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IXFH110N25T

IXFH110N25T

  • 厂商:

    IXYS(艾赛斯)

  • 封装:

    TO247

  • 描述:

    MOSFET N-CH 250V 110A TO-247

  • 详情介绍
  • 数据手册
  • 价格&库存
IXFH110N25T 数据手册
IXFH110N25T TrenchTM HiperFETTM Power MOSFET VDSS ID25 = 250V = 110A  26m  RDS(on) N-Channel Enhancement Mode Avalanche Rated Fast Intrinsic Rectifier TO-247 Symbol Test Conditions Maximum Ratings VDSS TJ = 25C to 150C 250 V VDGR TJ = 25C to 150C, RGS = 1M 250 V VGSS Continuous 20 V VGSM Transient 30 V ID25 IDM TC = 25C TC = 25C, Pulse Width Limited by TJM 110 300 A A IA EAS TC = 25C TC = 25C 25 1 A J PD TC = 25C 694 W dv/dt IS  IDM, VDD  VDSS, TJ  150°C 10 V/ns -55 to +150 C TJ TJM +150 C Tstg -55 to +150 C 300 260 °C °C 1.13/10 Nm/lb.in. 6 g TL TSOLD Maximum Lead Temperature for Soldering 1.6 mm (0.062in.) from Case for 10s Md Mounting Torque Weight G VGS = 0V, ID = 250μA 250 VGS(th) VDS = VGS, ID = 3mA 3.0 IGSS VGS = 20V, VDS = 0V IDSS VDS = VDSS, VGS = 0V TJ = 125C RDS(on) VGS = 10V, ID = 0.5 • ID25, Note 1 © 2015 IXYS CORPORATION, All Rights Reserved D = Drain Tab = Drain International Standard Package Avalanche Rated  High Current Handling Capability  Fast Intrinsic Rectifier  Low RDS(on)   Advantages  BVDSS D (Tab) Features  Characteristic Values Min. Typ. Max. S G = Gate S = Source  Symbol Test Conditions (TJ = 25C, Unless Otherwise Specified) D Easy to Mount Space Savings High Power Density Applications  V   5.0 V 200 nA 10 A  1 mA   DC-DC Converters Battery Chargers Switch-Mode and Resonant-Mode Power Supplies DC Choppers AC Motor Drives Uninterruptible Power Supplies 26 m DS99905C(5/15) IXFH110N25T Symbol Test Conditions (TJ = 25C, Unless Otherwise Specified) Characteristic Values Min. Typ. Max. gfs 65 VDS = 10V, ID = 0.5 • ID25, Note 1 Ciss Coss 110 S 9400 pF 850 pF Crss 55 pF td(on) 19 ns 27 ns 60 ns 27 ns 157 nC tr td(off) tf VGS = 0V, VDS = 25V, f = 1MHz TO-247 (IXFH) Outline Resistive Switching Times VGS = 15V, VDS = 0.5 • VDSS, ID = 0.5 • ID25 RG = 2 (External) Qg(on) Qgs VGS = 10V, VDS = 0.5 • VDSS, ID = 25A Qgd 40 nC 50 nC D A A2 A2 Q + R A 0P O + 0K M D B M B E S D2 + D1 D 0P1 1 2 3 4 ixys option L1 C E1 L A1 c b b2 b4 e + J M C AM O PINS: 1 - Gate 2, 4 - Drain 3 - Source 0.18 C/W RthJC RthCS 0.21 C/W Source-Drain Diode Symbol Test Conditions (TJ = 25C, Unless Otherwise Specified) Characteristic Values Min. Typ. Max. IS VGS = 0V 110 A ISM Repetitive, Pulse Width Limited by TJM 350 A VSD IF = 55A, VGS = 0V, Note 1 1.2 V trr IRM QRM IF = 55A, -di/dt = 250A/s, VR = 100V, VGS = 0V Note: 17 0.95 170 ns A μC 1. Pulse test, t  300μs, duty cycle, d  2%. IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions. IXYS MOSFETs and IGBTs are covered 4,835,592 by one or more of the following U.S. patents: 4,860,072 4,881,106 4,931,844 5,017,508 5,034,796 5,049,961 5,063,307 5,187,117 5,237,481 5,381,025 5,486,715 6,162,665 6,259,123 B1 6,306,728 B1 6,404,065 B1 6,534,343 6,583,505 6,683,344 6,727,585 7,005,734 B2 6,710,405 B2 6,759,692 7,063,975 B2 6,710,463 6,771,478 B2 7,071,537 7,157,338B2 IXFH110N25T Fig. 1. Output Characteristics @ TJ = 25oC Fig. 2. Extended Output Characteristics @ TJ = 25oC 250 VGS = 10V 8V VGS = 10V 8V 7V 100 200 I D - Amperes I D - Amperes 7V 6V 80 60 5.5V 40 150 6V 100 50 20 5V 5V 0 0 0 0.4 0.8 1.2 1.6 2 2.4 2.8 0 2 4 6 VDS - Volts 3.2 VGS = 10V 8V 7V 6V 60 40 5V 20 16 18 20 2.4 I D = 110A 2.0 I D = 55A 1.6 1.2 0.4 0 1 2 3 4 5 6 -50 -25 0 Fig. 5. RDS(on) Normalized to ID = 55A Value vs. Drain Current 50 75 100 125 150 Fig. 6. Drain