IXFK230N20T

IXFK230N20T IXFX230N20T GigaMOSTM Power MOSFET VDSS ID25 TO-264 (IXFK) Symbol Test Conditions VDSS VDGR TJ = 25C to 175C TJ = 25C to 175C, RGS = 1M 200 200 V V VGSS VGSM Continuous Transient  20  30 V V ID25 IL(RMS) IDM TC = 25C (Chip Capability) External Lead Current Limit TC = 25C, Pulse Width Limited by TJM 230 160 630 A A A IA EAS TC = 25C TC = 25C 100 5 A J dv/dt IS  IDM, VDD  VDSS, TJ  175°C 20 V/ns PD TC = 25C 1670 W -55 ... +175 175 -55 ... +175 C C C 300 260 °C °C 1.13/10 Nm/lb.in 20..120 /4.5..27 N/lb 10 6 g g G D S Maximum Ratings TJ TJM Tstg TL TSOLD Maximum Lead Temperature for Soldering 1.6 mm (0.062in.) from Case for 10s Md Mounting Torque (TO-264) FC Mounting Force (PLUS247) Weight TO-264 PLUS247 Tab PLUS247 (IXFX) G Symbol Test Conditions (TJ = 25C Unless Otherwise Specified) Characteristic Values Min. Typ. Max. BVDSS VGS = 0V, ID = 3mA 200 VGS(th) VDS = VGS, ID = 8mA 3.0 IDSS VDS = VDSS, VGS = 0V RDS(on) VGS = 10V, ID = 60A, Note 1 5.0 200 TJ = 150C © 2014 IXYS CORPORATION, All Rights Reserved D      International Standard Packages High Current Handling Capability Fast Intrinsic Diode Avalanche Rated Low RDS(on) Advantages  Easy to Mount Space Savings High Power Density V Applications V  50 A 3 mA 7.5 m D = Drain Tab = Drain Features  nA Tab S G = Gate S = Source  VGS =  20V, VDS = 0V 200V 230A  7.5m 200ns RDS(on)   trr N-Channel Enhancement Mode Avalanche Rated Fast Intrinsic Diode IGSS = = Synchronous Recification DC-DC Converters  Battery Chargers  Switched-Mode and Resonant-Mode Power Supplies  DC Choppers  AC Motor Drives  Uninterruptible Power Supplies  High Speed Power Switching Applications  DS100133B(04/14) IXFK230N20T IXFX230N20T Symbol Test Conditions (TJ = 25C Unless Otherwise Specified) Characteristic Values Min. Typ. Max. gfs 90 VDS = 10V, ID = 60A, Note 1 Ciss Coss VGS = 0V, VDS = 25V, f = 1MHz Crss RGi td(on) tr td(off) tf Gate Input Resistance Resistive Switching Times VGS = 10V, VDS = 0.5 • VDSS, ID = ID = 0.5 • ID25 RG = 1 (External) Qg(on) Qgs VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25 Qgd TO-264 AA Outline 150 S 24 nF 2440 pF 60 pF 1.15  58 ns 38 ns 62 ns 17 ns 358 nC 138 nC 60 nC RthJC 0.09C/W RthCS 0.15C/W Source-Drain Diode Symbol Test Conditions (TJ = 25C, Unless Otherwise Specified) Characteristic Values Min. Typ. Max. IS VGS = 0V 230 A ISM Repetitive, Pulse Width Limited by TJM 920 A VSD IF = 60A, VGS = 0V, Note 1 1.3 V trr QRM IRM IF = 115A, -di/dt = 100A/s 0.74 VR = 75V, VGS = 0V 10.6 200 ns  C Dim. Millimeter Min. Max. A A1 A2 b b1 b2 c D E e J K L L1 P Q Q1 R R1 S T 4.82 5.13 2.54 2.89 2.00 2.10 1.12 1.42 2.39 2.69 2.90 3.09 0.53 0.83 25.91 26.16 19.81 19.96 5.46 BSC 0.00 0.25 