DSEC30-12A

DSEC30-12A HiPerFRED VRRM = I FAV = 2x 15 A t rr = 40 ns 1200 V High Performance Fast Recovery Diode Low Loss and Soft Recovery Common Cathode Part number DSEC30-12A Backside: cathode 1 2 3 Features / Advantages: Applications: Package: TO-247 ● Planar passivated chips ● Very low leakage current ● Very short recovery time ● Improved thermal behaviour ● Very low Irm-values ● Very soft recovery behaviour ● Avalanche voltage rated for reliable operation ● Soft reverse recovery for low EMI/RFI ● Low Irm reduces: - Power dissipation within the diode - Turn-on loss in the commutating switch ● Antiparallel diode for high frequency switching devices ● Antisaturation diode ● Snubber diode ● Free wheeling diode ● Rectifiers in switch mode power supplies (SMPS) ● Uninterruptible power supplies (UPS) ● Industry standard outline ● RoHS compliant ● Epoxy meets UL 94V-0 Disclaimer Notice Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. IXYS reserves the right to change limits, conditions and dimensions. © 2022 IXYS all rights reserved Data according to IEC 60747and per semiconductor unless otherwise specified 20220610c DSEC30-12A Ratings Fast Diode Conditions Symbol VRSM Definition max. non-repetitive reverse blocking voltage TVJ = 25°C VRRM max. repetitive reverse blocking voltage TVJ = 25°C 1200 IR reverse current, drain current VF forward voltage drop min. typ. max. Unit 1200 V V VR = 1200 V TVJ = 25°C 100 µA VR = 1200 V TVJ = 150°C 0,5 mA TVJ = 25°C 2,61 V 3,17 V 1,86 V IF = 15 A IF = 30 A IF = 15 A IF = 30 A TVJ = 150 °C TC = 120°C 2,54 V T VJ = 175°C 15 A TVJ = 175°C 1,03 V 46 mΩ I FAV average forward current VF0 threshold voltage rF slope resistance R thJC thermal resistance junction to case R thCH thermal resistance case to heatsink Ptot total power dissipation I FSM max. forward surge current t = 10 ms; (50 Hz), sine; VR = 0 V TVJ = 45°C CJ junction capacitance VR = 600 V f = 1 MHz TVJ = 25°C 5 pF I RM max. reverse recovery current TVJ = 25 °C 6 A t rr reverse recovery time rectangular for power loss calculation only 1,6 K/W IXYS reserves the right to change limits, conditions and dimensions. K/W 0,25 TC = 25°C IF = © 2022 IXYS all rights reserved d = 0.5 15 A; VR = 600 V -di F /dt = 200 A/µs 95 90 W A TVJ = 100°C 9 A TVJ = 25 °C 50 ns TVJ = 100°C 140 ns Data according to IEC 60747and per semiconductor unless otherwise specified 20220610c DSEC30-12A Package Ratings TO-247 Symbol I RMS Definition Conditions RMS current per terminal min. TVJ virtual junction temperature T op operation temperature Tstg storage temperature -55 typ. max. 50 Unit A -55 175 °C -55 150 °C 150 °C 1) 6 Weight MD mounting torque FC mounting force with clip g 0,8 1,2 Nm 20 120 N Product Marking IXYS Logo XXXXXXXXX Part Number Date Code yywwZ 1234 Lot# Location Ordering Standard Ordering Number DSEC30-12A Equivalent Circuits for Simulation I V0 R0 * on die level Delivery Mode Tube Quantity 30 Code No. 477117 T VJ = 175 °C Fast Diode V 0 max threshold voltage 1,03 R0 max slope resistance * 43 IXYS reserves the right to change limits, conditions and dimensions. © 2022 IXYS all rights reserved Marking on Product DSEC30-12A V mΩ Data according to IEC 60747and per semiconductor unless otherwise specified 20220610c DSEC30-12A Outlines TO-247 A E A2 Ø P1 ØP D2 S Q D1 D 2x E2 4 1 2 3 L1 E1 L 2x b2 3x b b4 C A1 2x e 1 IXYS reserves the right to change limits, conditions and dimensions. © 2022 IXYS all rights reserved 2 Sym. Inches min. max. Millimeter min. max. A A1 A2 D E E2 e L L1 ØP Q S b b2 b4 c D1 D2 E1 Ø P1 0.185 0.209 0.087 0.102 0.059 0.098 0.819 0.845 0.610 0.640 0.170 0.216 0.215 BSC 0.780 0.800 0.177 0.140 0.144 0.212 0.244 0.242 BSC 0.039 0.055 0.065 0.094 0.102 0.135 0.015 0.035 0.515 0.020 0.053 0.530 0.29 4.70 5.30 2.21 2.59 1.50 2.49 20.79 21.45 15.48 16.24 4.31 5.48 5.46 BSC 19.80 20.30 4.49 3.55 3.65 5.38 6.19 6.14 BSC 0.99 1.40 1.65 2.39 2.59 3.43 0.38 0.89 13.07 0.51 1.35 13.45 7.39 3 Data according to IEC 60747and per semiconductor unless otherwise specified 20220610c DSEC30-12A Fast Diode 40 3.0 35 IF TVJ = 150°C 25 100°C 25°C IF = 30 A IF = 30 A 1.5 15 A 7.5 A IRM 30 15 A 7.5 A Qr [A] 15 VR = 600 V 40 2.0 20 TVJ = 100°C VR = 600 V 2.5 30 50 TVJ = 100°C [A] 20 [nC] 1.0 10 10 0.5 5 0 0 1 2 3 0.0 100 4 0 1000 VF [V] Fig. 1 Forward current IF versusVF 2.0 0 200 600 800 1000 -diF /dt [A/µs] Fig. 2 Typ. reverse recov. charge Qr versus -diF /dt Fig. 3 Typ. peak reverse current IRM versus -diF /dt 180 120 TVJ = 100°C 1.2 TVJ = 100°C VR = 600 V 1.5 400 -diF /dt [A/µs] IF = 15 A 160 80 Kf 1.0 0.8 IF = 30 A trr 15 A 7.5 A 140 [ns] VFR trr [V] [µs] 40 IRM 0.5 0.4 120 Qr tfr VFR 0.0 100 0 40 80 120 160 0 0 TVJ [°C] 200 400 600 800 1000 0 200 600 800 0.0 1000 -diF /dt [A/µs] -diF /dt [A/µs] Fig. 4 Typ. dynamic parameters Qr, IRM versus TVJ 400 Fig. 6 Typ. peak forward voltage VFR and tfr versus diF /dt Fig. 5 Typ. recovery time trr versus -diF /dt 2.0 1.6 ZthJC 1.2 Constants for ZthJC calculation: [K/W] 0.8 0.4 i Rthi (K/W) ti (s) 1 0.160 0.0010 2 0.100 0.0150 3 0.500 0.0040 4 0.840 0.1200 0.0 1 10 100 1000 10000 t [ms] Fig. 7 Transient thermal resistance junction to case IXYS reserves the right to change limits, conditions and dimensions. © 2022 IXYS all rights reserved Data according to IEC 60747and per semiconductor unless otherwise specified 20220610c