IXA4I1200UC
preliminary
XPT IGBT
VCES
=
1200 V
I C25
=
9A
VCE(sat) =
1.8 V
Single IGBT
Part number
IXA4I1200UC
Marking on Product: X4TAU
Backside: collector
(C) 2+4
(G) 1
(E) 3
Features / Advantages:
Applications:
Package: TO-252 (DPak)
● Easy paralleling due to the positive temperature
coefficient of the on-state voltage
● Rugged XPT design (Xtreme light Punch Through)
results in:
- short circuit rated for 10 µsec.
- very low gate charge
- low EMI
- square RBSOA @ 3x Ic
● Thin wafer technology combined with the XPT design
results in a competitive low VCE(sat)
● AC motor drives
● Solar inverter
● Medical equipment
● Uninterruptible power supply
● Air-conditioning systems
● Welding equipment
● Switched-mode and resonant-mode
power supplies
● Inductive heating, cookers
● Pumps, Fans
● Industry standard outline
● RoHS compliant
● Epoxy meets UL 94V-0
IXYS reserves the right to change limits, conditions and dimensions.
© 2012 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20120917
IXA4I1200UC
preliminary
Ratings
IGBT
Symbol
VCES
Definition
collector emitter voltage
VGES
max. DC gate voltage
VGEM
max. transient gate emitter voltage
I C25
collector current
Conditions
min.
TVJ =
25°C
TC = 25°C
I C100
V
6.5
V
0.1
mA
gate emitter threshold voltage
I C = 0.1 mA; VGE = VCE
TVJ = 25°C
I CES
collector emitter leakage current
VCE = VCES; VGE = 0 V
TVJ = 25°C
1.8
TVJ = 125 °C
t d(on)
turn-on delay time
tr
current rise time
t d(off)
turn-off delay time
tf
current fall time
Eon
turn-on energy per pulse
Eoff
turn-off energy per pulse
RBSOA
reverse bias safe operating area
5.4
5.9
3A
TVJ = 125 °C
600 V; IC =
3A
VGE = ±15 V; R G = 330 Ω
VGE = ±15 V; R G = 330 Ω
short circuit safe operating area
VCEmax = 900 V
t SC
short circuit duration
VCE = 900 V; VGE = ±15 V
R G = 330 Ω; non-repetitive
I SC
R thJC
thermal resistance junction to case
R thCH
thermal resistance case to heatsink
nA
12
nC
70
ns
40
ns
250
ns
100
ns
0.4
mJ
0.3
mJ
TVJ = 125 °C
VCEmax = 1200 V
SCSOA
short circuit current
mA
0.1
500
inductive load
VCE =
V
2.1
TVJ = 125 °C
VCE = 600 V; VGE = 15 V; IC =
A
2.1
VGE(th)
VGE = ±20 V
V
9
A
TVJ = 25°C
total gate charge
±30
W
IC =
gate emitter leakage current
V
5
collector emitter saturation voltage
Q G(on)
±20
45
VCE(sat)
I GES
Unit
V
TC = 25°C
total power dissipation
3 A; VGE = 15 V
max.
1200
TC = 100 °C
Ptot
I CM
typ.
TVJ = 125 °C
9
A
10
µs
A
12
2.7 K/W
K/W
0.50
Diode
VRRM
max. repetitive reverse voltage
TVJ = 25°C
1200
V
I F25
forward current
TC = 25°C
tbd
A
TC = 100 °C
tbd
A
TVJ = 25°C
tbd
V
*
mA
I F 100
3A
VF
forward voltage
IF =
IR
reverse current
VR = VRRM
TVJ = 125°C
TVJ = 25°C
* not applicable, see Ices value above
V
tbd
*
mA
tbd
µC
tbd
A
TVJ = 125°C
Q rr
reverse recovery charge
I RM
max. reverse recovery current
t rr
reverse recovery time
E rec
reverse recovery energy
R thJC
thermal resistance junction to case
tbd K/W
R thCH
thermal resistance case to heatsink
K/W
IXYS reserves the right to change limits, conditions and dimensions.
© 2012 IXYS all rights reserved
VR = 600 V
-di F /dt =
IF =
A/µs
3 A; VGE = 0 V
TVJ = 125°C
tbd
ns
tbd
mJ
Data according to IEC 60747and per semiconductor unless otherwise specified
20120917
IXA4I1200UC
preliminary
Package
Ratings
TO-252 (DPak)
Symbol
I RMS
Definition
Conditions
RMS current
per terminal
min.
TVJ
virtual junction temperature
T op
operation temperature
Tstg
storage temperature
-40
typ.
max.
20
Unit
A
-40
150
°C
-40
125
°C
150
°C
Weight
FC
0.3
20
mounting force with clip
Product Marking
Part number
Assembly Line
I
X
A
4
I
1200
UC
abcdefg
Z YY
60
N
Part number
IXYS
Logo
g
=
=
=
=
=
=
=
IGBT
XPT IGBT
Gen 1 / std
Current Rating [A]
Single IGBT
Reverse Voltage [V]
TO-252AA (DPak)
WW
Date Code
Ordering
Standard
Part Number
IXA4I1200UC
Equivalent Circuits for Simulation
I
V0
R0
Marking on Product
X4TAU
Delivery Mode
IGBT
threshold voltage
1.1
V
R 0 max
slope resistance *
460
mΩ
© 2012 IXYS all rights reserved
Code No.
T VJ = 150 °C
* on die level
V 0 max
IXYS reserves the right to change limits, conditions and dimensions.
Quantity
Data according to IEC 60747and per semiconductor unless otherwise specified
20120917
IXA4I1200UC
preliminary
Outlines TO-252 (DPak)
(C) 2+4
(G) 1
(E) 3
IXYS reserves the right to change limits, conditions and dimensions.
© 2012 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20120917
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