HiPerFETTM Power
MOSFETs
IXFK25N90 IXFX25N90
IXFK26N90 IXFX26N90
VDSS
ID25
RDS(on)
900V
25A
330mΩ
Ω
900V
26A
300mΩ
Ω
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
TO-264
Symbol
Test Conditions
Maximum Ratings
VDSS
VDGR
TJ = 25°C to 150°C
TJ = 25°C to 150°C, RGS = 1MΩ
900
900
V
V
VGSS
VGSM
Continuous
Transient
± 20
± 30
V
V
G
ID25
IDM
ID25
IDM
TC
TC
TC
TC
25N90
25N90
26N90
26N90
25
100
26
104
A
A
A
A
PLUS247
IA
TC = 25°C
25N90
25
A
26N90
EAS
TC = 25°C
26
3
A
J
dV/dt
IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 150°C
5
V/ns
PD
TC = 25°C
560
W
-55 ... +150
150
-55 ... +150
°C
°C
°C
300
260
°C
°C
1.13/10
Nm/lb.in.
z
20..120 /4.5..27
N/lb.
z
10
6
g
g
z
= 25°C
= 25°C, pulse width limited by TJM
= 25°C
= 25°C, pulse width limited by TJM
TJ
TJM
Tstg
TL
TSOLD
1.6mm (0.062 in.) from case for 10s
Plastic body for 10s
Md
Mounting torque (IXFK)
FC
Mounting force
Weight
TO-264
TO-247
(IXFX)
D
(TAB)
S
(TAB)
G = Gate
S = Source
D = Drain
TAB = Drain
Features
z
z
International standard packages
Avalanche Rated
Low package inductance
Low RDS(ON) HDMOS Process
Fast intrinsic diode
Advantages
z
Symbol
Test Conditions
Characteristic Values
(TJ = 25°C unless otherwise specified)
Min. Typ. Max.
BVDSS
VGS = 0V, ID = 3mA
900
VGS(th)
VDS = VGS, ID = 8mA
3.0
IGSS
VGS = ± 20V, VDS = 0V
IDSS
VDS = 0.8 • VDSS
VGS = 0V
RDS(on)
VGS = 10V, ID = 0.5 • ID25, Note 1
© 2008 IXYS CORPORATION,All rights reserved
TJ = 125°C
25N90
26N90
z
z
Easy to mount
Space savings
High power density
V
Applications:
5.0
V
z
± 200
nA
z
100 μA
2 mA
z
330 mΩ
300 mΩ
z
z
z
Switched-mode and resonant-mode
power supplies
DC-DC Converters
Battery chargers
DC choppers
AC motor drives
Temperature & lighting controls
DS9855D(12/08)
IXFK25N90 IXFX25N90
IXFK26N90 IXFX26N90
Symbol
Test Conditions
(TJ = 25°C unless otherwise specified)
Characteristic Values
Min.
Typ.
Max.
gfs
18
VDS= 10V, ID = 0.5 • ID25, Note 1
28
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
Crss
TO-264 (IXFK) Outline
S
8.7
10.8
nF
800
1000
pF
300
375
pF
td(on)
Resistive Switching Times
60
ns
tr
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
35
ns
td(off)
RG = 1Ω (External)
130
ns
24
ns
260
nC
tf
Qg(on)
Qgs
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
70
nC
100
nC
RthJC
0.22
RthCS
°C/W
0.15
Source-Drain Diode
°C/W
Characteristic Values
TJ = 25°C unless otherwise specified)
Min.
Typ.
Max.
Symbol
Test Conditions
IS
ISM
IS
ISM
VGS = 0V
Repetitive, pulse width limited by TJM
VGS = 0V
Repetitive, pulse width limited by TJM
VSD
IF = IS, VGS = 0V, Note 1
trr
QRM
IRM
IF = IS, -di/dt = 100A/μs
VR = 100V, VGS = 0V
25N90
25N90
26N90
26N90
25
100
26
104
A
A
A
A
1.5
V
250
ns
μC
A
1.4
10
Dim.
A
A1
A2
b
b1
b2
c
D
E
e
J
K
L
L1
P
Q
Q1
R
R1
S
T
Millimeter
Min.
Max.
4.82
5.13
2.54
2.89
2.00
2.10
1.12
1.42
2.39
2.69
2.90
3.09
0.53
0.83
25.91 26.16
19.81 19.96
5.46 BSC
0.00
0.25
0.00
0.25
20.32 20.83
2.29
2.59
3.17
3.66
6.07
6.27
8.38
8.69
3.81
4.32
1.78
2.29
6.04
6.30
1.57
1.83
Inches
Min.
