DSA30C45PC

DSA30C45PC preliminary Schottky Diode Gen ² VRRM = 45 V I FAV = 2x 15 A VF = 0.63 V High Performance Schottky Diode Low Loss and Soft Recovery Common Cathode Part number DSA30C45PC Marking on Product: DSA30C45PC Backside: cathode 1 2/4 3 Features / Advantages: Applications: Package: TO-263 (D2Pak) ● Very low Vf ● Extremely low switching losses ● Low Irm values ● Improved thermal behaviour ● High reliability circuit operation ● Low voltage peaks for reduced protection circuits ● Low noise switching ● Rectifiers in switch mode power supplies (SMPS) ● Free wheeling diode in low voltage converters ● Industry standard outline ● RoHS compliant ● Epoxy meets UL 94V-0 Disclaimer Notice Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. IXYS reserves the right to change limits, conditions and dimensions. © 2019 IXYS all rights reserved Data according to IEC 60747and per semiconductor unless otherwise specified 20190212b DSA30C45PC preliminary Ratings Schottky Conditions Symbol VRSM Definition max. non-repetitive reverse blocking voltage TVJ = 25°C VRRM max. repetitive reverse blocking voltage TVJ = 25°C 45 IR reverse current, drain current VF forward voltage drop I FAV average forward current VF0 threshold voltage rF slope resistance R thJC thermal resistance junction to case min. V 45 V TVJ = 25°C 250 µA VR = 45 V TVJ = 125°C 2.5 mA TVJ = 25°C 0.75 V 0.91 V 0.63 V IF = 15 A IF = 30 A IF = 15 A IF = 30 A TVJ = 125 °C TC = 155 °C 0.79 V T VJ = 175 °C 15 A TVJ = 175 °C 0.42 V 9.9 mΩ d = 0.5 for power loss calculation only 1.75 K/W R thCH thermal resistance case to heatsink Ptot total power dissipation I FSM max. forward surge current t = 10 ms; (50 Hz), sine; VR = 0 V TVJ = 45°C CJ junction capacitance VR = TVJ = 25°C © 2019 IXYS all rights reserved max. Unit 45 V VR = rectangular IXYS reserves the right to change limits, conditions and dimensions. typ. K/W 0.25 TC = 25°C 5 V f = 1 MHz 85 340 497 Data according to IEC 60747and per semiconductor unless otherwise specified W A pF 20190212b DSA30C45PC preliminary Package Ratings TO-263 (D2Pak) Symbol I RMS Definition Conditions RMS current per terminal min. TVJ virtual junction temperature T op operation temperature Tstg storage temperature -55 typ. max. 35 Unit A -55 175 °C -55 150 °C 150 °C 1.5 Weight FC 20 mounting force with clip Product Marking D S A 30 C 45 PC IXYS yywwZ Logo Date Code Location 60 N Part description XXXXXXXXX Part Number g = = = = = = = Diode Schottky Diode low VF Current Rating [A] Common Cathode Reverse Voltage [V] TO-263AB (D2Pak) (2) 123456 Lot# Ordering Standard Alternative Ordering Number DSA30C45PC-TRL DSA30C45PC-TUB Similar Part DSA30C45PB DSA30C45HB Equivalent Circuits for Simulation I V0 R0 Marking on Product DSA30C45PC DSA30C45PC Package TO-220AB (3) TO-247AD (3) * on die level Delivery Mode Tape & Reel Tube Code No. 512243 523682 Voltage class 45 45 T VJ = 175°C Schottky V 0 max threshold voltage 0.42 V R0 max slope resistance * 6.7 mΩ IXYS reserves the right to change limits, conditions and dimensions. © 2019 IXYS all rights reserved Quantity 800 50 Data according to IEC 60747and per semiconductor unless otherwise specified 20190212b DSA30C45PC preliminary Outlines TO-263 (D2Pak) Dim. W A A1 H D E Supplier Option D1 L1 c2 4 L L2 1 2 3 c 2x e 3x b2 10.92 (0.430) E1 W Inches min max 0.160 0.190 typ. 0.004 0.095 0.020 0.039 0.045 0.055 0.016 0.029 0.045 0.055 0.330 0.370 0.315 0.350 0.098 0.380 0.410 0.245 0.335 0,100 BSC 0.169 0.575 0.625 0.070 0.110 0.040 0.066 typ. 0.002 0.0008 All dimensions conform with and/or within JEDEC standard. 1.78 (0.07) 3.05 (0.120) 3.81 (0.150) 9.02 (0.355) mm (Inches) 2x b A A1 A2 b b2 c c2 D D1 D2 E E1 e e1 H L L1 Millimeter min max 4.06 4.83 typ. 0.10 2.41 0.51 0.99 1.14 1.40 0.40 0.74 1.14 1.40 8.38 9.40 8.00 8.89 2.5 9.65 10.41 6.22 8.50 2,54 BSC 4.28 14.61 15.88 1.78 2.79 1.02 1.68 typ. 0.040 0.02 2.54 (0.100) Recommended min. foot print 1 IXYS reserves the right to change limits, conditions and dimensions. © 2019 IXYS all rights reserved 2/4 3 Data according to IEC 60747and per semiconductor unless otherwise specified 20190212b