Preliminary Technical Information
IXFT94N30T
IXFH94N30T
TrenchTM HiperFETTM
Power MOSFETs
VDSS
ID25
= 300V
= 94A
≤ 36mΩ
Ω
RDS(on)
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Rectifier
TO-268 (IXFT)
G
S
Symbol
Test Conditions
Maximum Ratings
VDSS
TJ = 25°C to 150°C
300
V
VDGR
TJ = 25°C to 150°C, RGS = 1MΩ
300
V
VGSS
Continuous
±20
V
VGSM
Transient
±30
V
D (Tab)
ID25
TC = 25°C
94
A
IDM
TC = 25°C, Pulse Width Limited by TJM
235
A
IA
EAS
TC = 25°C
TC = 25°C
47
500
A
mJ
PD
TC = 25°C
890
W
dv/dt
IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 150°C
20
V/ns
-55 to +150
°C
TJM
+150
°C
Tstg
-55 to +150
°C
TJ
TL
1.6mm (0.063in) from Case for 10s
300
°C
TSOLD
Plastic Body for 10s
260
°C
Md
Mounting Torque (TO-247)
1.13/10
Nm/lb.in.
Weight
TO-268
TO-247
4
6
g
g
TO-247 (IXFH)
G
D
S
G = Gate
S = Source
D (Tab)
D
= Drain
Tab = Drain
Features
International Standard Packages
Avalanche Rated
z
High Current Handling Capability
z
Fast Intrinsic Rectifier
z
Low RDS(on)
z
z
Advantages
z
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVDSS
VGS = 0V, ID = 1mA
300
VGS(th)
VDS = VGS, ID = 4mA
3.0
IGSS
VGS = ±20V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
TJ = 125°C
RDS(on)
VGS = 10V, ID = 0.5 • ID25, Note 1
z
z
V
5.0
V
±200
nA
50
μA
2
mA
36 mΩ
Applications
z
z
z
z
z
z
z
© 2011 IXYS CORPORATION, All Rights Reserved
Easy to Mount
Space Savings
High Power Density
DC-DC Converters
Battery Chargers
Switch-Mode and Resonant-Mode
Power Supplies
DC Choppers
AC Motor Drives
Uninterruptible Power Supplies
High Speed Power Switching
Applications
DS100383A(11/11)
IXFT94N30T
IXFH94N30T
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
gfs
55
VDS = 10V, ID = 0.5 • ID25, Note 1
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
Crss
td(on)
tr
td(off)
tf
Qgs
95
S
11.4
nF
917
pF
116
pF
40
ns
14
ns
45
ns
12
ns
190
nC
65
nC
53
nC
Resistive Switching Times
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 2Ω (External)
Qg(on)
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
Terminals: 1 - Gate
3 - Source
2,4 - Drain
0.14 °C/W
RthJC
RthCS
TO-268 Outline
TO-247
0.21
°C/W
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
IS
VGS = 0V
ISM
Repetitive, Pulse Width Limited by TJM
VSD
IF = IS, VGS = 0V, Note 1
trr
IRM
QRM
IF = 47A, -di/dt = 100A/μs,
VR = 100V, VGS = 0V
94
A
376
A
1.4
V
155
10.6
816
TO-247 Outline
ns
A
nC
1
2
∅P
3
e
Note 1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%.
Terminals: 1 - Gate
3 - Source
Dim.
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
Millimeter
Min. Max.
A
4.7
5.3
2.2
2.54
A1
A2
2.2
2.6
b
1.0
1.4
1.65
2.13
b1
b2
2.87
3.12
C
.4
.8
D
20.80 21.46
E
15.75 16.26
e
5.20
5.72
L
19.81 20.32
L1
4.50
∅P 3.55
3.65
Q
5.89
6.40
R
4.32
5.49
S
6.15 BSC
2 - Drain
Inches
Min. Max.
.185 .209
.087 .102
.059 .098
.040 .055
.065 .084
.113 .123
.016 .031
.819 .845
.610 .640
0.205 0.225
.780 .800
.177
.140 .144
0.232 0.252
.170 .216
242 BSC
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXFT94N30T
IXFH94N30T
Fig. 2. Extended Output Characteristics @ T J = 25ºC
Fig. 1. Output Characteristics @ T J = 25ºC
100
240
VGS = 10V
7V
90
200
80
160
ID - Amperes
ID - Amperes
70
6V
60
50
40
7V
120
6V
80
30
20
40
5V
10
5V
0
0
0
0.5
1
1.5
2
2.5
3
0
3.5
5
10
20
25
VDS - Volts
Fig. 3. Output Characteristics @ T J = 125ºC
Fig. 4. RDS(on) Normalized to ID = 47A Value vs.
Junction Temperature
2.8
VGS = 10V
7V
90
VGS = 10V
2.4
70
R DS(on) - Normalized
80
6V
60
50
40
30
5V
20
I D = 94A
2.0
I D = 47A
1.6
1.2
0.8
10
4V
0
0.4
0
1
2
3
4
5
6
-50
7
-25
0
VDS - Volts
25
50
75
100
125
150
125
150
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to ID = 47A Value vs.
