IXFK52N100X
IXFX52N100X
X-Class HiPerFETTM
Power MOSFET
N-Channel Enhancement Mode
Avalanche Rated
VDSS
ID25
=
=
RDS(on)
1000V
52A
125m
D
TO-264P
(IXFK)
G
S
G
D
Symbol
Test Conditions
Maximum Ratings
VDSS
VDGR
TJ = 25C to 150C
TJ = 25C to 150C, RGS = 1M
1000
1000
V
V
VGSS
VGSM
Continuous
Transient
30
40
V
V
ID25
IDM
TC = 25C
TC = 25C, Pulse Width Limited by TJM
52
100
A
A
IA
EAS
TC = 25C
TC = 25C
10
3
A
J
PD
TC = 25C
1250
W
dv/dt
IS IDM, VDD VDSS, TJ 150°C
50
V/ns
-55 ... +150
150
-55 ... +150
C
C
C
300
260
°C
°C
TJ
TJM
Tstg
TL
TSOLD
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
Md
Mounting Torque (TO-264P)
1.13/10
Nm/lb.in
FC
Mounting Force (PLUS247)
20..120 /4.5..27
N/lb
Weight
TO-264P
PLUS247
10
6
g
g
PLUS247
(IXFX)
G
VGS = 0V, ID = 1mA
1000
VGS(th)
VDS = VGS, ID = 4mA
3.5
IGSS
VGS = 30V, VDS = 0V
IDSS
VDS = VDSS, VGS = 0V
RDS(on)
VGS = 10V, ID = 0.5 • ID25, Note 1
TJ = 125C
©2019 IXYS CORPORATION, All Rights Reserved
D = Drain
Tab = Drain
International Standard Packages
Low QG
Avalanche Rated
Low Package Inductance
Advantages
BVDSS
Tab
S
Features
Characteristic Values
Min.
Typ.
Max.
D
G = Gate
S = Source
Symbol
Test Conditions
(TJ = 25C Unless Otherwise Specified)
Tab
S
High Power Density
Easy to Mount
Space Savings
Applications
V
6.0
V
100
nA
50 A
5 mA
Switch-Mode and Resonant-Mode
Power Supplies
DC-DC Converters
PFC Circuits
AC and DC Motor Drives
Robotics and Servo Controls
125 m
DS100907D(11/19)
IXFK52N100X
IXFX52N100X
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max
gfs
VDS = 20V, ID = 0.5 • ID25, Note 1
23
RGi
Gate Input Resistance
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
37
S
0.5
6725
pF
1620
pF
123
pF
220
1070
pF
pF
34
ns
Crss
Co(er)
Co(tr)
Effective Output Capacitance
VGS = 0V
Energy related
VDS = 0.8 • VDSS
Time related
td(on)
Resistive Switching Times
tr
td(off)
tf
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 1(External)
Qg(on)
Qgs
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
13
ns
107
ns
9
ns
245
nC
53
nC
125
nC
RthJC
0.10C/W
RthCS
0.15C/W
Source-Drain Diode
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
IS
VGS = 0V
ISM
VSD
trr
QRM
IRM
Characteristic Values
Min.
Typ.
Max.
52
A
Repetitive, Pulse Width Limited by TJM
208
A
IF = IS , VGS = 0V, Note 1
1.4
V
260
IF = 26A, -di/dt = 100A/s
2.7
VR = 100V, VGS = 0V
20.8
ns
μC
A
Note 1. Pulse test, t 300s, duty cycle, d 2%.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXFK52N100X
IXFX52N100X
o
o
Fig. 1. Output Characteristics @ TJ = 25 C
Fig. 2. Extended Output Characteristics @ TJ = 25 C
140
VGS = 10V
50
8V
40
100
7V
I D - Amperes
I D - Amperes
VGS = 10V
9V
120
30
20
8V
80
60
7V
40
6V
10
20
6V
5V
0
5V
0
0
1
2
3
4
5
6
7
8
9
0
5
10
15
20
VDS - Volts
35
40
45
50
Fig. 4. RDS(on) Normalized to ID = 26A Value vs.
