IXFK210N30X3
IXFX210N30X3
X3-Class HiPerFETTM
Power MOSFET
VDSS
ID25
RDS(on)
= 300V
= 210A
5.5m
D
N-Channel Enhancement Mode
Avalanche Rated
G
TO-264
(IXFK)
S
Symbol
Test Conditions
Maximum Ratings
VDSS
TJ = 25C to 150C
300
V
VDGR
TJ = 25C to 150C, RGS = 1M
300
V
S
VGSS
Continuous
20
V
VGSM
Transient
30
V
PLUS247
(IXFX)
ID25
IL(RMS)
IDM
TC = 25C
External Lead Current Limit
TC = 25C, Pulse Width Limited by TJM
210
160
650
A
A
A
IA
TC = 25C
105
A
EAS
TC = 25C
3
J
dv/dt
IS IDM, VDD VDSS, TJ 150°C
50
V/ns
PD
TC = 25C
1250
W
G
-55 ... +150
C
TJM
150
C
Tstg
-55 ... +150
C
300
260
°C
°C
1.13/10
Nm/lb.in
20..120 /4.5..27
N/lb
10
6
g
g
TJ
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
Md
Mounting Torque (TO-264)
FC
Mounting Force
Weight
TO-264
PLUS247
D
G
Tab
S
G = Gate
S = Source
D = Drain
Tab = Drain
Features
(PLUS247)
D
Tab
International Standard Packages
Low RDS(ON) and QG
Avalanche Rated
Low Package Inductance
Advantages
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVDSS
VGS = 0V, ID = 3mA
300
VGS(th)
VDS = VGS, ID = 8mA
2.5
IGSS
VGS = 20V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
RDS(on)
V
4.5
V
200 nA
TJ = 125C
VGS = 10V, ID = 0.5 • ID25, Note 1
4.3
Applications
25 A
2.5 mA
5.5 m
© 2019 IXYS CORPORATION, All Rights Reserved
High Power Density
Easy to Mount
Space Savings
Switch-Mode and Resonant-Mode
Power Supplies
DC-DC Converters
PFC Circuits
AC and DC Motor Drives
Robotics and Servo Controls
DS100864B(11/19)
IXFK210N30X3
IXFX210N30X3
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max
gfs
VDS = 10V, ID = 60A, Note 1
84
RGi
Gate Input Resistance
Ciss
Coss
140
S
2
24.2
nF
3.1
nF
7.7
pF
1100
4600
pF
pF
38
ns
40
ns
210
ns
15
ns
375
nC
107
nC
100
nC
VGS = 0V, VDS = 25V, f = 1MHz
Crss
Effective Output Capacitance
Co(er)
Co(tr)
Energy related
td(on)
Resistive Switching Times
tr
td(off)
tf
Time related
VGS = 0V
VDS = 0.8 • VDSS
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 1 (External)
Qg(on)
Qgs
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
0.10 C/W
RthJC
RthCS
C/W
0.15
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max
IS
VGS = 0V
210
A
ISM
Repetitive, Pulse Width Limited by TJM
840
A
VSD
IF = 100A, VGS = 0V, Note 1
1.4
V
trr
QRM
IRM
IF = 105A, -di/dt = 100A/μs
190
1.4
15
ns
μC
A
6,162,665
6,259,123B1
6,306,728B1
6,404,065B1
6,534,343
6,583,505
VR = 100V
Note 1. Pulse test, t 300s, duty cycle, d 2%.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,683,344
6,710,405B2
6,710,463
6,727,585
7,005,734B2
6,759,692
7,063,975B2
6,771,478B2 7,071,537
7,157,338B2
IXFK210N30X3
IXFX210N30X3
o
o
Fig. 2. Extended Output Characteristics @ TJ = 25 C
Fig. 1. Output Characteristics @ TJ = 25 C
900
220
VGS = 10V
8V
200
VGS = 10V
180
700
7V
160
8V
600
140
120
I D - Amperes
I D - Amperes
9V
800
6V
100
80
500
7V
400
300
60
6V
200
40
5V
20
100
0
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
5V
0
2
4
6
8
VDS - Volts
2.4
220
VGS = 10V
8V
16
18
20
22
VGS = 10V
2.2
7V
180
2.0
140
RDS(on) - Normalized
160
I D - Amperes
14
Fig. 4. RDS(on) Normalized to ID = 105A Value vs.