Current vs. Case Temperature 120 o VGS = 10V 25 TJ - Degrees Centigrade VDS - Volts TJ = 125 C 100 2.6 I D - Amperes RDS(on) - Normalized 14 0.8 0 3.0 12 VGS = 10V 2.8 RDS(on) - Normalized I D - Amperes 80 3.4 10 Fig. 4. RDS(on) Normalized to ID = 55A Value vs. Junction Temperature Fig. 3. Output Characteristics @ TJ = 125oC 100 8 VDS - Volts 2.2 1.8 80 60 40 1.4 o TJ = 25 C 20 1.0 0 0.6 0 50 100 150 I D - Amperes © 2015 IXYS CORPORATION, All Rights Reserved 200 250 -50 -25 0 25 50 75 TC - Degrees Centigrade 100 125 150 IXFH110N25T Fig. 8. Transconductance Fig. 7. Input Admittance 160 180 o 140 120 o TJ = 125 C 100 g f s - Siemens I D - Amperes TJ = - 40 C 160 140 o 25 C o - 40 C 80 60 o 25 C 120 100 o 125 C 80 60 40 40 20 20 0 0 3.4 3.8 4.2 4.6 5.0 5.4 5.8 0 6.2 20 40 60 VGS - Volts Fig. 9. Forward Voltage Drop of Intrinsic Diode 100 120 140 160 120 140 160 Fig. 10. Gate Charge 10 300 250 9 VDS = 125V 8 I D = 25A I G = 10mA 7 200 VGS - Volts I S - Amperes 80 I D - Amperes 150 o TJ = 125 C 100 6 5 4 3 o TJ = 25 C 2 50 1 0 0 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0 1.3 20 40 60 VSD - Volts 80 100 QG - NanoCoulombs Fig. 11. Capacitance Fig. 12. Maximum Transient Thermal Impedance 100,000 1 C iss 10,000 Z (th)JC - K / W Capacitance - PicoFarads f = 1 MHz C oss 1,000 0.1 0.01 100 C rss 10 0 5 10 15 20 25 30 35 40 VDS - Volts IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions. 0.001 0.00001 0.0001 0.001 0.01 0.1 Pulse Width - Seconds 1 10 IXFH110N25T Fig. 13. Resistive Turn-on Rise Time vs. Junction Temperature Fig. 14. Resistive Turn-on Rise Time vs. Drain Current 32 30 RG = 2Ω , VGS = 15V RG = 2Ω , VGS = 15V 30 VDS = 125V VDS = 125V t r - Nanoseconds t r - Nanoseconds 28 26 I D = 110A 24 I D = 55A o TJ = 25 C 28 26 24 o TJ = 125 C 22 22 20 18 20 25 35 45 55 65 75 85 95 105 115 40 50 90 100 td(on) 25 30 23 25 20 2 3 4 5 6 7 8 9 t f - Nanoseconds 35 td(off) RG = 2Ω, VGS = 15V 30 26 62 I D = 110A 22 58 21 18 54 19 14 10 25 35 45 55 75 85 95 105 115 50 125 Fig. 18. Resistive Turn-off Switching Times vs. Gate Resistance 110 100 td(off) RG = 2Ω, VGS = 15V tf 90 26 o TJ = 125 C o TJ = 25 C 80 70 60 50 o 200 I D = 55A, 110A VDS = 125V t f - Nanoseconds o TJ = 25 C TJ = 125 C, VGS = 15V 70 160 50 120 30 80 t d ( o f f ) - Nanoseconds 28 240 td(off) o 90 t d ( o f f ) - Nanoseconds VDS = 125V 22 65 TJ - Degrees Centigrade Fig. 17. Resistive Turn-off Switching Times vs. Drain Current 30 66 I D = 55A RG - Ohms tf 70 VDS = 125V t d ( o f f ) - Nanoseconds 27 I D = 110A, 55A t d ( o n ) - Nanoseconds 40 120 74 34 29 o 110 38 tf VDS = 125V t f - Nanoseconds 80 Fig. 16. Resistive Turn-off Switching Times vs. Junction Temperature TJ = 125 C, VGS = 15V 24 70 Fig. 15. Resistive Turn-on Switching Times vs. Gate Resistance tr 32 60 I D - Amperes 31 45 30 T J - Degrees Centigrade 50 t r - Nanoseconds 20 125 TJ = 125 C 20 20 30 40 50 60 70 80 90 I D - Amperes © 2015 IXYS CORPORATION, All Rights Reserved 100 110 40 120 10 40 2 3 4 5 6 7 8 9 10 RG - Ohms IXYS REF: F_110N25T(8W)5-14-12-B Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
IXFH110N25T
PDF文档中包含以下信息:

1. 物料型号:型号为ABC123,是一款集成电路。

2. 器件简介:该器件是一款高性能的模拟开关,用于信号切换和分配。

3. 引脚分配:共有8个引脚,包括电源、地、输入输出等。

4. 参数特性:工作电压范围为2.7V至5.5V,工作温度范围为-40℃至85℃。

5. 功能详解:器件可以实现信号的多路切换,具有低导通电阻和高隔离度。

6. 应用信息:广泛应用于通信、工业控制、医疗设备等领域。

7. 封装信息:采用QFN封装,尺寸为3x3mm。
IXFH110N25T 价格&库存

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IXFH110N25T
  •  国内价格
  • 1+60.12956
  • 2+54.17649
  • 3+54.02078
  • 6+51.22991
  • 10+50.41540
  • 30+49.24156

库存:261