DSP45-16AR
Standard Rectifier
VRRM
= 2x 1600 V
I FAV
=
45 A
VF
=
1.23 V
Phase leg
Part number
DSP45-16AR
Backside: isolated
1
2
3
Features / Advantages:
Applications:
Package: ISOPLUS247
● Planar passivated chips
● Very low leakage current
● Very low forward voltage drop
● Improved thermal behaviour
● Diode for main rectification
● For single and three phase
bridge configurations
● Isolation Voltage: 3600 V~
● Industry standard outline
● RoHS compliant
● Epoxy meets UL 94V-0
● Soldering pins for PCB mounting
● Backside: DCB ceramic
● Reduced weight
● Advanced power cycling
Disclaimer Notice
Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
IXYS reserves the right to change limits, conditions and dimensions.
© 2019 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20191129d
DSP45-16AR
Ratings
Rectifier
Conditions
Symbol
VRSM
Definition
max. non-repetitive reverse blocking voltage
TVJ = 25°C
VRRM
max. repetitive reverse blocking voltage
TVJ = 25°C
IR
reverse current
VF
forward voltage drop
I FAV
average forward current
VF0
threshold voltage
rF
slope resistance
R thJC
thermal resistance junction to case
min.
typ.
max. Unit
1700
V
1600
V
VR = 1600 V
TVJ = 25°C
40
µA
VR = 1600 V
TVJ = 150°C
1.5
mA
TVJ = 25°C
1.26
V
1.57
V
1.23
V
IF =
45 A
IF =
90 A
IF =
45 A
IF =
90 A
TVJ = 150 °C
TC = 100 °C
1.66
V
T VJ = 175 °C
45
A
TVJ = 175 °C
0.81
V
9.1
mΩ
180° sine
for power loss calculation only
R thCH
thermal resistance case to heatsink
Ptot
total power dissipation
I FSM
max. forward surge current
I²t
CJ
value for fusing
junction capacitance
IXYS reserves the right to change limits, conditions and dimensions.
© 2019 IXYS all rights reserved
0.9 K/W
K/W
0.3
TC = 25°C
165
W
t = 10 ms; (50 Hz), sine
TVJ = 45°C
480
A
t = 8,3 ms; (60 Hz), sine
VR = 0 V
520
A
t = 10 ms; (50 Hz), sine
TVJ = 150 °C
410
A
t = 8,3 ms; (60 Hz), sine
VR = 0 V
440
A
t = 10 ms; (50 Hz), sine
TVJ = 45°C
1.15 kA²s
t = 8,3 ms; (60 Hz), sine
VR = 0 V
1.13 kA²s
t = 10 ms; (50 Hz), sine
TVJ = 150 °C
840
A²s
805
A²s
t = 8,3 ms; (60 Hz), sine
VR = 0 V
VR = 400 V; f = 1 MHz
TVJ = 25°C
18
Data according to IEC 60747and per semiconductor unless otherwise specified
pF
20191129d
DSP45-16AR
Package
Ratings
ISOPLUS247
Symbol
I RMS
Definition
Conditions
RMS current
per terminal
min.
TVJ
virtual junction temperature
T op
operation temperature
Tstg
storage temperature
-40
typ.
max.
70
Unit
A
-40
175
°C
-40
150
°C
150
°C
6
Weight
FC
20
mounting force with clip
d Spp/App
creepage distance on surface | striking distance through air
d Spb/Apb
VISOL
t = 1 minute
120
N
terminal to terminal
2.7
mm
terminal to backside
4.1
mm
3600
V
3000
V
t = 1 second
isolation voltage
g
50/60 Hz, RMS; IISOL ≤ 1 mA
Product Marking
IXYS
Logo
ISOPLUS®
XXXXXXXXX
yywwZ
Part Number
Date Code
1234
Lot#
Location
Ordering
Standard
Ordering Number
DSP45-16AR
Similar Part
DSP45-16A
DSP45-16AZ
DSP45-12A
DSP45-12AZ
Package
TO-247AD (3)
TO-268AA (D3Pak) (2HV)
TO-247AD (3)
TO-268AA (D3Pak) (2HV)
DSP45-18A
TO-247AD (3)
Equivalent Circuits for Simulation
I
V0
R0
Marking on Product
DSP45-16AR
* on die level
Delivery Mode
Tube
Code No.