0.00 0.25 20.32 20.83 2.29 2.59 3.17 3.66 6.07 6.27 8.38 8.69 3.81 4.32 1.78 2.29 6.04 6.30 1.57 1.83 Terminals: 1 - Gate 2 - Drain 3 - Source 4 - Drain Inches Min. Max. .190 .202 .100 .114 .079 .083 .044 .056 .094 .106 .114 .122 .021 .033 1.020 1.030 .780 .786 .215 BSC .000 .010 .000 .010 .800 .820 .090 .102 .125 .144 .239 .247 .330 .342 .150 .170 .070 .090 .238 .248 .062 .072 PLUS 247TM Outline A Terminals: 1 - Gate 2 - Drain 3 - Source Note 1: Pulse test, t  300s, duty cycle, d 2%. Dim. A A1 A2 b b1 b2 C D E e L L1 Q R IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions. IXYS MOSFETs and IGBTs are covered 4,835,592 by one or more of the following U.S. patents: 4,860,072 4,881,106 4,931,844 5,017,508 5,034,796 5,049,961 5,063,307 5,187,117 5,237,481 5,381,025 5,486,715 6,162,665 6,259,123 B1 6,306,728 B1 6,404,065 B1 6,534,343 6,583,505 Millimeter Min. Max. 4.83 5.21 2.29 2.54 1.91 2.16 1.14 1.40 1.91 2.13 2.92 3.12 0.61 0.80 20.80 21.34 15.75 16.13 5.45 BSC 19.81 20.32 3.81 4.32 5.59 6.20 4.32 4.83 Inches Min. Max. .190 .205 .090 .100 .075 .085 .045 .055 .075 .084 .115 .123 .024 .031 .819 .840 .620 .635 .215 BSC .780 .800 .150 .170 .220 0.244 .170 .190 6,683,344 6,727,585 7,005,734 B2 6,710,405 B2 6,759,692 7,063,975 B2 6,710,463 6,771,478 B2 7,071,537 7,157,338B2 IXFK230N20T IXFX230N20T Fig. 1. Output Characteristics @ TJ = 25ºC Fig. 2. Extended Output Characteristis @ TJ = 25ºC 350 240 VGS = 15V 10V 8V 200 VGS = 15V 10V 8V 300 7V I D - Amperes I D - Amperes 250 7V 160 120 6V 80 200 150 100 40 6V 50 5V 5V 0 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 0 2 1 2 3 VDS - Volts 3.0 240 VGS = 15V 10V 8V 6 7 8 9 VGS = 10V 2.6 7V RDS(on) - Normalized I D - Amperes 5 Fig. 4. RDS(on) Normalized to ID = 115A Value vs. Junction Temperature Fig. 3. Output Characteristics @ TJ = 150ºC 200 4 VDS - Volts 160 6V 120 80 40 2.2 I D = 230A 1.8 I D = 115A 1.4 1.0 0.6 5V 0 0.2 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 -50 -25 0 VDS - Volts 75 100 125 150 175 Fig. 6. Drain Current vs. Case Temperature 180 External Lead Current Limit VGS = 10V 3.0 50 TJ - Degrees Centigrade Fig. 5. RDS(on) Normalized to ID = 115A Value vs. Drain Current 3.4 25 160 TJ = 175ºC 120 I D - Amperes R DS(on) - Normalized 140 2.6 2.2 1.8 100 80 60 1.4 40 TJ = 25ºC 1.0 20 0 0.6 0 50 100 150 200 I D - Amperes © 2014 IXYS CORPORATION, All Rights Reserved 250 300 350 -50 -25 0 25 50 75 TC - Degrees Centigrade 100 125 150 175 IXFK230N20T IXFX230N20T Fig. 8. Transconductance Fig. 7. Input Admittance 280 200 TJ = - 40ºC 180 240 160 200 120 100 TJ = 150ºC 80 25ºC g f s - Siemens I D - Amperes 140 25ºC 160 150ºC 120 60 80 - 40ºC 40 40 20 0 0 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 