GUO40-16NO1
3~
Rectifier
Standard Rectifier
VRRM = 1600 V
I DAV =
40 A
I FSM =
370 A
3~ Rectifier Bridge
Part number
GUO40-16NO1
Backside: isolated
+
D1
D3
D5
D2
D4
D6
~
~
~
-
Features / Advantages:
Applications:
Package: GUFP
● Low forward voltage drop
● Planar passivated chips
● Easy to mount with one screw
● Space and weight savings
● Supplies for DC power equipment
● Input rectifiers for PWM inverter
● Battery DC power supplies
● Field supply for DC motors
● Isolation Voltage: 2500 V~
● Industry standard outline
● RoHS compliant
● Epoxy meets UL 94V-0
● Soldering pins for PCB mounting
● Base plate: Plastic overmolded tab
● Reduced weight
Disclaimer Notice
Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
IXYS reserves the right to change limits, conditions and dimensions.
© 2019 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20191219d
GUO40-16NO1
Ratings
Rectifier
Conditions
Symbol
VRSM
Definition
max. non-repetitive reverse blocking voltage
TVJ = 25°C
VRRM
max. repetitive reverse blocking voltage
TVJ = 25°C
IR
reverse current
VF
forward voltage drop
bridge output current
VF0
threshold voltage
rF
slope resistance
R thJC
thermal resistance junction to case
thermal resistance case to heatsink
total power dissipation
I FSM
max. forward surge current
I²t
CJ
value for fusing
junction capacitance
IXYS reserves the right to change limits, conditions and dimensions.
© 2019 IXYS all rights reserved
1600
V
TVJ = 25°C
40
µA
TVJ = 150°C
1.5
mA
TVJ = 25°C
1.06
V
1.28
V
0.92
V
IF =
10 A
IF =
30 A
IF =
10 A
IF =
30 A
TVJ = 150 °C
1.23
V
T VJ = 175 °C
40
A
TVJ = 175 °C
0.74
V
16.3
mΩ
d=⅓
for power loss calculation only
R thCH
max. Unit
1700
V
VR = 1600 V
rectangular
Ptot
typ.
VR = 1600 V
TC = 90 °C
I DAV
min.
4.3 K/W
K/W
0.5
TC = 25°C
35
W
t = 10 ms; (50 Hz), sine
TVJ = 45°C
370
A
t = 8,3 ms; (60 Hz), sine
VR = 0 V
400
A
t = 10 ms; (50 Hz), sine
TVJ = 150 °C
315
A
t = 8,3 ms; (60 Hz), sine
VR = 0 V
340
A
t = 10 ms; (50 Hz), sine
TVJ = 45°C
685
A²s
t = 8,3 ms; (60 Hz), sine
VR = 0 V
665
A²s
t = 10 ms; (50 Hz), sine
TVJ = 150 °C
495
A²s
480
A²s
t = 8,3 ms; (60 Hz), sine
VR = 0 V
VR = 400 V; f = 1 MHz
TVJ = 25°C
10
Data according to IEC 60747and per semiconductor unless otherwise specified
pF
20191219d
GUO40-16NO1
Package
Ratings
GUFP
Symbol
I RMS
Definition
Conditions
RMS current
per terminal
min.
TVJ
virtual junction temperature
T op
operation temperature
Tstg
storage temperature
-40
max.
70
Unit
A
-40
175
°C
-40
150
°C
150
°C
8.5
Weight
MD
mounting torque
FC
mounting force with clip
d Spp/App
creepage distance on surface | striking distance through air
d Spb/Apb
VISOL
t = 1 minute
6.7
10.0
50/60 Hz, RMS; IISOL ≤ 1 mA
1.2
Nm
20
120
N
5.4
mm
8.0
mm
2500
V
2100
V
Similar Part
DNA40U2200GU
DMA40U1800GU
GUO40-12NO1
GUO40-08NO1
Equivalent Circuits for Simulation
V0
50
Ordering Number
GUO40-16NO1
R0
Marking on Product
GUO40-16NO1
Package
GUFP
GUFP
GUFP
GUFP
* on die level
Delivery Mode
Tube
Quantity
14
K/W
Code No.
514899
Voltage class
2200
1800
1200
800
T VJ = 175°C
Rectifier
V 0 max
threshold voltage
0.74
V
R0 max
slope resistance *
13.7
mΩ
IXYS reserves the right to change limits, conditions and dimensions.