Max.
.190
.202
.100
.114
.079
.083
.044
.056
.094
.106
.114
.122
.021
.033
1.020
1.030
.780
.786
.215 BSC
.000
.010
.000
.010
.800
.820
.090
.102
.125
.144
.239
.247
.330
.342
.150
.170
.070
.090
.238
.248
.062
.072
PLUS 247TM (IXFX) Outline
Note 1: Pulse test, t ≤ 300μs; duty cycle, d ≤ 2%.
Terminals: 1 - Gate
2 - Drain (Collector)
3 - Source (Emitter)
Dim.
Millimeter
Min.
Max.
Inches
Min.
Max.
A
A1
A2
4.83
2.29
1.91
5.21
2.54
2.16
.190
.090
.075
.205
.100
.085
b
b1
b2
1.14
1.91
2.92
1.40
2.13
3.12
.045
.075
.115
.055
.084
.123
C
D
E
0.61
20.80
15.75
0.80
21.34
16.13
.024
.819
.620
.031
.840
.635
e
5.45 BSC
.215 BSC
L
L1
19.81
3.81
20.32
4.32
.780
.150
.800
.170
Q
R
5.59
4.32
6.20
4.83
.220
.170
0.244
.190
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXFK25N90 IXFX25N90
IXFK26N90 IXFX26N90
Figure 1. Output Characteristics at 25OC
Figure 2. Extended Output Characteristics at 125OC
50
20
T J = 25°C V GS = 9V
8V
6V
ID - Amperes
ID - Amperes
40
7V
15
V GS = 9V
8V
7V
T J = 25°C
5V
10
6V
30
20
5V
5
10
4V
4V
0
0
0
2
4
6
8
0
10
4
8
30
25
V GS = 9V
8V
7V
25
6V
5V
20
ID - Amperes
T J = 125°C
ID - Amperes
20
Figure 4. Admittance Curves
Figure 3. RDS(on) normalized to 0.5 ID25 value vs. ID
15
10
5
20
O
T J = 125 C
15
O
T J = 25 C
10
5
4V
0
0
0
5
10
15
20
2
25
3
4
V DS - Volts
2.4
5
6
7
V GS - Volts
6. R
0.5value
ID25 Value
6. Fig.
RDS(ON)
Normalized
to 0.5toID25
vs. Tvs.
DS(on) Normalized
J
Figure 5. RDS(on) normalized to 0.5 ID25 value vs. ID
Junction Temperature
2.4
2.4
V GS = 10V
2.2
2.2
2.0
RRDS(ON)
- Normalized
DS(on) - Normalized
2.2
RDS(ON) - Normalized
16
V CE - Volts
V DS - Volts
30
12
T J = 125°C
1.8
1.6
1.4
T J = 25°C
1.2
V
= 10V
VGSGS
= 10V
2.0
2.0
I D = 26A
I D = 26A
1.8
1.8
I D = 13A
1.6
1.6
1.4
1.4
ID = 13A
1.2
1.2
1.0
1.0
1.0
0.8
0.8
0.8
0
10
20
30
ID - Amperes
© 2008 IXYS CORPORATION,All rights reserved
40
50
25
25
50
50
75
100
125
75
100
125
Centigrade
T J -TDegrees
- Degrees C
J
150
150
IXFK25N90 IXFX25N90
IXFK26N90 IXFX26N90
Figure 8. Capacitance Curves
Figure 7. Gate Charge
20000
15
V DS = 500 V
I D = 13 A
I G = 10 mA
Capacitance - pF
VGS - Volts
12
Ciss
10000
9
6
f = 1MHz
Coss
1000
3
Crss
100
0
0
50
100
150
200
250
300
0
350
5
10
15
20
25
30
35
40
100
125
150
V DS - Volts
Gate Charge - nC
Figure 9. Forward Voltage Drop of the Intrinsic Diode
50
30
IXFN26N90
45
25
40
IXFN25N90
30
ID - Amperes
ID - Amperes
35
T J = 125 o C
25
20
T J = 25 o C
15
10
20
15
10
5
5
0
0.0
0.3
0.6
0.9
1.2
1.5
0
-50
-25
0
25
50
75
o
V SD - Volts
Case Temperatue - C
0.300
R(th)JC - K/W
0.100
0.010
0.001
10 -4
10 -3
10 -2
10 -1
10 0
10 1
Pulse Width - Seconds
Figure 11. Transient Thermal Resistance
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS REF: F_26N90(9X)12-09-08
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.