Advance Technical Information
IXFT150N20T
IXFH150N20T
TrenchTM HiperFETTM
Power MOSFETs
VDSS
ID25
= 200V
= 150A
≤ 15mΩ
Ω
RDS(on)
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Rectifier
TO-268 (IXFT)
G
S
D (Tab)
Symbol
Test Conditions
Maximum Ratings
VDSS
TJ = 25°C to 150°C
200
V
VDGR
TJ = 25°C to 150°C, RGS = 1MΩ
200
V
VGSS
Continuous
±20
V
VGSM
Transient
±30
V
ID25
TC = 25°C
150
A
IDM
TC = 25°C, Pulse Width Limited by TJM
375
A
IA
EAS
TC = 25°C
TC = 25°C
75
1.5
A
J
PD
TC = 25°C
890
W
dv/dt
IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 150°C
20
V/ns
-55 to +150
°C
TJM
+150
°C
Tstg
-55 to +150
°C
TJ
TO-247 (IXFH)
G
D
S
G = Gate
S = Source
D (Tab)
D
= Drain
Tab = Drain
Features
TL
1.6mm (0.063in) from Case for 10s
300
°C
z
TSOLD
Plastic Body for 10s
260
°C
z
Md
Mounting Torque (TO-247)
1.13/10
Nm/lb.in.
Weight
TO-268
TO-247
4
6
g
g
International Standard Packages
Avalanche Rated
z
High Current Handling Capability
z
Fast Intrinsic Rectifier
z
Low RDS(on)
Advantages
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVDSS
VGS = 0V, ID = 1mA
200
VGS(th)
VDS = VGS, ID = 4mA
3.0
IGSS
VGS = ±20V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
TJ = 125°C
RDS(on)
VGS = 10V, ID = 0.5 • ID25, Note 1
z
z
z
V
5.0
V
±200
nA
25
μA
z
1.5 mA
z
Applications
z
15 mΩ
z
z
z
z
© 2011 IXYS CORPORATION, All Rights Reserved
Easy to Mount
Space Savings
High Power Density
DC-DC Converters
Battery Chargers
Switch-Mode and Resonant-Mode
Power Supplies
DC Choppers
AC Motor Drives
Uninterruptible Power Supplies
High Speed Power Switching
Applications
DS100426(12/11)
IXFT150N20T
IXFH150N20T
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
gfs
66
VDS = 10V, ID = 0.5 • ID25, Note 1
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
Crss
td(on)
tr
td(off)
tf
Resistive Switching Times
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 2Ω (External)
Qg(on)
Qgs
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
112
S
11.7
nF
1250
pF
162
pF
43
ns
12
ns
45
ns
12
ns
177
nC
70
nC
44
nC
Terminals: 1 - Gate
3 - Source
2,4 - Drain
0.14 °C/W
RthJC
RthCS
TO-268 Outline
TO-247
0.21
°C/W
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
IS
VGS = 0V
150
A
ISM
Repetitive, Pulse Width Limited by TJM
600
A
VSD
IF = 100A, VGS = 0V, Note 1
1.4
V
trr
IRM
QRM
IF = 75A, -di/dt = 100A/μs,
VR = 75V, VGS = 0V
100
8.0
0.4
TO-247 Outline
ns
A
μC
1
2
∅P
3
e
Note 1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%.
Terminals: 1 - Gate
3 - Source
Dim.
ADVANCE TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from a subjective evaluation of the design, based upon prior knowledge and experience, and constitute a
"considered reflection" of the anticipated result. IXYS reserves the right to change limits, test
conditions, and dimensions without notice.
Millimeter
Min. Max.
A
4.7
5.3
2.2
2.54
A1
A2
2.2
2.6
b
1.0
1.4
1.65
2.13
b1
b2
2.87
3.12
C
.4
.8
D
20.80 21.46
E
15.75 16.26
e
5.20
5.72
L
19.81 20.32
L1
4.50
∅P 3.55
3.65
Q
5.89
6.40
R
4.32
5.49
S
6.15 BSC
2 - Drain
Inches
Min. Max.
.185 .209
.087 .102
.059 .098
.040 .055
.065 .084
.113 .123
.016 .031
.819 .845
.610 .640
0.205 0.225
.780 .800
.177
.140 .144
0.232 0.252
.170 .216
242 BSC
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXFT150N20T
IXFH150N20T
Fig. 1. Output Characteristics @ T J = 25ºC
Fig. 2. Extended Output Characteristics @ T J = 25ºC
150
350
VGS = 10V
8V
VGS = 10V
8V
300
7V
250
ID - Amperes
ID - Amperes
100
6V
50
200
7V
150
100
6V
50
5V
5V
0
0
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
2.2
0
2.4
10
15
20
VDS - Volts
Fig. 3. Output Characteristics @ T J = 125ºC
Fig. 4. RDS(on) Normalized to ID = 75A Value vs.
