DSEP30-12A
HiPerFRED
VRRM
=
1200 V
I FAV
=
30 A
t rr
=
40 ns
High Performance Fast Recovery Diode
Low Loss and Soft Recovery
Single Diode
Part number
DSEP30-12A
Backside: cathode
3
1
Features / Advantages:
Applications:
Package: TO-247
● Planar passivated chips
● Very low leakage current
● Very short recovery time
● Improved thermal behaviour
● Very low Irm-values
● Very soft recovery behaviour
● Avalanche voltage rated for reliable operation
● Soft reverse recovery for low EMI/RFI
● Low Irm reduces:
- Power dissipation within the diode
- Turn-on loss in the commutating switch
● Antiparallel diode for high frequency
switching devices
● Antisaturation diode
● Snubber diode
● Free wheeling diode
● Rectifiers in switch mode power
supplies (SMPS)
● Uninterruptible power supplies (UPS)
● Industry standard outline
● RoHS compliant
● Epoxy meets UL 94V-0
Disclaimer Notice
Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
IXYS reserves the right to change limits, conditions and dimensions.
© 2022 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20220610d
DSEP30-12A
Ratings
Fast Diode
Conditions
Definition
max. non-repetitive reverse blocking voltage
TVJ = 25°C
VRRM
max. repetitive reverse blocking voltage
TVJ = 25°C
1200
IR
reverse current, drain current
VR = 1200 V
TVJ = 25°C
250
µA
VR = 1200 V
TVJ = 150°C
1
mA
IF =
30 A
TVJ = 25°C
2,74
V
IF =
60 A
3,27
V
IF =
30 A
1,79
V
IF =
60 A
VF
forward voltage drop
min.
typ.
max. Unit
1200
V
Symbol
VRSM
TVJ = 150 °C
TC = 120°C
V
2,30
V
T VJ = 175°C
30
A
TVJ = 175°C
1,12
V
16
mΩ
I FAV
average forward current
VF0
threshold voltage
rF
slope resistance
R thJC
thermal resistance junction to case
R thCH
thermal resistance case to heatsink
Ptot
total power dissipation
I FSM
max. forward surge current
t = 10 ms; (50 Hz), sine; VR = 0 V
TVJ = 45°C
CJ
junction capacitance
VR = 600 V f = 1 MHz
TVJ = 25°C
12
pF
I RM
max. reverse recovery current
TVJ = 25 °C
8,5
A
TVJ = 100°C
13
A
t rr
reverse recovery time
TVJ = 25 °C
60
ns
TVJ = 100°C
170
ns
rectangular
for power loss calculation only
0,9 K/W
IXYS reserves the right to change limits, conditions and dimensions.
K/W
0,25
TC = 25°C
IF =
© 2022 IXYS all rights reserved
d = 0.5
30 A; VR = 600 V
-di F /dt = 200 A/µs
165
200
Data according to IEC 60747and per semiconductor unless otherwise specified
W
A
20220610d
DSEP30-12A
Package
Ratings
TO-247
Symbol
I RMS
Definition
Conditions
RMS current
per terminal
min.
typ.
max.
70
Unit
A
TVJ
virtual junction temperature
-55
175
°C
T op
operation temperature
-55
150
°C
Tstg
storage temperature
-55
150
°C
6
Weight
MD
mounting torque
FC
mounting force with clip
g
0,8
1,2
Nm
20
120
N
Product Marking
IXYS
Logo
XXXXXXXXX
Part Number
yywwZ
Date Code
1234
Lot#
Location
Ordering
Standard
Ordering Number
DSEP30-12A
Similar Part
DSEP30-12B
DSEP29-12A
DSEP30-12AR
DHG30I1200HA
Package
TO-247AD (2)
TO-220AC (2)
ISOPLUS247 (2)
TO-247AD (2)
DSEP30-12CR
DSEP29-12B
ISOPLUS247 (2)
TO-220AC (2)
Equivalent Circuits for Simulation
I
V0
R0
Marking on Product
DSEP30-12A
* on die level
Delivery Mode
Tube
Code No.