Drain Current
Fig. 6. Maximum Drain Current vs.
Case Temperature
100
3.4
VGS = 10V
3.0
90
TJ = 125ºC
80
2.6
70
ID - Amperes
R DS(on) - Normalized
15
VDS - Volts
100
ID - Amperes
VGS = 10V
8V
2.2
1.8
TJ = 25ºC
60
50
40
30
1.4
20
1.0
10
0.6
0
0
40
80
120
160
ID - Amperes
© 2011 IXYS CORPORATION, All Rights Reserved
200
240
-50
-25
0
25
50
75
TC - Degrees Centigrade
100
IXFT94N30T
IXFH94N30T
Fig. 8. Transconductance
Fig. 7. Input Admittance
180
180
160
160
TJ = - 40ºC
140
g f s - Siemens
120
ID - Amperes
140
TJ = 125ºC
25ºC
- 40ºC
100
80
25ºC
120
100
125ºC
80
60
60
40
40
20
20
0
0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
0
7.0
20
40
60
80
VGS - Volts
Fig. 9. Forward Voltage Drop of Intrinsic Diode
120
140
160
180
180
200
Fig. 10. Gate Charge
10
300
9
250
VDS = 150V
I D = 47A
8
I G = 10mA
7
VGS - Volts
200
IS - Amperes
100
ID - Amperes
150
TJ = 125ºC
100
6
5
4
3
TJ = 25ºC
2
50
1
0
0
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
0
20
40
VSD - Volts
60
80
100
120
140
160
QG - NanoCoulombs
Fig. 12. Forward-Bias Safe Operating Area @ TC = 25ºC
Fig. 11. Capacitance
1000
100,000
RDS(on) Limit
f = 1 MHz
Capacitance - PicoFarads
Ciss
100
IC - Amperes
10,000
Coss
1,000
25µs
100µs
10
1
100
1ms
Crss
0.1
10
0
5
10
15
20
25
30
35
40
VDS - Volts
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
10
100
VCE - Volts
1000
IXFT94N30T
IXFH94N30T
Fig. 13. Resistive Turn-on Rise Time vs.
Junction Temperature
Fig. 14. Resistive Turn-on Rise Time vs.
Drain Current
28
28
RG = 2Ω , VGS = 10V
26
VDS = 150V
24
t r - Nanoseconds
24
t r - Nanoseconds
RG = 2Ω , VGS = 10V
26
VDS = 150V
22
I
20
D
= 94A
18
I
16
D = 47A
22
18
16
14
14
12
12
10
TJ = 125ºC
20
TJ = 25ºC
10
25
35
45
55
65
75
85
95
105
115
45
125
50
55
60
65
TJ - Degrees Centigrade
Fig. 15. Resistive Turn-on Switching Times vs.
Gate Resistance
180
250
22
90
95
90
I D = 47A
60
50
t f - Nanoseconds
150
80
VDS = 150V
70
18
16
60
I D = 47A, 94A
14
50
12
10
t d ( o f f ) - Nanoseconds
120
t d ( o n ) - Nanoseconds
200
td(off) - - - -
RG = 2Ω, VGS = 10V
20
VDS = 150V
t r - Nanoseconds
85
90
tf
150
TJ = 125ºC, VGS = 10V
I D = 94A
80
24
td(on) - - - -
100
75
Fig. 16. Resistive Turn-off Switching Times vs.
Junction Temperature
300
tr
70
ID - Amperes
40
30
8
0
6
0
2
4
6
8
10
12
14
16
25
18
35
45
55
Fig. 17. Resistive Turn-off Switching Times vs.
Drain Current
td(off) - - - -
100
350
90
300
RG = 2Ω, VGS = 10V
70
16
60
14
50
12
40
TJ = 25ºC
10
30
8
20
45
50
55
60
65
70
105
115
30
125
75
80
ID - Amperes
© 2011 IXYS CORPORATION, All Rights Reserved
85
90
95
320
tf
td(off) - - - -
280
TJ = 125ºC, VGS = 10V
VDS = 150V
250
t f - Nanoseconds
t f - Nanoseconds
TJ = 125ºC
18
95
240
200
200
I D = 47A
150
160
I
D
= 94A
100
120
50
80
0
40
2
4
6
8
10
RG - Ohms
12
14
16
18
t d ( o f f ) - Nanoseconds
80
t d ( o f f ) - Nanoseconds
VDS = 150V
20
85
Fig. 18. Resistive Turn-off Switching Times vs.
Gate Resistance
24
tf
75
TJ - Degrees Centigrade
RG - Ohms
22
65
IXFT94N30T
IXFH94N30T
Fig. 19. Maximum Transient Thermal Impedance
Z (th )J C - ºC / W
1
0.1
0.01
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS REF: F_94N30T(8G)9-19-11
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