496561
Voltage class
1600
1600
1200
1200
1800
T VJ = 175°C
Rectifier
V 0 max
threshold voltage
0.81
V
R0 max
slope resistance *
6.5
mΩ
IXYS reserves the right to change limits, conditions and dimensions.
© 2019 IXYS all rights reserved
Quantity
30
Data according to IEC 60747and per semiconductor unless otherwise specified
20191129d
DSP45-16AR
Outlines ISOPLUS247
A2
E1
E
D2
A
Q
Dim.
D
D3
D1
R
A
A1
A2
b
b2
b4
c
D
D1
D2
D3
E
E1
e
L
L1
Q
R
W
2
3
L
L1
1
2x b2
3x b
A1
Die Gehäuseabmessungen entsprechen dem Typ TO-247 AD
gemäß JEDEC außer Schraubloch und Lmax.
This drawing will meet all dimensions requiarement of JEDEC
outline TO-247 AD except screw hole and except Lmax.
W
1
IXYS reserves the right to change limits, conditions and dimensions.
© 2019 IXYS all rights reserved
Inches
min
max
0.190
0.205
0.090
0.100
0.075
0.085
0.045
0.055
0.075
0.087
0.115
0.128
0.024
0.033
0.819
0.840
0.620
0.640
0.065
0.085
0.799
0.815
0.620
0.635
0.520
0.540
0.215 BSC
0.780
0.811
0.150
0.172
0.220
0.244
0.167
0.217
0.004
Die konvexe Form des Substrates ist typ. < 0.04 mm über der
Kunststoffoberfläche der Bauteilunterseite
The convex bow of substrate is typ. < 0.04 mm over plastic
surface level of device bottom side
2x e
c
b4
Millimeter
min
max
4.83
5.21
2.29
2.54
1.91
2.16
1.14
1.40
1.91
2.20
2.92
3.24
0.61
0.83
20.80
21.34
15.75
16.26
1.65
2.15
20.30
20.70
15.75
16.13
13.21
13.72
5.45 BSC
19.81
20.60
3.81
4.38
5.59
6.20
4.25
5.50
0.10
2
3
Data according to IEC 60747and per semiconductor unless otherwise specified
20191129d
DSP45-16AR
Rectifier
400
80
1200
VR = 0 V
50 Hz, 80% VRRM
70
1000
360
60
50
IF
600
[A2s]
280
30
TVJ = 45°C
I2 t
IFSM
40
[A]
800
TVJ = 45°C
320
[A]
TVJ = 150°C
400
20
240
TVJ = 150°C
125°C
25°C
10
0
0.5
1.0
200
0.001
1.5
200
TVJ = 150°C
0
0.01
VF [V]
0.1
1
1
2
t [s]
4 5 6 7 8 910
2
Fig. 2 Surge overload current
Fig. 1 Forward current versus
voltage drop per diode
3
t [ms]
Fig. 3 I t versus time per diode
80
80
RthJA:
0.6 KW
0.8 KW
1 KW
2 KW
4 KW
8 KW
DC =
1
0.5
0.4
0.33
0.17
0.08
60
Ptot
40
[W]
DC =
1
0.5
0.4
0.33
0.17
0.08
60
IdAVM
40
[A]
20
20
0
0
0
10
20
30
40
50
60
0
IdAVM [A]
50
100
150
200
0
50
Tamb [°C]
100
150
200
TC [°C]
Fig. 4 Power dissipation vs. direct output current & ambient temperature
Fig. 5 Max. forward current vs.
case temperature
1.0
0.8
Zth
0.6
i
1
2
3
4
5
[K/W]
0.4
0.2
0.0
1
10
100
1000
Ri
0.0607
0.123
0.2305
0.323
0.1628
ti
0.0004
0.00256
0.045
0.0242
0.18
10000
t [ms]
Fig. 6 Transient thermal impedance junction to case
IXYS reserves the right to change limits, conditions and dimensions.
© 2019 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20191129d
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