0 20 40 60 80 VGS - Volts 120 140 160 180 200 Fig. 10. Gate Charge Fig. 9. Forward Voltage Drop of Intrinsic Diode 10 300 VDS = 100V 9 250 I D = 115A 8 I G = 10mA 7 200 VGS - Volts I S - Amperes 100 I D - Amperes 150 100 6 5 4 3 TJ = 150ºC 2 TJ = 25ºC 50 1 0 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0 40 80 Fig. 11. Capacitance 160 200 240 280 320 360 Fig. 12. Forward-Bias Safe Operating Area 100,000 1,000 f = 1 MHz RDS(on) Limit 25µs Ciss 10,000 100 I D - Amperes Capacitance - PicoFarads 120 QG - NanoCoulombs VSD - Volts C oss 1,000 100µs 10 100 TJ = 175ºC 1ms TC = 25ºC Single Pulse C rss 10 1 0 5 10 15 20 25 30 35 40 VDS - Volts IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions. 1 10 100 VDS - Volts 1,000 IXFK230N20T IXFX230N20T Fig. 13. Resistive Turn-on Rise Time vs. Junction Temperature 43 43 RG = 1Ω, VGS = 10V 42 RG = 1Ω, VGS = 10V 42 VDS = 100V VDS = 100V 41 t r - Nanoseconds 41 t r - Nanoseconds Fig. 14. Resistive Turn-on Rise Time vs. Drain Current I D = 230A 40 39 I D = 115A 38 TJ = 125ºC 40 39 38 37 37 36 36 TJ = 25ºC 35 35 25 35 45 55 65 75 85 95 105 115 110 125 120 130 140 150 TJ - Degrees Centigrade Fig. 15. Resistive Turn-on Switching Times vs. Gate Resistance tr 700 VDS = 50V 600 30 180 28 160 500 140 400 120 I D = 115A 300 100 200 80 100 60 0 4 5 6 7 8 9 tf I D = 115A 20 50 18 40 35 45 55 160 170 75 85 95 105 115 30 125 900 tf t f - Nanoseconds 420 td(off) - - - - 380 TJ = 125ºC, VGS = 10V VDS = 100V 340 I D = 130A 600 300 500 260 I D = 115A 400 220 300 180 200 140 100 100 50 180 190 200 I D - Amperes © 2014 IXYS CORPORATION, All Rights Reserved 210 220 40 230 0 60 3 4 5 6 7 RG - Ohms 8 9 10 t d(off) - Nanoseconds 80 12 150 65 Fig. 18. Resistive Turn-off Switching Times vs. Gate Resistance 700 TJ = 25ºC 140 70 60 800 60 130 80 22 VDS = 100V 20 120 100 I D = 230A 90 70 110 230 90 VDS = 100V 25 t d(off) - Nanoseconds t f - Nanoseconds td(off) - - - - 24 16 220 td(off) - - - - 16 100 RG = 1Ω, VGS = 10V TJ = 125ºC 210 TJ - Degrees Centigrade tf 28 200 24 10 Fig. 17. Resistive Turn-off Switching Times vs. Drain Current 32 190 RG = 1Ω, VGS = 10V RG - Ohms 36 180 Fig. 16. Resistive Turn-off Switching Times vs. Junction Temperature 26 40 3 170 t d(off) - Nanoseconds I D = 230A t d(on) - Nanoseconds t r - Nanoseconds td(on) - - - - TJ = 125ºC, VGS = 10V 200 t f - Nanoseconds 800 160 I D - Amperes IXFK230N20T IXFX230N20T Fig. 19. Maximum Transient Thermal Impedance Z (th)JC - ºC / W 0.1 0.01 0.001 0.00001 0.0001 0.001 0.01 0.1 1 10 Pulse Width - Seconds IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions. IXYS REF: F_230N20T (9E-N19) 4-17-14 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.