Nm
MT
terminal torque
1.1
1.5
Nm
d Spp/App
d Spb/Apb
VISOL
8.6
50/60 Hz, RMS; IISOL ≤ 1 mA
3.2
mm
6.8
mm
3000
V
2500
V
IRMS is typically limited by the pin-to-chip resistance (1); or by the current capability of the chip (2). In case of (1) and a product
with multiple pins for one chip-potential, the current capability can be increased by connecting the pins as one contact.
Product Marking
Logo
XXXXX ®
yywwZ
1234
Date
Code
Location
Ordering
Standard
D
S
A
300
I
45
NA
=
=
=
=
=
=
=
Diode
Schottky Diode
low VF
Current Rating [A]
Single Diode
Reverse Voltage [V]
SOT-227B (minibloc)
Lot#
Ordering Number
DSA300I45NA
Equivalent Circuits for Simulation
V0
Part description
Part
Number
UL
Similar Part
DSA300I100NA
DSA300I200NA
I
10.5
t = 1 second
isolation voltage
t = 1 minute
1)
terminal to terminal
terminal to backside
creepage distance on surface | striking distance through air
R0
Marking on Product
DSA300I45NA
Package
SOT-227B (minibloc)
SOT-227B (minibloc)
* on die level
Delivery Mode
Tube
Code No.
511251
Voltage class
100
200
T VJ = 150°C
Schottky
V 0 max
threshold voltage
0.41
V
R0 max
slope resistance *
0.28
mΩ
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
Quantity
10
Data according to IEC 60747and per semiconductor unless otherwise specified
20200127b
DSA300I45NA
preliminary
Outlines SOT-227B (minibloc)
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
2
1
3
4
Data according to IEC 60747and per semiconductor unless otherwise specified
20200127b
DSA300I45NA
preliminary
Schottky
600
500
400
IF
300
TVJ =
25°C
125°C
150°C
[A]
200
100
0
0.2
0.4
0.6
0.8
1.0
1.2
VF [V]
Fig. 2 Typ. reverse current
IR vs. reverse voltage VR
Fig. 1 Max. forward voltage
drop characteristics
Fig. 3 Typ. junction capacitance
CT vs. reverse voltage VR
350
dc =
1
0.5
0.4
0.33
0.17
0.08
200
150
P(AV)
RthHA
0.2
0.4
0.6
0.8
1.0
2.0
300
250
IF(AV)
dc =
1
0.5
0.4
0.33
0.17
200
[A]
100
[W]
150
100
50
50
0
0
0
50
100
150 200 250
IF(AV) [A]
0
40
80
120
160
0
40
80
120
160
TC [°C]
Tamb [°C]
Fig. 5 Average forward current
IF(AV) vs. case temp. TC
Fig. 4a Power dissipation versus direct output current
Fig. 4b and ambient temperature
0.16
0.12
ZthJC
Rthi [K/W]
0.017
0.013
0.02
0.05
0.05
0.08
[K/W]
0.04
ti [s]
0.01
0.00001
0.01
0.045
0.3
0.00
1
10
100
1000
10000
t [ms]
Fig. 6 Transient thermal impedance junction to case
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20200127b
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