Junction Temperature
o
3.8
VGS = 10V
8V
3.4
VGS = 10V
3.0
RDS(on) - Normalized
7V
40
I D - Amperes
30
VDS - Volts
Fig. 3. Output Characteristics @ TJ = 125 C
50
25
30
6V
20
2.6
2.2
I D = 52A
1.8
I D = 26A
1.4
1.0
10
5V
0.6
0
0.2
0
2
4
6
8
10
12
14
16
18
20
22
-50
-25
0
25
VDS - Volts
Fig. 5. RDS(on) Normalized to ID = 26A Value vs.
Drain Current
4.5
100
125
150
1.2
o
BVDSS / VGS(th) - Normalized
TJ = 125 C
3.5
RDS(on) - Normalized
75
Fig. 6. Normalized Breakdown & Threshold Voltages
vs. Junction Temperature
1.3
VGS = 10V
4.0
50
TJ - Degrees Centigrade
3.0
2.5
o
TJ = 25 C
2.0
1.5
BVDSS
1.1
1.0
0.9
0.8
VGS(th)
0.7
1.0
0.5
0.6
0
13
26
39
52
65
78
I D - Amperes
©2019 IXYS CORPORATION, All Rights Reserved
91
104
117
130
-60
-40
-20
0
20
40
60
80
TJ - Degrees Centigrade
100
120
140
160
IXFK52N100X
IXFX52N100X
Fig. 7. Maximum Drain Current vs. Case Temperature
Fig. 8. Input Admittance
60
45
40
VDS = 20V
50
35
- Amperes
I
I
30
25
o
TJ = 125 C
20
o
25 C
o
- 40 C
D
30
D
- Amperes
40
20
15
10
10
5
0
0
-50
-25
0
25
50
75
100
125
150
3.5
4.0
4.5
5.0
TC - Degrees Centigrade
5.5
6.0
6.5
7.0
7.5
VGS - Volts
Fig. 10. Forward Voltage Drop of Intrinsic Diode
Fig. 9. Transconductance
200
60
o
TJ = - 40 C
VDS = 20V
50
160
o
30
- Amperes
25 C
o
S
125 C
120
80
o
I
g f s - Siemens
40
TJ = 125 C
20
o
TJ = 25 C
40
10
0
0
0
5
10
15
20
25
30
35
40
0.2
45
0.4
0.6
0.8
1
Fig. 11. Gate Charge
1.4
1.6
Fig. 12. Capacitance
10
100,000
VDS = 500V
Capacitance - PicoFarads
I D = 26A
8
I G = 10mA
VGS - Volts
1.2
VSD - Volts
I D - Amperes
6
4
Ciss
10,000
1,000
Coss
100
10
2
Crss
f = 1 MHz
1
0
0
50
100
150
200
250
QG - NanoCoulombs
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
1
10
100
VDS - Volts
1000
IXFK52N100X
IXFX52N100X
Fig. 13. Output Capacitance Stored Energy
Fig. 14. Forward-Bias Safe Operating Area
100
120
RDS(on) Limit
25μs
100
10
80
I D - Amperes
EOSS - MicroJoules
100μs
60
1ms
40
1
o
TJ = 150 C
o
TC = 25 C
Single Pulse
20
01
0
100
200
300
400
500
600
Fig. 15.
700
800
10ms
DC
0.1
Maximum
Transient Thermal
Impedance
10
900
1000
VDS - Volts
100
100ms
1,000
VDS - Volts
Fig. 15. Maximum Transient Thermal Impedance
aaaaa
0.2
Z(th)JC - K / W
0.1
0.01
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
©2019 IXYS CORPORATION, All Rights Reserved
IXYS_F_52N100X (U8-DA01) 10-02-18-A
IXFK52N100X
IXFX52N100X
PLUS247 Outline
1 - Gate
2,4 - Drain
3 - Source
TO-264P Outline
1 - Gate
2,4 - Drain
3 - Source
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXFK52N100X
IXFX52N100X
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evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
©2019 IXYS CORPORATION, All Rights Reserved