Junction Temperature
o
6V
120
100
80
5V
60
1.8
I D = 210A
1.6
I D = 105A
1.4
1.2
1.0
40
0.8
20
4V
0.6
0
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
-50
2.2
-25
0
25
VDS - Volts
75
100
125
150
Fig. 6. Normalized Breakdown & Threshold Voltages
vs. Junction Temperature
1.3
VGS = 10V
1.2
BVDSS / VGS(th) - Normalized
3.5
50
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to ID = 105A Value vs.
Drain Current
4.0
RDS(on) - Normalized
12
VDS - Volts
Fig. 3. Output Characteristics @ TJ = 125 C
200
10
3.0
o
TJ = 125 C
2.5
2.0
1.5
o
TJ = 25 C
BVDSS
1.1
1.0
0.9
0.8
VGS(th)
0.7
1.0
0.6
0.5
0
100
200
300
400
500
600
I D - Amperes
© 2019 IXYS CORPORATION, All Rights Reserved
700
800
900
-60
-40
-20
0
20
40
60
80
TJ - Degrees Centigrade
100
120
140
160
IXFK210N30X3
IXFX210N30X3
Fig. 7. Maximum Drain Current vs. Case Temperature
Fig. 8. Input Admittance
280
180
160
VDS = 10V
240
External Lead Current Limit
140
200
I D - Amperes
I D - Amperes
120
100
80
60
160
120
o
TJ = 125 C
o
25 C
80
o
40
- 40 C
40
20
0
0
-50
-25
0
25
50
75
100
125
3.0
150
3.5
4.0
4.5
TC - Degrees Centigrade
5.0
5.5
6.0
6.5
VGS - Volts
Fig. 10. Forward Voltage Drop of Intrinsic Diode
Fig. 9. Transconductance
400
600
o
TJ = - 40 C
VDS = 10V
350
500
400
o
250
25 C
I S - Amperes
g f s - Siemens
300
200
o
125 C
150
300
200
100
o
TJ = 125 C
100
50
o
TJ = 25 C
0
0
0
40
80
120
160
200
240
280
0.2
0.4
0.6
0.8
1.2
1.4
1.6
1.8
2.0
Fig. 12. Capacitance
Fig. 11. Gate Charge
100,000
10
VDS = 150V
8
I D = 105A
Ciss
Capacitance - PicoFarads
9
I G = 10mA
7
VGS - Volts
1.0
VSD - Volts
I D - Amperes
6
5
4
3
2
10,000
1,000
Coss
Crss
100
10
f = 1 MHz
1
0
1
0
50
100
150
200
250
300
350
400
QG - NanoCoulombs
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
1
10
100
VDS - Volts
1,000
IXFK210N30X3
IXFX210N30X3
Fig. 13. Output Capacitance Stored Energy
Fig. 14. Forward-Bias Safe Operating Area
1000
45
RDS(on) Limit
40
25μs
100
100μs
30
External Lead
Current Limit
I D - Amperes
E OSS - MicroJoules
35
25
20
15
10
1ms
1
10
o
10ms
TJ = 150 C
o
5
Fig. 15. Maximum Transient
10
0
50
100
150
200
250
DC
TC = 25 C
Thermal
Impedance
Single
Pulse
0.1
300
1
10
100
1,000
VDS - Volts
VDS - Volts
Fig. 15. Maximum Transient Thermal Impedance
aaaaa
0.2
Z (th)JC - K / W
0.1
0.01
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
© 2019 IXYS CORPORATION, All Rights Reserved
IXYS REF: F_210N30X3 (29-S301) 11-08-17
IXFK210N30X3
IXFX210N30X3
PLUS247 Outline
1 - Gate
2,4 - Drain
3 - Source
TO-264 Outline
1 - Gate
2,4 - Drain
3 - Source
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXFK210N30X3
IXFX210N30X3
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© 2019 IXYS CORPORATION, All Rights Reserved