FDA215S

FDA215 Dual Photovoltaic MOSFET Driver INTEGRATED CIRCUITS DIVISION Parameter Open Circuit Voltage, Typical Short Circuit Current, Typical Input Control Current Rating 5.5 2.5 5 Units V A mA Features • Optically Isolated, Input to Output • Dual Independent, Floating Outputs for Parallel, Series, or Isolated Configuration • 5mA Control Current • May Be Configured for AC and DC Switching • Replacement of Discrete Components • No EMI/RFI Generation • Surface Mount and Tape & Reel Version Available • Flammability Rating UL 94 V-0 Applications • MOSFET Driver • Programmable Control • Process Control • Instrumentation • Telecommunications Description The FDA215 is a dual photovoltaic MOSFET driver. Each independent driver consists of an LED that is optically coupled to a photodiode array. The driver output is controlled by means of the highly effective infrared LED at the input. When the input current is applied to the LED, the light emitted activates the photodiode array, and generates the voltage at the output. The photodiode array is capable of generating a floating power source with voltage and current sufficient to drive high-power MOSFET transistors. Each photodiode array contains an integrated turn-off circuit that discharges the external MOSFET gate when LED current is removed. This eliminates the need to use external components to facilitate the discharge. The optically coupled technology provides 3750Vrms of input to output isolation. The FDA215 is well suited for use in discrete solid state relay designs and in other isolated switching applications. Approvals • EN 62368-1 Certificate# B 082667 0008 Ordering Information Part # FDA215 FDA215S FDA215STR Description 8-Pin DIP (50/tube) 8-Pin Surface Mount (50/tube) 8-Pin Surface Mount (1000/reel) Pin Configuration 1 Input 2 3 Input 4 DS-FDA215-R08 www.ixysic.com + – PV – 8 Output + 7 + – PV – + 6 Output 5 1 INTEGRATED CIRCUITS DIVISION FDA215 Absolute Maximum Ratings @ 25ºC Parameter Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Ratings 5 100 1 150 500 3750 -40 to +85 -40 to +125 Units V mA A mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Output Characteristics Open Circuit Voltage Short Circuit Current Switching Speeds Turn-On Turn-Off Offstate Clamping Resistance Input Characteristics LED Current to Activate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 2 Conditions Symbol Min Typ Max Units IF=5mA IF=5mA IF=25mA VOC 5.5 2.5 3.5 8 9 20 V ISC 3 1 2.5 VL=1V ton toff RCL 100 250 5 5 3300 IF=5mA VR=5V IF VF IR 0.9 - 1.2 - 5 1.5 10 mA V µA VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, CLOAD=200pF www.ixysic.com A ms  R08 INTEGRATED CIRCUITS DIVISION FDA215 PERFORMANCE DATA LED Forward Voltage vs. Forward Current (Room Temperature) 14 Turn-On Time (ms) 1.4 1.3 1.2 1.1 IF=5mA IF=10mA IF=20mA IF=50mA 10 8 6 4 10 20 30 40 50 0 60 0 4000 6000 8000 Capacitance (pF) LED Forward Voltage vs. Temperature Turn-On Time vs. LED Current (VOUT=5V, C=200pF) 900 IF=50mA IF=20mA IF=10mA 1.5 Turn-On Time (Ps) 1.4 1.3 1.2 IF=5mA 1.1 0 20 40 60 Temperature (ºC) 80 800 700 700 600 500 85ºC 25ºC 0ºC -40ºC 400 300 200 5 Turn-On Time (Ps) 700 680 660 640 620 -20 0 20 40 60 Temperature (ºC) 80 IF=10mA 500 400 300 IF=20mA 200 IF=50mA -40 -20 Short Circuit Current (PA) Open Circuit Voltage (V) 0 20 40 60 Temperature (ºC) 80 9 8 IF=10mA 7 6 IF=5mA 5 4 80 100 50 60 IF=50mA IF=20mA IF=10mA IF=5mA 150 100 50 -20 0 20 40 60 Temperature (ºC) 80 100 Output Current vs. Output Voltage 3.0 IF=10mA 15 10 IF=5mA 5 2.5 2.0 1.5 -40ºC 0ºC 25ºC 85ºC 1.0 0.5 0.0 0 20 40 60 Temperature (ºC) 20 30 40 LED Current (mA) 200 0 -40 100 20 0 10 Short Circuit Current vs. Temperature 10 -20 200 250 600 Open Circuit Voltage vs. Temperature -40 300 IF=5mA 700 100 -40ºC 0ºC 25ºC 85ºC 400 Turn-Off Time vs. Temperature (VOUT=1V, COUT=200pF) 0 -40 500 0 Turn-On Time vs. Temperature (VOUT=5V, COUT=200pF) 100 600 600 10 15 20 25 30 35 40 45 50 55 LED Current (mA) 800 720 10000 0 900 740 8000 100 0 Offstate Output Resistance vs. Temperature (VLOAD=1V, Internal to Photovoltaic Driver) 4000 6000 Capacitance (pF) 900 800 100 2000 Turn-Off Time vs. LED Current (VOUT=1V, C=200pF) Turn-Off Time (Ps) -20 200 0 0 -40 225 10000 12000 100 1.0 760 2000 Output Current (mA) LED Forward Voltage (V) 1.6 250 150 LED Forward Current (mA) Turn-Off Time (Ps) 0 IF=50mA IF=20mA IF=10mA IF=5mA 275 175 2 1.0 Resistance (:) 300 12 Turn-Off Time (Ps) LED Forward Voltage (V) 1.5 Turn-Off Time vs. Capacitance (VOUT=1V) Turn-On Time vs. Capacitance (VOUT=5V) -40 -20 0 20 40 60 Temperature (ºC) 80 100 0 1 2 3 4 Output Voltage (V) 5 6 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R08 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION FDA215 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification FDA215S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles FDA215S 250ºC 30 seconds 3 For through-hole devices, the wave soldering maximum lead (pin) temperature and the maximum dwell time the leads (pins) are at the peak soldering temperature is given in the table below. Maximum wave soldering parameters are shown below. Device Pin Temperature Body Temperature Dwell Time Wave Cycles FDA215 260ºC 250ºC 10 seconds 1 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. 4 www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION FDA215 MECHANICAL DIMENSIONS FDA215S PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 2.54 (0.10) 9.525 ± 0.254 (0.375 ± 0.010) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.457 ± 0.076 (0.018 ± 0.003) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) FDA215STR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment R08 16.0±0.3 (0.63±0.012) P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION FDA215 FDA215 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 4.064 TYP (0.160) 3.302 ± 0.051 (0.130 ± 0.002) 7.239 TYP. (0.285) 7.620 ± 0.127 (0.300 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.813 ± 0.102 (0.032 ± 0.004) 7.620 ± 0.127 (0.300 ± 0.005) Dimensions mm (inches) For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 6 Specification: DS-FDA215-R08 ©Copyright 2022, Littelfuse, Inc. All rights reserved. Printed in USA. 5/12/2022