DSEP2x61-03A
HiPerFRED
VRRM
=
I FAV
= 2x
60 A
t rr
=
30 ns
300 V
High Performance Fast Recovery Diode
Low Loss and Soft Recovery
Parallel legs
Part number
DSEP2x61-03A
Backside: isolated
2
1
3
4
Features / Advantages:
Applications:
Package: SOT-227B (minibloc)
● Planar passivated chips
● Very low leakage current
● Very short recovery time
● Improved thermal behaviour
● Very low Irm-values
● Very soft recovery behaviour
● Avalanche voltage rated for reliable operation
● Soft reverse recovery for low EMI/RFI
● Low Irm reduces:
- Power dissipation within the diode
- Turn-on loss in the commutating switch
● Antiparallel diode for high frequency
switching devices
● Antisaturation diode
● Snubber diode
● Free wheeling diode
● Rectifiers in switch mode power
supplies (SMPS)
● Uninterruptible power supplies (UPS)
● Isolation Voltage: 3000 V~
● Industry standard outline
● RoHS compliant
● Epoxy meets UL 94V-0
● Base plate: Copper
internally DCB isolated
● Advanced power cycling
Disclaimer Notice
Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
IXYS reserves the right to change limits, conditions and dimensions.
© 2022 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20220608d
DSEP2x61-03A
Ratings
Fast Diode
Conditions
Symbol
VRSM
max. non-repetitive reverse blocking voltage
TVJ = 25°C
VRRM
max. repetitive reverse blocking voltage
TVJ = 25°C
300
IR
reverse current, drain current
VR = 300 V
TVJ = 25°C
650
µA
VR = 300 V
TVJ = 150°C
2,5
mA
TVJ = 25°C
1,51
V
1,82
V
1,11
V
VF
Definition
IF =
forward voltage drop
min.
60 A
typ.
I F = 120 A
IF =
TVJ = 150 °C
60 A
I F = 120 A
I FAV
average forward current
VF0
threshold voltage
rF
slope resistance
R thJC
thermal resistance junction to case
TC = 80°C
rectangular
max. Unit
300
V
V
1,45
V
T VJ = 150 °C
60
A
TVJ = 150 °C
0,79
V
5,3
mΩ
d = 0.5
for power loss calculation only
0,85 K/W
K/W
R thCH
thermal resistance case to heatsink
Ptot
total power dissipation
I FSM
max. forward surge current
t = 10 ms; (50 Hz), sine; VR = 0 V
TVJ = 45°C
CJ
junction capacitance
VR = 150 V f = 1 MHz
TVJ = 25°C
170
pF
I RM
max. reverse recovery current
TVJ = 25 °C
12
A
t rr
reverse recovery time
IXYS reserves the right to change limits, conditions and dimensions.
© 2022 IXYS all rights reserved
0,1
TC = 25°C
I F = 60 A; VR = 190 V
-di F /dt = 600 A/µs
140
600
W
A
TVJ = 100°C
15
A
TVJ = 25 °C
40
ns
TVJ = 100°C
60
ns
Data according to IEC 60747and per semiconductor unless otherwise specified
20220608d
DSEP2x61-03A
Package
Ratings
SOT-227B (minibloc)
Symbol
I RMS
Definition
Conditions
RMS current
per terminal
TVJ
virtual junction temperature
T op
operation temperature
Tstg
storage temperature
-40
min.
typ.
max.
100
Unit
A
-40
150
°C
-40
125
°C
150
°C
30
Weight
MD
MT
d Spp/App
d Spb/Apb
VISOL
g
mounting torque
1,1
1,5
Nm
terminal torque
1,1
1,5
Nm
creepage distance on surface | striking distance through air
terminal to terminal
10,5
terminal to backside
8,6
t = 1 second
isolation voltage
t = 1 minute
50/60 Hz, RMS; IISOL ≤ 1 mA
3,2
mm
6,8
mm
3000
V
2500
V
Product Marking
Logo
Date
Code
yywwZ
®
XXXXX
123456
Location UL
Ordering
Standard
Part
Number
Lot#
Ordering Number
DSEP2x61-03A
Equivalent Circuits for Simulation
I
V0
R0
Marking on Product
DSEP2x61-03A
* on die level
Delivery Mode
Tube
Code No.
476250
T VJ = 150 °C
Fast
Diode
V 0 max
threshold voltage
0,79
V
R 0 max
slope resistance *
3,4
mΩ
IXYS reserves the right to change limits, conditions and dimensions.
© 2022 IXYS all rights reserved
Quantity
10
Data according to IEC 60747and per semiconductor unless otherwise specified
20220608d
DSEP2x61-03A
Outlines SOT-227B (minibloc)
2
1
3
4
IXYS reserves the right to change limits, conditions and dimensions.
© 2022 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20220608d
DSEP2x61-03A
Fast Diode
160
25
800
TVJ = 100°C
TVJ = 100°C
VR = 150 V
VR = 150 V
20
120
600
TVJ = 150°C
IF
100°C
25°C
80
Qr
IF = 120 A
60 A
30 A
400
15
IRM
10
[nC]
[A]
40
IF = 120 A
60 A
30 A
[A]
200
5
0
0.0
0.5
1.0
1.5
0
100
2.0
VF [V]
Fig. 1 Forward current
IF versus VF
0
1000
0
-diF /dt [A/μs]
90
400
600
800
14
0.85
TVJ = 100°C
VR = 150 V
1.2
1000
-diF /dt [A/μs]
Fig. 3 Typ. peak reverse current
IRM versus -diF /dt
Fig. 2 Typ. reverse recov. charge
Qr versus -diF /dt
1.4
200
TVJ = 100°C
IF = 60 A
12
0.80
VFR 10
0.75
[V] 8
0.70
80
1.0
trr
0.8
[ns]
Kf
IF = 120A
IF = 60A
IF = 30A
70
IRM
[μs]
60
Qr
0.6
tfr
6
0.65
VFR
0.4
50
0
40
80
120
160
4
0
200
TVJ [°C]
400
600
800
1000
0
-diF /dt [A/μs]
200
400
600
800
0.60
1000
-diF /dt [A/μs]
Fig. 5 Typ. recovery time
trr versus -diF /dt
Fig. 4 Typ. dynamic parameters
Qr, IRM versus TVJ
tfr
Fig. 6 Typ. peak forward voltage
VFR and tfr versus diF /dt
1
0.1
ZthJC
Constants for ZthJC calculation:
0.01
[K/W]
0.001
0.0001
0.00001
0.0001
0.001
0.01
0.1
1
i
Rthi (K/W)
ti (s)
1
0.307
0.0055
2
0.353
0.009
3
0.089
0.0007
4
0.101
0.04
10
t [s]
Fig. 7 Transient thermal resistance junction to case
IXYS reserves the right to change limits, conditions and dimensions.
© 2022 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20220608d
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