© 2019 IXYS all rights reserved
g
0.8
thermal resistance junction to ambient
Ordering
Standard
I
terminal to terminal
terminal to backside
t = 1 second
isolation voltage
RthJA
typ.
Data according to IEC 60747and per semiconductor unless otherwise specified
20191219d
GUO40-16NO1
Outlines GUFP
Dim.
Z1
O
Z2
Q
A2
D
ØP
S1
L
5x b2
5x b
C
A3
e
4x e
A4
E
A5
F
A6
A
X2
X1
Y2
+
S2
~
Y1
~
~
R
_
L1
+1
+2
A
A2
A3
A4
A5
A6
b
b2
C
D
E
e
F
L
L1
O
ØP
Q
Ø
/2 R
s1
s2
t1
t2
x1
x2
y1
y2
z1
Millimeter
min
typ.
max
5.40 5.50 5.60
3.90 4.00 4.10
0.95 1.00 1.10
0.95 1.00 1.05
1.60 1.70 1.80
1.25 1.30 1.35
0.95 1.00 1.05
1.95 2.00 2.05
0.45 0.50 0.55
24.80 25.00 25.20
34.70 35.00 35.30
BSC 7.50
2.40 2.50 2.60
20.30 20.40 20.50
3.70 3.75 3.80
17.40 17.50 17.60
4.10 4.20 4.30
9.20 9.30 9.40
1.77
3.45 3.50 3.55
1.45 1.50 1.55
0.95 1.00 1.05
0.95 1.00 1.05
3.20 3.30 3.40
1.90
1.60
4.65
2.80
2.00
1.65
4.70
2.90
2.10
1.70
4.75
3.00
min
0.213
0.154
0.037
0.037
0.063
0.049
0.037
0.077
0.018
0.977
1.367
BSC
0.095
0.800
0.146
0.686
0.162
0.362
0.136
0.057
0.037
0.037
0.126
0.075
0.063
0.183
0.110
Inches
typ.
0.217
0.158
0.039
0.039
0.067
0.051
0.039
0.079
0.020
0.985
1.379
0.296
0.099
0.804
0.148
0.690
0.165
0.366
0.070
0.138
0.059
0.039
0.039
0.130
0.079
0.065
0.185
0.114
max
0.221
0.162
0.043
0.041
0.071
0.053
0.041
0.081
0.022
0.993
1.391
0.102
0.808
0.150
0.693
0.169
0.370
0.140
0.061
0.041
0.041
0.134
0.083
0.067
0.187
0.118
+
D1
D3
D5
D2
D4
D6
~
~
~
-
IXYS reserves the right to change limits, conditions and dimensions.
© 2019 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20191219d
GUO40-16NO1
Rectifier
60
300
40
250
800
50 Hz
0.8 x V RRM
VR = 0 V
600
IF
TVJ = 45°C
IFSM
I 2t
TVJ = 45°C
400
[A]
[A]
2
[A s]
200
20
0
0.4
0.8
1.2
150
10-3
1.6
10-2
10-1
1
Fig. 1 Forward current vs.
voltage drop per diode
Fig. 2 Surge overload current
vs. time per diode
2
Fig. 3 I t vs. time per diode
40
RthJA:
DC =
1
0.5
0.4
0.33
0.17
0.08
10
t [ms]
t [s]
12
0
100
VF [V]
16
[W]
200
TVJ = 25°C
20
Ptot
TVJ = 150°C
TVJ = 150°C
TVJ =
125°C
150°C
DC =
0.6 KW
1
0.8 KW
1
KW
2
KW
4
KW
8
KW
30
0.5
0.4
0.33
IF(AV)M
0.17
20
0.08
[A]
8
10
4
0
0
0
4
8
12
16
0
25
50
IF(AV)M [A]
75
100
125
150
175
0
25
50
75 100 125 150 175
TC [°C]
TA [°C]
Fig. 4 Power dissipation vs. forward current
and ambient temperature per diode
Fig. 5 Max. forward current vs.
case temperature per diode
5
4
ZthJC 3
Constants for ZthJC calculation:
[K/W]
i
Rth (K/W)
ti (s)
1
0.302
0.002
2
1.252
0.032
3
1.582
0.227
4
1.164
0.820
2
1
0
1
10
100
1000
10000
t [ms]
Fig. 6 Transient thermal impedance junction to case vs. time per diode
IXYS reserves the right to change limits, conditions and dimensions.
© 2019 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20191219d
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