DSEP15-06B
HiPerFRED
VRRM
=
600 V
I FAV
=
15 A
t rr
=
25 ns
High Performance Fast Recovery Diode
Low Loss and Soft Recovery
Single Diode
Part number
DSEP15-06B
Backside: cathode
3
1
Features / Advantages:
Applications:
Package: TO-220
● Planar passivated chips
● Very low leakage current
● Very short recovery time
● Improved thermal behaviour
● Very low Irm-values
● Very soft recovery behaviour
● Avalanche voltage rated for reliable operation
● Soft reverse recovery for low EMI/RFI
● Low Irm reduces:
- Power dissipation within the diode
- Turn-on loss in the commutating switch
● Antiparallel diode for high frequency
switching devices
● Antisaturation diode
● Snubber diode
● Free wheeling diode
● Rectifiers in switch mode power
supplies (SMPS)
● Uninterruptible power supplies (UPS)
● Industry standard outline
● RoHS compliant
● Epoxy meets UL 94V-0
Disclaimer Notice
Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
IXYS reserves the right to change limits, conditions and dimensions.
© 2022 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20220610d
DSEP15-06B
Ratings
Fast Diode
Conditions
Symbol
VRSM
Definition
max. non-repetitive reverse blocking voltage
TVJ = 25°C
VRRM
max. repetitive reverse blocking voltage
TVJ = 25°C
600
IR
reverse current, drain current
VF
forward voltage drop
min.
typ.
max. Unit
600
V
V
VR = 600 V
TVJ = 25°C
100
µA
VR = 600 V
TVJ = 150°C
0,5
mA
TVJ = 25°C
2,54
V
2,99
V
1,59
V
IF =
15 A
IF =
30 A
IF =
15 A
IF =
30 A
TVJ = 150 °C
TC = 130°C
2,04
V
T VJ = 175°C
15
A
TVJ = 175°C
0,98
V
28
mΩ
I FAV
average forward current
VF0
threshold voltage
rF
slope resistance
R thJC
thermal resistance junction to case
R thCH
thermal resistance case to heatsink
Ptot
total power dissipation
I FSM
max. forward surge current
t = 10 ms; (50 Hz), sine; VR = 0 V
TVJ = 45°C
CJ
junction capacitance
VR = 400 V f = 1 MHz
TVJ = 25°C
12
pF
I RM
max. reverse recovery current
TVJ = 25 °C
2
A
t rr
reverse recovery time
rectangular
for power loss calculation only
1,6 K/W
IXYS reserves the right to change limits, conditions and dimensions.
K/W
0,5
TC = 25°C
IF =
© 2022 IXYS all rights reserved
d = 0.5
15 A; VR = 300 V
-di F /dt = 200 A/µs
95
110
W
A
TVJ = 100°C
3
A
TVJ = 25 °C
25
ns
TVJ = 100°C
80
ns
Data according to IEC 60747and per semiconductor unless otherwise specified
20220610d
DSEP15-06B
Package
Ratings
TO-220
Symbol
I RMS
Definition
Conditions
RMS current
per terminal
min.
TVJ
virtual junction temperature
T op
operation temperature
Tstg
storage temperature
-55
typ.
max.
35
Unit
A
-55
175
°C
-55
150
°C
150
°C
2
Weight
MD
mounting torque
FC
mounting force with clip
g
0,4
0,6
Nm
20
60
N
Product Marking
Part Number
Logo
Date Code
Lot #
XXXXXX
yywwZ
123456
Location
Ordering
Standard
Ordering Number
DSEP15-06B
Similar Part
DSEP15-06A
DSEP15-06AS
DSEP15-06BS
Equivalent Circuits for Simulation
I
V0
R0
Package
TO-220AC (2)
TO-263AB (D2Pak) (2)
TO-263AB (D2Pak) (2)
* on die level
Delivery Mode
Tube
Quantity
50
Code No.
492639
Voltage class
600
600
600
T VJ = 175 °C
Fast
Diode
V 0 max
threshold voltage
0,98
R0 max
slope resistance *
25
IXYS reserves the right to change limits, conditions and dimensions.
© 2022 IXYS all rights reserved
Marking on Product
DSEP15-06B
V
mΩ
Data according to IEC 60747and per semiconductor unless otherwise specified
20220610d
DSEP15-06B
Outlines TO-220
A
= supplier option
H1
ØP
D
4
3
L1
1
L
2x b2
2x b
C
e
A2
3
IXYS reserves the right to change limits, conditions and dimensions.
© 2022 IXYS all rights reserved
Millimeter
Min.
Max.
Inches
Min.
Max.
A
A1
A2
4.32
1.14
2.29
4.82
1.39
2.79
0.170
0.045
0.090
0.190
0.055
0.110
b
b2
0.64
1.15
1.01
1.65
0.025
0.045
0.040
0.065
C
D
0.35
14.73
0.56
16.00
0.014
0.580
0.022
0.630
E
e
H1
9.91
5.08
5.85
10.66
BSC
6.85
0.390
0.200
0.230
0.420
BSC
0.270
L
L1
12.70
2.79
13.97
5.84
0.500
0.110
0.550
0.230
ØP
Q
3.54
2.54
4.08
3.18
0.139
0.100
0.161
0.125
A1
Q
E
Dim.
1
Data according to IEC 60747and per semiconductor unless otherwise specified
20220610d
DSEP15-06B
Fast Diode
50
300
VR = 300 V
250
40
TVJ = 150°C
[A]
8
6
[µC]
20
IF = 7.5 A
IRM
IF = 7.5 A
150
IF = 30 A
IF = 15 A
IF = 15 A
Qr
TVJ = 100°C
10
IF = 30 A
200
IF 30
12
TVJ = 100°C
[A]
100
TVJ = 100°C
4
VR = 300 V
TVJ = 25°C
10
50
0
0
1
2
3
2
0
100
4
0
1000
VF [V]
Fig. 1 Forward current
IF versus VF
2.0
0
1000
60
TVJ = 100°C
80
0.30
TVJ = 100°C
I F = 30 A
50 IF = 15 A
0.25
40
0.20
30
0.15
VFR
I F = 15 A
[ns]
I F = 7.5 A
tfr
[µs]
[V]
60
IRM
800
Fig. 3 Typ. peak reverse current
IRM versus -diF /dt
VR = 300 V
Kf 1.0
600
Fig. 2 Typ. reverse recov. charge
Qr versus -diF /dt
100
trr
400
-diF /dt [A/µs]
120
1.5
200
-diF /dt [A/µs]
20
tfr
0.5
0.10
VFR
10
0.05
40
Qr
0.0
0
0
40
80
120
160
0
TVJ [°C]
200
400
600
800
1000
0
200
-diF /dt [A/µs]
Fig. 4 Dynamic parameters
Qr, IRM versus TVJ
400
600
800
0.00
1000
-diF /dt [A/µs]
Fig. 5 Typ. recovery time
trr versus -diF /dt
Fig. 6 Typ. peak forward voltage
VFR and tfr versus diF /dt
10
1
ZthJC
0.1
Constants for ZthJC calculation:
[K/W]
i
0.01
0.001
0.00001
DSEP 15-06B
0.0001
0.001
0.01
0.1
Rthi (K/W)
ti (s)
1 0.908
0.0052
2 0.350
0.0003
3 0.342
0.017
1
t [s]
Fig. 7 Transient thermal impedance junction to case
IXYS reserves the right to change limits, conditions and dimensions.
© 2022 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20220610d
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