Junction Temperature
2.8
150
VGS = 10V
8V
7V
VGS = 10V
2.4
R DS(on) - Normalized
ID - Amperes
5
VDS - Volts
100
6V
50
5V
2.0
I D = 150A
I D = 75A
1.6
1.2
0.8
4V
0
0.4
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
-50
5
-25
0
VDS - Volts
25
50
75
100
125
150
125
150
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to ID = 75A Value vs.
Drain Current
Fig. 6. Maximum Drain Current vs.
Case Temperature
160
3.0
VGS = 10V
2.6
140
TJ = 125ºC
2.2
ID - Amperes
R DS(on) - Normalized
120
1.8
TJ = 25ºC
1.4
100
80
60
40
1.0
20
0.6
0
0
40
80
120
160
200
ID - Amperes
© 2011 IXYS CORPORATION, All Rights Reserved
240
280
320
-50
-25
0
25
50
75
TC - Degrees Centigrade
100
IXFT150N20T
IXFH150N20T
Fig. 7. Input Admittance
Fig. 8. Transconductance
180
180
160
160
TJ = - 40ºC
140
g f s - Siemens
120
ID - Amperes
140
TJ = 125ºC
25ºC
- 40ºC
100
80
25ºC
120
100
125ºC
80
60
60
40
40
20
20
0
0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
0
7.5
20
40
60
80
VGS - Volts
Fig. 9. Forward Voltage Drop of Intrinsic Diode
140
160
180
200
10
VDS = 100V
9
300
I D = 75A
8
250
I G = 10mA
7
VGS - Volts
IS - Amperes
120
Fig. 10. Gate Charge
350
200
150
TJ = 125ºC
100
6
5
4
3
2
TJ = 25ºC
50
1
0
0
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
0
1.3
20
40
60
VSD - Volts
80
100
120
180
Fig. 12. Forward-Bias Safe Operating Area @ TC = 25ºC
f = 1 MHz
RDS(on) Limit
25µs
100
Ciss
IC - Amperes
10,000
Coss
100µs
10
1,000
1
1ms
TJ = 150ºC
TC = 25ºC
Single Pulse
Crss
10ms
DC
0.1
100
5
160
1000
100,000
0
140
QG - NanoCoulombs
Fig. 11. Capacitance
Capacitance - PicoFarads
100
ID - Amperes
10
15
20
25
30
35
40
VDS - Volts
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
1
10
100
VCE - Volts
100ms
1000
IXFT150N20T
IXFH150N20T
Fig. 13. Resistive Turn-on Rise Time vs.
Junction Temperature
Fig. 14. Resistive Turn-on Rise Time vs.
Drain Current
18
18
RG = 2Ω , VGS = 10V
17
VDS = 100V
16
15
I
D
t r - Nanoseconds
16
t r - Nanoseconds
RG = 2Ω , VGS = 10V
17
VDS = 100V
= 75A
14
I
13
D
= 150A
14
13
12
12
11
11
10
TJ = 125ºC
15
TJ = 25ºC
10
25
35
45
55
65
75
85
95
105
115
125
70
80
90
100
TJ - Degrees Centigrade
Fig. 15. Resistive Turn-on Switching Times vs.
Gate Resistance
130
110
TJ = 125ºC, VGS = 10V
t r - Nanoseconds
80
50
40
30
0
6
8
10
12
14
16
16
55
I D = 75A
12
50
I D = 150A
45
4
25
18
35
45
55
Fig. 17. Resistive Turn-off Switching Times vs.
Drain Current
19
15
55
14
50
13
45
TJ = 25ºC
12
40
11
110
115
40
125
120
130
ID - Amperes
© 2011 IXYS CORPORATION, All Rights Reserved
140
35
150
td(off) - - - 250
TJ = 125ºC, VGS = 10V
I D = 150A
VDS = 100V
t f - Nanoseconds
60
TJ = 125ºC
100
105
160
200
I
120
D
= 75A
150
80
100
40
50
0
0
2
4
6
8
10
RG - Ohms
12
14
16
18
t d ( o f f ) - Nanoseconds
65
90
tf
200
16
80
95
300
70
VDS = 100V
70
85
240
t d ( o f f ) - Nanoseconds
t f - Nanoseconds
td(off) - - - -
RG = 2Ω, VGS = 10V
17
75
Fig. 18. Resistive Turn-off Switching Times vs.
Gate Resistance
75
tf
65
TJ - Degrees Centigrade
RG - Ohms
18
60
VDS = 100V
8
10
4
td(off) - - - -
t d ( o f f ) - Nanoseconds
70
I D = 75A
2
150
RG = 2Ω, VGS = 10V
20
t d ( o n ) - Nanoseconds
90
I D = 150A
120
140
65
tf
VDS = 100V
160
130
24
td(on) - - - -
t f - Nanoseconds
200
120
Fig. 16. Resistive Turn-off Switching Times vs.
Junction Temperature
240
tr
110
ID - Amperes
IXFT150N20T
IXFH150N20T
Fig. 19. Maximum Transient Thermal Impedance
1
Z (th)JC - ºC / W
0.1
0.01
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS REF: F_150N20T(8G)12-14-11
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