DSEC 60-04A
HiPerFREDTM Epitaxial Diode
IFAV = 2x30 A
VRRM = 400 V
trr
= 30 ns
with common cathode and soft recovery
Preliminary Data
VRSM
VRRM
V
V
400
400
A
Type
C
A
TO-247 AD
A
C
A
DSEC 60-04A
C (TAB)
D4
Maximum Ratings
IFRMS
IFAVM
TC = 140°C; rectangular, d = 0.5
IFSM
TVJ = 45°C; tp = 10 ms (50 Hz), sine
EAS
TVJ = 25°C; non-repetitive
IAS = tbd A; L = tbd µH
IAR
VA = 1.5·VR typ.; f = 10 kHz; repetitive
TC = 25°C
Md
mounting torque
Weight
typical
Symbol
Conditions
A
tbd
mJ
tbd
A
RthJC
RthCH
°C
°C
°C
165
W
0.8...1.2
6
fo
Nm
g
Characteristic Values
typ.
max.
TVJ = 25°C VR = VRRM
TVJ = 150°C VR = VRRM
250
1
µA
mA
IF = 30 A;
1.09
1.49
V
V
0.9
K/W
K/W
No
t
①
VF ②
IRM
tbd
-55...+175
175
-55...+150
r
Ptot
trr
A
A
ne
TVJ
TVJM
Tstg
IR
70
30
Features
•
•
•
•
•
•
•
International standard package
Planar passivated chips
Very short recovery time
Extremely low switching losses
Low IRM-values
Soft recovery behaviour
Epoxy meets UL 94V-0
de
s
Conditions
w
Symbol
ig
n
A = Anode, C = Cathode, TAB = Cathode
TVJ = 150°C
TVJ = 25°C
0.25
IF = 1 A; -di/dt = 300 A/µs;
VR = 30 V; TVJ = 25°C
30
VR = 100 V; IF = 50 A; -diF/dt = 100 A/µs
TVJ = 100°C
5.5
6.8
A
• Antiparallel diode for high frequency
switching devices
• Antisaturation diode
• Snubber diode
• Free wheeling diode in converters
and motor control circuits
• Rectifiers in switch mode power
supplies (SMPS)
• Inductive heating
• Uninterruptible power supplies (UPS)
• Ultrasonic cleaners and welders
Advantages
• Avalanche voltage rated for reliable
operation
• Soft reverse recovery for low
EMI/RFI
• Low IRM reduces:
- Power dissipation within the diode
- Turn-on loss in the commutating switch
Dimensions see Outlines.pdf
Recommended replacement:
DPG 60C400HB
IXYS reserves the right to change limits, test conditions and dimensions.
20071025a
Pulse test: ① Pulse Width = 5 ms, Duty Cycle < 2.0 %
② Pulse Width = 300 µs, Duty Cycle < 2.0 %
ns
Applications
© 2007 IXYS All rights reserved
1-2
Data according to IEC 60747 and per diode unless otherwise specified
DSEC 60-04A
70
A
60
1600
50
TVJ= 100°C
VR = 200V
nC
IRM
1200
IF 50
40
Qr
TVJ=150°C
TVJ=100°C
TVJ= 25°C
40
TVJ= 100°C
VR = 200V
A
800
30
20
30
IF= 60A
IF= 30A
IF= 15A
IF= 60A
IF= 30A
IF= 15A
20
400
10
10
1.0
1.5 V 2.0
VF
Fig. 1 Forward current IF versus VF
2.0
0
100
0
A/µs 1000
-diF/dt
Fig. 2 Reverse recovery charge Qr
versus -diF/dt
90
IF= 60A
IF= 30A
IF= 15A
ne
60
Qr
50
40
80
120 °C 160
TVJ
Fig. 4 Dynamic parameters Qr, IRM
versus TVJ
0
200
fo
0
r
0.0
400
800 1000
A/µs
1
0.1
ZthJC
0.4
VFR
5
0.2
0
200
400
0.0
600 A/µs
800 1000
diF/dt
Fig. 6 Peak forward voltage VFR and tfr
versus diF/dt
Constants for ZthJC calculation:
No
t
K/W
tfr
-diF/dt
Fig. 5 Recovery time trr versus -diF/dt
µs
tfr
0
600
0.6
TVJ= 100°C
IF = 30A
10
w
70
IRM
0.5
600 A/µs
800 1000
-diF/dt
Fig. 3 Peak reverse current IRM
versus -diF/dt
VFR
Kf
1.0
400
V
trr 80
1.5
200
15
TVJ= 100°C
VR = 200V
ns
0
ig
n
0.5
de
s
0
0.0
i
1
2
3
Rthi (K/W)
ti (s)
0.465
0.179
0.256
0.0052
0.0003
0.0396
0.01
0.001
0.00001
DSEP 30-04A / DSEC 60-04A
0.0001
0.001
0.01
s
0.1
1
Fig. 7 Transient thermal resistance junction to case
NOTE: Fig. 2 to Fig. 6 shows typical values
2-2
20071025a
t
© 2007 IXYS All rights reserved
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