473227
Voltage class
1200
1200
1200
1200
1200
1200
T VJ = 175 °C
Fast
Diode
V 0 max
threshold voltage
1,12
V
R0 max
slope resistance *
13,4
mΩ
IXYS reserves the right to change limits, conditions and dimensions.
© 2022 IXYS all rights reserved
Quantity
30
Data according to IEC 60747and per semiconductor unless otherwise specified
20220610d
DSEP30-12A
Outlines TO-247
A
E
A2
D2
Ø P1
ØP
S
Q
D1
D
2x E2
4
1
2
3
L1
E1
L
2x b2
2x b
e
C
A1
3
IXYS reserves the right to change limits, conditions and dimensions.
© 2022 IXYS all rights reserved
Sym.
Inches
min.
max.
Millimeter
min.
max.
A
A1
A2
D
E
E2
e
L
L1
ØP
Q
S
b
b2
b4
c
D1
D2
E1
Ø P1
0.185 0.209
0.087 0.102
0.059 0.098
0.819 0.845
0.610 0.640
0.170 0.216
0.430 BSC
0.780 0.800
0.177
0.140 0.144
0.212 0.244
0.242 BSC
0.039 0.055
0.065 0.094
0.102 0.135
0.015 0.035
0.515
0.020 0.053
0.530
0.29
4.70
5.30
2.21
2.59
1.50
2.49
20.79 21.45
15.48 16.24
4.31
5.48
10.92 BSC
19.80 20.30
4.49
3.55
3.65
5.38
6.19
6.14 BSC
0.99
1.40
1.65
2.39
2.59
3.43
0.38
0.89
13.07
0.51
1.35
13.45
7.39
1
Data according to IEC 60747and per semiconductor unless otherwise specified
20220610d
DSEP30-12A
Fast Diode
70
5
VR = 600 V
60
50
4
TVJ = 150°C
50
IF = 60 A
100°C
25°C
IF = 60 A
30
IRM
30
[A]
[µC] 2
20
20
1
10
0
0
1
2
3
10
0
100
4
Fig. 1 Forward current
IF versus VF
1000
220
VR = 600 V
1.5
trr
Kf 1.0
200
IF = 60 A
180
160
120
1000
1.2
TVJ = 100°C
1.0
IF = 30 A
80
0.8
60
0.6
40
0.4
tfr
[µs]
20
0
200
400 600 800
-diF /dt [A/µs]
1000
0
0.2
trr
VFR
0
200
400
600
800
0.0
1000
-diF /dt [A/µs]
Fig. 5 Typ. recovery time
trr versus -diF /dt
Fig. 4 Typ. dynamic parameters
Qr, IRM versus TVJ
800
[V]
140
QR
600
Fig. 3 Typ. peak reverse current
IRM versus -diF /dt
VFR
30 A
15 A
IRM
0.5
400
100
[ns] 160
80
120
TVJ [°C]
0
120
TVJ = 100°C
200
40
VR = 600 V
-diF /dt [A/µs]
Fig. 2 Typ. reverse recov. charge
Qr versus -diF /dt
2.0
0
0
TVJ = 100°C
-diF /dt [A/µs]
VF [V]
0.0
30 A
15 A
40
30 A
15 A
Qr 3
IF 40
[A]
60
TVJ = 100°C
Fig. 6 Typ. peak forward voltage
VFR and tfr versus diF /dt
1
0.1
Constants for ZthJC calculation:
ZthJC
[K/W]
0.01
0.001
0.00001
0.0001
0.001
0.01
0.1
i
Rthi (K/W)
ti (s)
1
0.030
0.001
2
0.080
0.030
3
0.300
0.006
4
0.490
0.060
1
t [s]
Fig. 7 Transient thermal impedance junction to case
IXYS reserves the right to change limits, conditions and dimensions.
© 2022 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20220610d
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